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WP3160W6NFEI-320B1

Microchip Technology

WP3160W6NFEI-320B1 by Microchip Technology

WP3160W6NFEI-320B1 by Microchip Technology is a GRID ARRAY IC with 672 terminals in PLASTIC/EPOXY package. It's a TELECOM CIRCUIT for telecom applications, designed for surface mount with BALL terminals at the bottom.

Median Price

$118.184

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

WP3160W6NFEI-320B1 by Microchip Technology
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$118.184

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700

$118.184

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Vyrian

USA . 3,289 parts In-Stock

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3,289

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Distributors (Availability)

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AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$6.045

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627

$6.045

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Continental Prestige Electronics

USA . 3,243 parts In-Stock

1+ parts

$118.184

100+ parts

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1k+ parts

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$115.820

3,243

$118.184

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$115.820

Netroflash

USA . 50 parts In-Stock

1+ parts

$118.184

100+ parts

-

1k+ parts

$112.274

10k+ parts

$109.911

50

$118.184

-

$112.274

$109.911

Semicontronic

India . 639 parts In-Stock

1+ parts

$123.810

100+ parts

$120.715

1k+ parts

$120.096

10k+ parts

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639

$123.810

$120.715

$120.096

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Ampacity Inc.

Singapore . 586 parts In-Stock

1+ parts

$123.810

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586

$123.810

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QUARKTWIN TECHNOLOGY LTD

USA . 9,359 parts In-Stock

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9,359

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West Coast Incorporated

USA . 5,061 parts In-Stock

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5,061

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Argo Parts USA

USA . 1,120 parts In-Stock

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Overview

Upgrade your telecom systems with the WP3160W6NFEI-320B1 by Microchip Technology. Known for its superior quality and reliability, this telecom interface IC offers unmatched performance in various applications. With a grid array package style and 672 terminals, this product is designed to meet the demands of modern telecommunications. Experience seamless connectivity and enhanced functionality with the WP3160W6NFEI-320B1, providing value and benefits that will elevate your communication network to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the overall weight of the product, making it more portable and easier to handle.

Surface Mount: YES

Surface mount technology allows for easy installation and removal of the IC, making it convenient for manufacturing and repairs.

Package Shape: SQUARE

The square shape of the package provides a compact design, saving valuable space on the circuit board and allowing for efficient use of available space.

No. of Terminals: 672

With a high number of terminals, this IC can support complex telecom interface functions, making it suitable for advanced communication systems.

Package Style (Meter): GRID ARRAY

The grid array package style offers improved electrical performance and thermal management, enhancing the overall reliability and functionality of the IC.

Terminal Position: BOTTOM

Having terminals located at the bottom of the IC simplifies the connection process and allows for better heat dissipation, resulting in improved performance.

Terminal Form: BALL

The use of ball terminals ensures reliable connectivity and minimizes the risk of signal interruption, making this IC suitable for high-speed data transmission.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC offers specialized features and functions that are essential for ensuring seamless communication and data transfer.

Technical Specifications

Other Function Telecom Interface ICs WP3160W6NFEI-320B1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

No. of Functions:

1

No. of Terminals:

672

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

WP3160W6NFEI-320B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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