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WP3161F5NFEI-320B1

Microchip Technology

WP3161F5NFEI-320B1 by Microchip Technology

WP3161F5NFEI-320B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its square package shape.

Median Price

$41.503

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

WP3161F5NFEI-320B1 by Microchip Technology
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 40 parts In-Stock

1+ parts

$41.503

100+ parts

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40

$41.503

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Vyrian

USA . 729 parts In-Stock

1+ parts

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729

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Speed Components Ltd

Israel . 46 parts In-Stock

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46

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Distributors (Availability)

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AZTECH Wire

Italy . 713 parts In-Stock

1+ parts

$17.615

100+ parts

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713

$17.615

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Continental Prestige Electronics

USA . 1,955 parts In-Stock

1+ parts

$41.503

100+ parts

-

1k+ parts

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10k+ parts

$40.673

1,955

$41.503

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$40.673

Ampacity Inc.

Singapore . 745 parts In-Stock

1+ parts

$46.000

100+ parts

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745

$46.000

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Semicontronic

India . 723 parts In-Stock

1+ parts

$177.000

100+ parts

$172.575

1k+ parts

$171.690

10k+ parts

-

723

$177.000

$172.575

$171.690

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Argo Parts USA

USA . 4,236 parts In-Stock

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4,236

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Fulton Briggs Corp.

USA . 1,798 parts In-Stock

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1,798

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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Kepictronics

USA . 120 parts In-Stock

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120

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$40.673

1k+ parts

$39.428

10k+ parts

$38.598

50

-

$40.673

$39.428

$38.598

Overview

Experience unparalleled quality and reliability with the WP3161F5NFEI-320B1 by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers cutting-edge solutions for various applications in the Other Function Telecom Interface ICs category. This innovative product offers exceptional value and benefits, providing customers with superior performance and efficiency. Trust in Microchip Technology to meet all your telecom circuit needs with the WP3161F5NFEI-320B1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the internal components of the IC, ensuring durability and reliability in various operating conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and facilitating automated assembly processes.

Package Shape: SQUARE

Square package shape helps in efficient space utilization on the PCB, enabling compact design and layout of the telecom interface IC.

No. of Terminals: 672

With a high number of terminals, this telecom interface IC can support complex communication functionalities and connections, making it suitable for advanced telecom applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers high density and reliable connections, enhancing signal integrity and overall performance of the telecom interface IC.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure soldering onto the PCB, ensuring stable connections and improving overall mechanical strength of the telecom interface IC.

Terminal Form: BALL

Ball terminal form facilitates better electrical connections and solder joints, reducing the risk of signal loss or interference in the telecom interface IC.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this telecom circuit IC offers advanced features and functionalities tailored to meet the requirements of modern communication systems.

Technical Specifications

Other Function Telecom Interface ICs WP3161F5NFEI-320B1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

No. of Functions:

1

No. of Terminals:

672

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

WP3161F5NFEI-320B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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