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WP3161D4NFEI-400B1

Microchip Technology

WP3161D4NFEI-400B1 by Microchip Technology

WP3161D4NFEI-400B1 by Microchip Technology is a telecom IC with 672 terminals in a grid array package. It features plastic/epoxy body material, surface mount capability, and ball-shaped bottom terminals. Ideal for telecom circuit applications due to its advanced interface functionalities.

Median Price

$85.475

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

WP3161D4NFEI-400B1 by Microchip Technology
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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$85.475

100+ parts

-

1k+ parts

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24

$85.475

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Vyrian

USA . 3,342 parts In-Stock

1+ parts

-

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3,342

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Component Sense

UK . 1,558 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,558

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 824 parts In-Stock

1+ parts

$8.713

100+ parts

-

1k+ parts

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10k+ parts

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824

$8.713

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-

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$83.766

100+ parts

-

1k+ parts

$80.415

10k+ parts

-

2,000

$83.766

-

$80.415

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Continental Prestige Electronics

USA . 5,267 parts In-Stock

1+ parts

$85.475

100+ parts

-

1k+ parts

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10k+ parts

$83.766

5,267

$85.475

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-

$83.766

Ampacity Inc.

Singapore . 25 parts In-Stock

1+ parts

$89.550

100+ parts

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1k+ parts

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25

$89.550

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Semicontronic

India . 25 parts In-Stock

1+ parts

$194.900

100+ parts

$190.028

1k+ parts

$189.053

10k+ parts

-

25

$194.900

$190.028

$189.053

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RGB Technical Solutions

Ukraine . 2,373 parts In-Stock

1+ parts

-

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2,373

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Argo Parts USA

USA . 1,956 parts In-Stock

1+ parts

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1,956

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Enhance your telecom systems with the WP3161D4NFEI-400B1 by Microchip Technology. Known for their top-notch quality and reliability, Microchip Technology delivers cutting-edge solutions for various applications in the telecom industry. This telecom interface IC offers unparalleled value, providing seamless connectivity and improved performance for your communication networks. Elevate your systems with the WP3161D4NFEI-400B1 and experience the benefits of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for high-frequency telecom applications.

Surface Mount: YES

With surface mount capability, this product can easily be integrated into compact telecom devices, saving space and reducing assembly time.

Package Shape: SQUARE

The square package shape provides a balanced design, allowing for efficient heat dissipation and uniform signal distribution in telecom systems.

No. of Terminals: 672

With a high number of terminals, this IC provides ample connectivity options for complex telecom circuit designs, ensuring optimal performance.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased pin density, enabling higher data transfer rates and enhanced signal integrity in telecom interfaces.

Terminal Position: BOTTOM

The bottom terminal position simplifies the PCB layout and routing process, facilitating quick and seamless integration of this IC into telecom devices.

Terminal Form: BALL

The ball terminal form provides reliable electrical connections and improved solder joint strength, ensuring long-term functionality in telecom applications.

Telecom IC Type: TELECOM CIRCUIT

As a specialized telecom circuit IC, this product is tailored for high-speed data transmission, low latency, and reliable communication in telecommunications infrastructure.

Technical Specifications

Other Function Telecom Interface ICs WP3161D4NFEI-400B1 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B672

No. of Functions:

1

No. of Terminals:

672

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

WP3161D4NFEI-400B1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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