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VSC8491YJU-13

Microchip Technology

VSC8491YJU-13 by Microchip Technology

VSC8491YJU-13 by Microchip is a telecom IC with 196 terminals in a low profile grid array package. Operating from -40 to 110°C, it has a nominal voltage of 1V. Ideal for telecom applications, this IC features bottom terminal position and ball-shaped terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,300 parts In-Stock

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5,300

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Cyclops Electronics Ltd

UK . 53 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 286 parts In-Stock

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$8.530

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286

$8.530

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Ampacity Inc.

Singapore . 443 parts In-Stock

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$358.000

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443

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Continental Prestige Electronics

USA . 6,780 parts In-Stock

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Argo Parts USA

USA . 2,810 parts In-Stock

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Microchip USA

USA . 2,354 parts In-Stock

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Vigor

Singapore . 2,216 parts In-Stock

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RGB Technical Solutions

Ukraine . 1,679 parts In-Stock

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RC Electronics

USA . 1,229 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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Kepictronics

USA . 83 parts In-Stock

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Overview

Elevate your telecom systems with the VSC8491YJU-13 by Microchip Technology. This high-quality telecom circuit IC offers unparalleled performance and reliability, thanks to its cutting-edge design and advanced manufacturing techniques. With a wide range of applications in telecommunications, this product provides exceptional value by delivering seamless connectivity, enhanced efficiency, and unmatched durability. Upgrade your telecom infrastructure today with the VSC8491YJU-13 and experience the difference that only Microchip Technology can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and resistance to heat, making it suitable for industrial applications.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Package Shape: SQUARE

Square shape allows for easy placement and alignment on the PCB.

No. of Terminals: 196

High number of terminals for connecting various components and ensuring versatile functionality.

Package Style: GRID ARRAY, LOW PROFILE

Low profile design saves space and allows for compact devices.

Maximum Operating Temperature: 110 °C

High operating temperature range suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures functionality even in extreme cold conditions.

Terminal Position: BOTTOM

Bottom terminal position enables easy and secure soldering.

Terminal Form: BALL

Ball terminals provide reliable connections and easy soldering.

Nominal Supply Voltage: 1 V

Low supply voltage requirement for energy efficiency.

Technical Specifications

Other Function Telecom Interface ICs VSC8491YJU-13 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B196

Length:

15 mm

No. of Functions:

1

No. of Terminals:

196

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Maximum Seated Height:

1.4 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Trade Compliance

VSC8491YJU-13 Telecommunications trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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