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WP3161W6NFEI-320B1

Microchip Technology

WP3161W6NFEI-320B1 by Microchip Technology

WP3161W6NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.

Median Price

$140.470

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

WP3161W6NFEI-320B1 by Microchip Technology
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 40 parts In-Stock

1+ parts

$140.470

100+ parts

$106.420

1k+ parts

-

10k+ parts

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40

$140.470

$106.420

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 32 parts In-Stock

1+ parts

$113.975

100+ parts

-

1k+ parts

-

10k+ parts

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32

$113.975

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-

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Vyrian

USA . 5,859 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,859

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 382 parts In-Stock

1+ parts

$7.832

100+ parts

-

1k+ parts

-

10k+ parts

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382

$7.832

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Continental Prestige Electronics

USA . 6,874 parts In-Stock

1+ parts

$113.975

100+ parts

-

1k+ parts

-

10k+ parts

$111.696

6,874

$113.975

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-

$111.696

Ampacity Inc.

Singapore . 58 parts In-Stock

1+ parts

$119.400

100+ parts

-

1k+ parts

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58

$119.400

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Semicontronic

India . 58 parts In-Stock

1+ parts

$119.400

100+ parts

$116.415

1k+ parts

$115.818

10k+ parts

-

58

$119.400

$116.415

$115.818

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Argo Parts USA

USA . 4,952 parts In-Stock

1+ parts

-

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4,952

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Fulton Briggs Corp.

USA . 4,922 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,922

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-

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Kepictronics

USA . 361 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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361

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$111.696

1k+ parts

$108.277

10k+ parts

$105.997

100

-

$111.696

$108.277

$105.997

Overview

The WP3161W6NFEI-320B1 by Microchip Technology is a game-changer in the world of Other Function Telecom Interface ICs. With its high-quality manufacturing and cutting-edge technology, this product offers unmatched reliability and performance. From telecommunications to networking, this versatile IC is designed to meet the demands of various applications. Customers can expect seamless integration, enhanced functionality, and superior results with the WP3161W6NFEI-320B1. Upgrade your systems today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and thermal conductivity, making the IC resistant to heat and physical damage.

Surface Mount: YES

Surface mount capability allows for easy and quick assembly onto circuit boards, saving time and effort in production processes.

Package Shape: SQUARE

Square shape provides a compact and efficient design, saving space on the circuit board and creating a neat layout.

No. of Terminals: 672

Having a high number of terminals allows for more connections and functionalities, making the IC versatile and suitable for complex telecom applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers high density and excellent electrical performance, ensuring reliable connections and efficient signal transmission.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure soldering onto the circuit board, ensuring stable connections and preventing accidental disconnection.

Terminal Form: BALL

Ball terminals provide reliable and consistent contact points, reducing the risk of connectivity issues and ensuring smooth signal transmission.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this IC is optimized for telecommunication functions, making it a suitable and efficient choice for telecom interface requirements.

Technical Specifications

Other Function Telecom Interface ICs WP3161W6NFEI-320B1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

No. of Functions:

1

No. of Terminals:

672

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

WP3161W6NFEI-320B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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