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NL3HS644FCTAG

Onsemi

NL3HS644FCTAG by Onsemi

NL3HS644FCTAG by Onsemi is a 36-terminal, telecom interface IC with a nominal voltage of 3.3V. It features a grid array package style with very thin profile and fine pitch, suitable for telecom circuit applications. The package body material is plastic/epoxy, making it surface mountable with a terminal pitch of 0.4mm and max seated height of 0.54mm.

Median Price

$1.314

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 96,563 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

96,563

-

$1.240

$1.110

$1.050

Verical

USA . 96,563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.313

96,563

-

-

$1.387

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,914 parts In-Stock

1+ parts

$1.320

100+ parts

-

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-

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1,914

$1.320

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-

-

Vyrian

USA . 6,073 parts In-Stock

1+ parts

-

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6,073

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 361 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

-

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361

$1.251

-

-

-

Vigor

Singapore . 690 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

690

$1.330

-

-

-

Corohmni

South Africa . 145 parts In-Stock

1+ parts

$1.390

100+ parts

-

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145

$1.390

-

-

-

AZTECH Wire

Italy . 264 parts In-Stock

1+ parts

$19.950

100+ parts

-

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264

$19.950

-

-

-

TANS Electronics

Latvia . 7,588 parts In-Stock

1+ parts

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7,588

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Microchip USA

USA . 3,999 parts In-Stock

1+ parts

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3,999

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Problanco Electronics

Mexico . 3,966 parts In-Stock

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3,966

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Kulean Microsystems

USA . 2,363 parts In-Stock

1+ parts

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2,363

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Kepictronics

USA . 1,821 parts In-Stock

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1,821

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SupplyDigital Components

Austria . 1,291 parts In-Stock

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1,291

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Perfect Parts

USA . 890 parts In-Stock

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890

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GreenTree Electronics

Israel . 86 parts In-Stock

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86

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UHIMA Technologies

Türkiye . 26 parts In-Stock

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26

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Overview

Experience superior quality and reliability with the NL3HS644FCTAG by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch products that deliver exceptional performance. The NL3HS644FCTAG falls under the category of Other Function Telecom Interface ICs, making it versatile for various applications. Offering unmatched value and benefits, this product is perfect for customers seeking efficiency and convenience in their telecom circuits. Trust Onsemi for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the telecom interface IC, ensuring long-lasting performance.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Package Shape: SQUARE

The square shape provides a compact form factor, saving space on the PCB and enabling efficient use of board real estate.

No. of Terminals: 36

With 36 terminals, this telecom interface IC can accommodate a wide range of connections and communication interfaces, making it versatile and adaptable.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a high-density configuration with a thin profile, allowing for efficient and space-saving integration in telecom applications.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V, this telecom IC is compatible with standard power sources, making it easy to integrate into existing systems.

Technical Specifications

Other Function Telecom Interface ICs NL3HS644FCTAG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PBGA-B36

Length:

2.34 mm

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.54 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.34 mm

Trade Compliance

NL3HS644FCTAG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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