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NL3HS644BFCTAG

Onsemi

NL3HS644BFCTAG by Onsemi

NL3HS644BFCTAG by Onsemi is a 36-terminal GRID ARRAY IC with 0.4mm pitch, suitable for TELECOM CIRCUITS. Its PLASTIC/EPOXY body and 0.54mm height make it ideal for compact applications. Operating at 3.3V, this IC is designed for surface mount installation in telecom interfaces.

Median Price

$1.387

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,179,305 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.050

2,179,305

-

$1.240

$1.110

$1.050

DigiKey

USA . 2,179,305 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.640

10k+ parts

-

2,179,305

-

-

$1.640

-

Verical

USA . 1,849,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.313

1,849,079

-

-

$1.387

$1.313

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 832 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

-

10k+ parts

-

832

$1.320

-

-

-

Vyrian

USA . 189 parts In-Stock

1+ parts

$1.390

100+ parts

-

1k+ parts

-

10k+ parts

-

189

$1.390

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,120 parts In-Stock

1+ parts

$1.251

100+ parts

-

1k+ parts

-

10k+ parts

-

2,120

$1.251

-

-

-

Vigor

Singapore . 508 parts In-Stock

1+ parts

$1.330

100+ parts

-

1k+ parts

-

10k+ parts

-

508

$1.330

-

-

-

Corohmni

South Africa . 74 parts In-Stock

1+ parts

$1.390

100+ parts

-

1k+ parts

-

10k+ parts

-

74

$1.390

-

-

-

Component Stockers USA

USA . 2,633,036 parts In-Stock

1+ parts

$1.430

100+ parts

$1.350

1k+ parts

$1.220

10k+ parts

$1.220

2,633,036

$1.430

$1.350

$1.220

$1.220

Kulean Microsystems

USA . 4,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,489

-

-

-

-

Problanco Electronics

Mexico . 3,277 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,277

-

-

-

-

TANS Electronics

Latvia . 1,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,907

-

-

-

-

SupplyDigital Components

Austria . 1,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,500

-

-

-

-

UHIMA Technologies

Türkiye . 910 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

910

-

-

-

-

Microchip USA

USA . 491 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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491

-

-

-

-

Overview

Enhance your telecom interfaces with the NL3HS644BFCTAG by Onsemi. Known for their top-quality manufacturing, Onsemi delivers reliable products that meet industry standards. This telecom IC offers a wide range of applications in various industries, providing seamless communication solutions. With its advanced features and compact design, this product ensures optimal performance while maintaining a low profile. Trust Onsemi to deliver cutting-edge technology that brings value and efficiency to your projects. Upgrade your telecom systems today with the NL3HS644BFCTAG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good insulation and protection for the IC components, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly process.

Package Shape: SQUARE

Square package shape enables efficient use of space on the PCB layout, optimizing design flexibility.

No. of Terminals: 36

Having 36 terminals allows for a high level of connectivity and functionality in the telecom interface IC.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array style with a very thin profile and fine pitch design facilitates high-density mounting and improves signal integrity.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and connections, enhancing overall reliability and ease of use.

Maximum Seated Height: 0.54 mm

Low maximum seated height allows for compact and slim designs, beneficial for space-constrained applications.

Width: 2.34 mm

Narrow width dimension contributes to the overall small footprint of the IC, making it suitable for miniaturized devices.

Length: 2.34 mm

Short length measurement further contributes to the compact size of the IC, ideal for applications with limited space availability.

Terminal Form: BALL

Ball terminal form offers reliable electrical connections and ensures secure mounting on the PCB, enhancing performance and longevity.

Telecom IC Type: TELECOM CIRCUIT

Specialized for telecom circuits, this IC type is designed to meet the specific requirements of communication devices, ensuring optimal performance.

Nominal Supply Voltage: 3.3 V

Operates at a standard 3.3V supply voltage, compatible with common power sources and suitable for various applications.

Terminal Pitch: 0.4 mm

Fine terminal pitch of 0.4mm allows for high-density packaging of components, enabling more features in a compact form factor.

Technical Specifications

Other Function Telecom Interface ICs NL3HS644BFCTAG attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Onsemi

Specs

JESD-30 Code:

S-PBGA-B36

Length:

2.34 mm

No. of Functions:

1

No. of Terminals:

36

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.54 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.34 mm

Trade Compliance

NL3HS644BFCTAG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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