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PM5440B-FEI

Microchip Technology

PM5440B-FEI by Microchip Technology

PM5440B-FEI by Microchip Technology is a grid array package with 1894 terminals. It is a telecom circuit IC designed for telecom interface applications. The package body material is plastic/epoxy, and it features surface mount technology with bottom terminal position in a square shape.

Median Price

$1,406.210

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 18 parts In-Stock

1+ parts

$1,406.210

100+ parts

$1,346.910

1k+ parts

-

10k+ parts

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18

$1,406.210

$1,346.910

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-

Verical

USA . 18 parts In-Stock

1+ parts

$1,406.210

100+ parts

$1,346.910

1k+ parts

-

10k+ parts

-

18

$1,406.210

$1,346.910

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-

Microchip Technology

USA . 2 parts In-Stock

1+ parts

$1,412.370

100+ parts

$1,070.080

1k+ parts

-

10k+ parts

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2

$1,412.370

$1,070.080

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,206 parts In-Stock

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3,206

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Chip Stock

USA . 306 parts In-Stock

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306

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Nova Conductors

Japan . 58 parts In-Stock

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58

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Flip Electronics

USA . 10 parts In-Stock

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10

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LIBRA Elektronik GmbH

Germany . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 361 parts In-Stock

1+ parts

$8.348

100+ parts

-

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361

$8.348

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AZTECH Wire

Italy . 1,154 parts In-Stock

1+ parts

$12.130

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-

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1,154

$12.130

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Ampacity Inc.

Singapore . 300 parts In-Stock

1+ parts

$997.430

100+ parts

-

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300

$997.430

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Microchip USA

USA . 2,477 parts In-Stock

1+ parts

$1,129.896

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2,477

$1,129.896

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QUARKTWIN TECHNOLOGY LTD

USA . 27,583 parts In-Stock

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27,583

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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West Coast Incorporated

USA . 1,684 parts In-Stock

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1,684

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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GreenTree Electronics

Israel . 500 parts In-Stock

1+ parts

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500

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RC Electronics

USA . 82 parts In-Stock

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82

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Overview

Enhance your telecom systems with the PM5440B-FEI by Microchip Technology. Known for their top-quality products, Microchip Technology delivers innovative solutions for various applications in the telecom industry. This telecom IC boasts a package style of grid array with 1894 terminals for seamless integration. Say goodbye to connectivity issues and hello to improved performance with the PM5440B-FEI. Upgrade your systems today and experience the benefits this product has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making this product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product on a PCB, saving time and reducing production costs.

Package Shape: SQUARE

Square package shape provides efficient use of PCB space and allows for easy orientation during assembly.

No. of Terminals: 1894

Large number of terminals allow for multiple connections, making this product suitable for complex telecom applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides better thermal performance and electrical stability, improving overall product reliability.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout design and ensures secure connections for stable performance.

Terminal Form: BALL

Ball terminal form offers enhanced electrical connectivity and allows for better heat dissipation, ensuring optimal performance.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, this product offers advanced functionality and compatibility with telecom systems.

Technical Specifications

Other Function Telecom Interface ICs PM5440B-FEI attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Microchip Technology

Specs

JESD-30 Code:

S-PBGA-B1894

No. of Functions:

1

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

PM5440B-FEI Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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