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AFE8092HIABJ

Texas Instruments

AFE8092HIABJ by Texas Instruments

AFE8092HIABJ by Texas Instruments is a telecom interface IC with 400 terminals in a square grid array package. It operates b/w -40 to 85°C, has a data rate of 32500 Mbps, and features tin silver copper terminal finish. Ideal for high-speed telecom applications due to its fine pitch design and moisture sensitivity level of 3.

Median Price

$3,441.200

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,977 parts In-Stock

1+ parts

$2,490.000

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1,977

$2,490.000

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Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$4,392.400

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3

$4,392.400

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 295 parts In-Stock

1+ parts

$2,365.500

100+ parts

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295

$2,365.500

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Vyrian

USA . 6,181 parts In-Stock

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6,181

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,823 parts In-Stock

1+ parts

$7.110

100+ parts

-

1k+ parts

$7.630

10k+ parts

-

1,823

$7.110

-

$7.630

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DigiPath Technology Company

USA . 76 parts In-Stock

1+ parts

$7.829

100+ parts

-

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76

$7.829

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ChromeModa Solutions

Germany . 4,456 parts In-Stock

1+ parts

$7.989

100+ parts

$6.551

1k+ parts

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4,456

$7.989

$6.551

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IDEA Electronic Components Group

UK . 1,657 parts In-Stock

1+ parts

$7.989

100+ parts

-

1k+ parts

$7.190

10k+ parts

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1,657

$7.989

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$7.190

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Semicontronic

India . 696 parts In-Stock

1+ parts

$2,116.500

100+ parts

$2,063.588

1k+ parts

$2,053.005

10k+ parts

-

696

$2,116.500

$2,063.588

$2,053.005

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Ampacity Inc.

Singapore . 624 parts In-Stock

1+ parts

$2,116.500

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624

$2,116.500

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Corphita

USA . 1,701 parts In-Stock

1+ parts

$2,241.000

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1,701

$2,241.000

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Corohmni

South Africa . 437 parts In-Stock

1+ parts

$2,490.000

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437

$2,490.000

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Northwest PG Solutions

USA . 1,895 parts In-Stock

1+ parts

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1,895

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Component Stockers USA

USA . 1,420 parts In-Stock

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1,420

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Native Components

USA . 274 parts In-Stock

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274

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Overview

Experience unparalleled quality and reliability with the AFE8092HIABJ by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge telecom interface ICs that are essential for a wide range of applications. With a package style of grid array, fine pitch and a maximum operating temperature of 85°C, this product offers unmatched performance and durability. Elevate your projects with the AFE8092HIABJ and enjoy seamless communication, efficient data transfer, and superior functionality. Choose Texas Instruments for top-notch products that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards.

Package Shape: SQUARE

The square shape of the package ensures efficient use of space on the circuit board.

No. of Terminals: 400

Having 400 terminals allows for complex connectivity and functionality in the telecom interface.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability under various operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance.

Terminal Position: BOTTOM

The bottom terminal position allows for secure connections and efficient signal transmission.

Maximum Seated Height: 2.65 mm

The low maximum seated height helps in compact design of the product.

Width: 17 mm

The width of 17mm ensures compatibility with standard PCB sizes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and assembly processes.

Length: 17 mm

The length of 17mm ensures a compact form factor for the product.

Terminal Form: BALL

The ball terminal form allows for reliable and secure connections on the circuit board.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC ensures that the product is specifically designed for telecom interface applications.

Terminal Pitch: 0.8 mm

The small terminal pitch of 0.8mm allows for high density and compact layout of terminals.

Data Rate: 32500 Mbps

The high data rate capability of 32500 Mbps ensures high-speed data transmission in telecom applications.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that the product has a moderate level of sensitivity to moisture, suitable for typical usage environments.

Technical Specifications

Other Function Telecom Interface ICs AFE8092HIABJ attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Additional Features:

RF frequency(Min)(MHz) : 600; RF frequency(Max)(MHz) : 5500

Data Rate:

32500 Mbps

JESD-30 Code:

S-PBGA-B400

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

400

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA400,20X20,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17 mm

Trade Compliance

AFE8092HIABJ Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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