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AFE8221IRFPQ1

Texas Instruments

AFE8221IRFPQ1 by Texas Instruments

AFE8221IRFPQ1 by Texas Instruments is a telecom interface IC with 64 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 1.8V, it features gull wing terminals and is surface mountable for various telecom circuit applications.

Median Price

$69.150

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,310 parts In-Stock

1+ parts

$64.001

100+ parts

$56.890

1k+ parts

$41.831

10k+ parts

-

1,310

$64.001

$56.890

$41.831

-

Rochester

USA . 8,570 parts In-Stock

1+ parts

-

100+ parts

$69.150

1k+ parts

$61.870

10k+ parts

$58.230

8,570

-

$69.150

$61.870

$58.230

DigiKey

USA . 8,570 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,570

-

-

-

-

Verical

USA . 4,850 parts In-Stock

1+ parts

-

100+ parts

$86.438

1k+ parts

$77.338

10k+ parts

$72.787

4,850

-

$86.438

$77.338

$72.787

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,114 parts In-Stock

1+ parts

$55.195

100+ parts

-

1k+ parts

-

10k+ parts

-

3,114

$55.195

-

-

-

Vyrian

USA . 325 parts In-Stock

1+ parts

$58.100

100+ parts

-

1k+ parts

-

10k+ parts

-

325

$58.100

-

-

-

DigiKey Marketplace

USA . 8,570 parts In-Stock

1+ parts

$60.420

100+ parts

-

1k+ parts

-

10k+ parts

-

8,570

$60.420

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

$12.888

100+ parts

-

1k+ parts

$13.369

10k+ parts

-

2,174

$12.888

-

$13.369

-

DigiPath Technology Company

USA . 1 parts In-Stock

1+ parts

$14.191

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$14.191

-

-

-

ChromeModa Solutions

Germany . 1,105 parts In-Stock

1+ parts

$14.481

100+ parts

$11.874

1k+ parts

-

10k+ parts

-

1,105

$14.481

$11.874

-

-

IDEA Electronic Components Group

UK . 37 parts In-Stock

1+ parts

$14.481

100+ parts

$13.757

1k+ parts

$13.033

10k+ parts

-

37

$14.481

$13.757

$13.033

-

Ampacity Inc.

Singapore . 5,567 parts In-Stock

1+ parts

$49.380

100+ parts

-

1k+ parts

-

10k+ parts

-

5,567

$49.380

-

-

-

Corphita

USA . 3,682 parts In-Stock

1+ parts

$52.290

100+ parts

-

1k+ parts

-

10k+ parts

-

3,682

$52.290

-

-

-

A-Z Elektronik GmbH

Germany . 1,667 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,667

-

-

-

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Kepictronics

USA . 965 parts In-Stock

1+ parts

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100+ parts

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965

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-

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Native Components

USA . 612 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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612

-

-

-

-

Northwest PG Solutions

USA . 316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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316

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-

-

-

Overview

Discover the AFE8221IRFPQ1 by Texas Instruments, a cutting-edge Telecom Interface IC that guarantees top-notch quality and reliability. With Texas Instruments' renowned reputation for innovation and excellence, this product is sure to exceed your expectations. Ideal for a wide range of applications in the telecom industry, this IC offers unmatched performance and efficiency. Experience the value and benefits this product brings to your projects with its advanced features and superior design. Trust Texas Instruments for all your interface IC needs and take your projects to the next level with the AFE8221IRFPQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protects the IC from external elements, making it long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and saves space on the PCB.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy alignment during assembly.

No. of Terminals: 64

64 terminals provide connectivity for various functions, making the IC versatile.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish offers excellent conductivity and corrosion resistance, ensuring reliable connections.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the IC to withstand harsh environmental conditions without performance degradation.

Terminal Form: GULL WING

Gull Wing terminal form provides increased mechanical strength and easy soldering, improving overall reliability.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage reduces power consumption, making the IC energy-efficient.

Technical Specifications

Other Function Telecom Interface ICs AFE8221IRFPQ1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Trade Compliance

AFE8221IRFPQ1 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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