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BALL Other Function Telecom Interface ICs 143

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
STA8058 by STMicroelectronics

STA8058

STMicroelectronics

STA8058 by STMicroelectronics is a BICMOS technology IC with 104 terminals in a grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It has power supplies of 2.7V and 3.3V, making it ideal for telecom interfaces requiring precise control and connectivity.

R-PBGA-B104

104

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA104,8X13,32

RECTANGULAR

GRID ARRAY, FINE PITCH

2.7,3.3

Not Qualified

Other Telecom ICs

YES

BICMOS

INDUSTRIAL

BALL

.8 mm

BOTTOM

PN5120A0ET/C2J by NXP Semiconductors

PN5120A0ET/C2J

NXP Semiconductors

PN5120A0ET/C2J by NXP Semiconductors is a telecom interface IC with 64 terminals in a square package. Operating at -30 to 85°C, it requires 3/3.3V power supply and has a peak reflow temp of 260°C. Ideal for applications requiring fine pitch grid array style packages.

S-PBGA-B64

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,25

SQUARE

GRID ARRAY, FINE PITCH

260

3/3.3

Not Qualified

Other Telecom ICs

100 mA

YES

OTHER

BALL

.635 mm

BOTTOM

PN5120A0ET/C2EL by NXP Semiconductors

PN5120A0ET/C2EL

NXP Semiconductors

PN5120A0ET/C2EL by NXP Semiconductors is a versatile telecom interface IC designed for surface mount applications. It operates at 3/3.3V with a max current of 100mA and supports temperatures from -30 °C to 85 °C. Ideal for compact, high-performance electronic devices.

S-PBGA-B64

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,25

SQUARE

GRID ARRAY, FINE PITCH

260

3/3.3

Not Qualified

Other Telecom ICs

100 mA

YES

OTHER

BALL

.635 mm

BOTTOM

PN5120A0ET/C2QL by NXP Semiconductors

PN5120A0ET/C2QL

NXP Semiconductors

NXP Semiconductors' PN5120A0ET/C2QL is a telecom interface IC with 64 terminals, operating at temperatures from -30 to 85°C. It has a power supply of 3/3.3V and peak reflow temperature of 260°C. This square-shaped IC in plastic/epoxy package is ideal for applications requiring fine pitch grid array style components.

S-PBGA-B64

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

FBGA

BGA64,8X8,25

SQUARE

GRID ARRAY, FINE PITCH

260

3/3.3

Not Qualified

Other Telecom ICs

100 mA

YES

OTHER

BALL

.635 mm

BOTTOM

TPS657051YZHT by Texas Instruments

TPS657051YZHT

Texas Instruments

TPS657051YZHT by Texas Instruments is a 16-terminal IC with operating temp range -40 to 85°C. Telecom circuit type, it has nominal voltage of 3.6V and peak reflow temp of 260°C. Ideal for telecom interfaces due to its very thin profile and fine pitch grid array package style.

S-XBGA-B16

e1

2.3 mm

1

1

16

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

30

2.3 mm

TPS657052YZHT by Texas Instruments

TPS657052YZHT

Texas Instruments

TPS657052YZHT by Texas Instruments is a 16-terminal GRID ARRAY IC with operating temp range of -40 to 85°C. Telecom circuit type with nominal voltage of 3.6V, it's ideal for telecom interface applications due to its very thin profile and fine pitch package style.

S-XBGA-B16

e1

2.3 mm

1

1

16

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.5 mm

BOTTOM

NOT SPECIFIED

2.3 mm

BQ51011YFFR by Texas Instruments

BQ51011YFFR

Texas Instruments

BQ51011YFFR by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from 0 to 125°C. It features TIN SILVER COPPER finish, 0.4mm pitch, and 5V supply voltage. Ideal for TELECOM CIRCUITS due to its compact size and fine pitch design.

R-XBGA-B28

e1

2.76 mm

1

1

28

125 Cel

0 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

5 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.56 mm

BQ51013YFFT by Texas Instruments

BQ51013YFFT

Texas Instruments

BQ51013YFFT by Texas Instruments is a Telecom Interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with peak reflow temperature of 260°C. With a nominal voltage of 5V, it is ideal for telecom circuit applications.

R-XBGA-B28

e1

2.76 mm

1

1

28

125 Cel

0 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

5 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.56 mm

ADP5585ACBZ-01-R7 by Analog Devices

ADP5585ACBZ-01-R7

Analog Devices

ADP5585ACBZ-01-R7 by Analog Devices is a 16-terminal IC with a package style of grid array, thin profile, and fine pitch. It operates b/w -40 to 85°C, suitable for industrial telecom circuits at 1.8V nominal voltage. The package material is plastic/epoxy with surface mount capability.

S-PBGA-B16

e1

1.59 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.545 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.59 mm

ADP5589ACBZ-00-R7 by Analog Devices

ADP5589ACBZ-00-R7

Analog Devices

ADP5589ACBZ-00-R7 by Analog Devices is a 25-terminal GRID ARRAY IC with operating temp range -40 to 85°C. Telecom circuit type with nominal voltage of 1.8V, ideal for telecom interface applications. Package style: SQUARE, PLASTIC/EPOXY material, suitable for surface mount assembly.

S-PBGA-B25

e1

1.99 mm

1

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.56 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.99 mm

ADP5589ACBZ-01-R7 by Analog Devices

ADP5589ACBZ-01-R7

Analog Devices

ADP5589ACBZ-01-R7 by Analog Devices is a 25-terminal IC with package style GRID ARRAY, suitable for telecom circuits. It operates b/w -40 to 85°C, with a nominal voltage of 1.8V. The package material is PLASTIC/EPOXY, making it ideal for surface mount applications in industrial settings.

S-PBGA-B25

e1

1.99 mm

1

1

25

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.56 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.99 mm

BQ51013AYFPR by Texas Instruments

BQ51013AYFPR

Texas Instruments

BQ51013AYFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.

.002 Mbps

R-PBGA-B28

e1

3 mm

1

1

28

125 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

BQ51013AYFPT by Texas Instruments

BQ51013AYFPT

Texas Instruments

BQ51013AYFPT by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w 0-125°C, with a peak reflow temperature of 260°C. This IC has a data rate of 0.002 Mbps and is suitable for telecom circuit applications.

.002 Mbps

R-PBGA-B28

e1

3 mm

1

1

28

125 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

SN65DSI83ZQER by Texas Instruments

SN65DSI83ZQER

Texas Instruments

SN65DSI83ZQER by Texas Instruments is a telecom interface IC with 64 terminals in a grid array package. It operates b/w -40 to 85°C, has a data rate of 1 Mbps, and requires a nominal voltage of 1.8V. This IC is suitable for industrial applications requiring thin profile and fine pitch components.

1 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

SN65DSI85ZQER by Texas Instruments

SN65DSI85ZQER

Texas Instruments

SN65DSI85ZQER by Texas Instruments is a 64-terminal, industrial-grade telecom interface IC with a data rate of 1 Mbps. It operates b/w -40°C to 85°C and has a supply voltage of 1.8V. This square-shaped IC in grid array package is ideal for telecom circuit applications requiring fine pitch and low profile design.

1 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

BQ51013BYFPT by Texas Instruments

BQ51013BYFPT

Texas Instruments

BQ51013BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, suitable for AUTOMOTIVE applications. It operates b/w -40 to 125 °C and has a supply voltage of 5 V. With a data rate of 0.002 Mbps, it is ideal for TELECOM CIRCUITS requiring fine pitch and very thin profile packaging.

.002 Mbps

R-XBGA-B28

e1

3 mm

1

1

28

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

LMV1099TLX/NOPB by Texas Instruments

LMV1099TLX/NOPB

Texas Instruments

LMV1099TLX/NOPB by Texas Instruments is a telecom interface IC with 25 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 3.6V, it features very thin profile and fine pitch terminals ideal for telecom circuit applications.

S-XBGA-B25

e1

2.764 mm

1

1

25

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

2.64 mm

ADP5586ACBZ-01-R7 by Analog Devices

ADP5586ACBZ-01-R7

Analog Devices

ADP5586ACBZ-01-R7 by Analog Devices is a 16-terminal IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature range from -40 to 85°C and has a nominal voltage of 1.8V. This telecom circuit IC is designed for telecom interface applications.

S-PBGA-B16

e1

1.59 mm

1

1

16

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.545 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

1.59 mm

SX8651ICSTRT by Semtech

SX8651ICSTRT

Semtech

Semtech's SX8651ICSTRT is a 12-terminal IC with nickel palladium gold finish. It operates b/w -40 to 85°C, ideal for industrial telecom circuits at 1.8V supply voltage. The package style is grid array, very thin profile, fine pitch, suitable for surface mount applications.

R-PBGA-B12

e4

2 mm

1

1

12

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.625 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

NICKEL PALLADIUM GOLD

BALL

.5 mm

BOTTOM

1.5 mm

CC2564NSYFVR by Texas Instruments

CC2564NSYFVR

Texas Instruments

The Texas Instruments CC2564NSYFVR is a telecom IC with 54 terminals in a grid array package. It operates b/w -40°C to 85°C, with peak reflow temperature of 260°C. Suitable for industrial applications, it has a nominal voltage of 3.6V and features tin silver copper terminal finish.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564NYFVR by Texas Instruments

CC2564NYFVR

Texas Instruments

Texas Instruments CC2564NYFVR is a 54-terminal IC with industrial temperature grade. It operates at -40 to 85°C, with a peak reflow temp of 260°C. Ideal for telecom circuits, it has a nominal voltage of 3.6V and features surface mount packaging in plastic/epoxy material.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVR by Texas Instruments

CC2564YFVR

Texas Instruments

Texas Instruments CC2564YFVR is a telecom IC with 54 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. Ideal for industrial applications requiring reliable telecom circuit interfaces in a surface-mount grid array package.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

CC2564YFVT by Texas Instruments

CC2564YFVT

Texas Instruments

The Texas Instruments CC2564YFVT is a telecom IC with 54 terminals, operating from -40 to 85°C. It has a supply voltage of 3.6V and peak reflow temperature of 260°C. This rectangular grid array package is ideal for industrial telecom applications.

R-PBGA-B54

e1

1

1

54

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

RECTANGULAR

GRID ARRAY

260

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

BOTTOM

30

TCA5013ZAHR by Texas Instruments

TCA5013ZAHR

Texas Instruments

TCA5013ZAHR by Texas Instruments is a 48-terminal, telecom interface IC with a supply voltage of 3.3V. It operates in industrial temperature range (-40 to 85°C) and has a peak reflow temperature of 260°C. This square-shaped IC is designed for telecom circuits, featuring a thin profile package body suitable for surface mount applications.

S-PBGA-B48

e1

5 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.2 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

SN65DSI86ZQER by Texas Instruments

SN65DSI86ZQER

Texas Instruments

SN65DSI86ZQER by Texas Instruments is a 64-terminal, telecom interface IC with a data rate of 5400 Mbps. It operates b/w -40 to 85°C and has a supply voltage of 1.2V, making it suitable for industrial applications requiring high-speed data transmission in compact spaces. The package style is grid array with very thin profile and fine pitch, ideal for surface mount assembly processes.

5400 Mbps

S-PBGA-B64

e1

5 mm

3

1

64

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

1 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

TCC-106A-RT by Onsemi

TCC-106A-RT

Onsemi

TCC-106A-RT by Onsemi is a Telecom Circuit IC with 20 terminals in a very thin profile grid array package. Operating temperature ranges from -30 to 85 °C, suitable for telecom interface applications. It has a nominal voltage of 3.3V and terminal pitch of 0.4mm, making it ideal for compact electronic devices.

R-PBGA-B20

2.58 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.65 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

2.23 mm

TLK10022CTR by Texas Instruments

TLK10022CTR

Texas Instruments

TLK10022CTR by Texas Instruments is a 144-terminal, telecom interface IC with data rate of 10 Gbps. It operates b/w -40 to 85°C and has a supply voltage of 1V. Ideal for industrial applications requiring high-speed telecommunications circuitry in compact form factor.

10000 Mbps

S-PBGA-B144

e1

13.05 mm

4

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

3.25 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

13.05 mm

LM3290TME/NOPB by Texas Instruments

LM3290TME/NOPB

Texas Instruments

LM3290TME/NOPB by Texas Instruments is a 30-terminal GRID ARRAY IC with TIN SILVER COPPER finish. It operates b/w -30 to 85 °C, with peak reflow temp of 260C for telecom circuits. Its 0.4mm pitch and 0.675mm height make it suitable for compact telecom interface applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3290TMX/NOPB by Texas Instruments

LM3290TMX/NOPB

Texas Instruments

LM3290TMX/NOPB by Texas Instruments is a telecom IC with 30 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30 seconds. With a very thin profile and fine pitch, it's ideal for telecom circuit applications.

R-XBGA-B30

e1

1

1

30

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TME/NOPB by Texas Instruments

LM3291TME/NOPB

Texas Instruments

LM3291TME/NOPB by Texas Instruments is a 12-terminal IC with a rectangular package style. It operates b/w -30 to 85°C, with peak reflow temperature of 260°C for 30s. Ideal for telecom circuits due to its thin profile and fine pitch grid array package design.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

LM3291TMX/NOPB by Texas Instruments

LM3291TMX/NOPB

Texas Instruments

LM3291TMX/NOPB by Texas Instruments is a telecom interface IC with 12 terminals in a grid array package. It operates b/w -30°C to 85°C, with peak reflow temperature of 260°C for 30s. This very thin profile IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

R-XBGA-B12

e1

1

1

12

85 Cel

-30 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.675 mm

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

BQ51010BYFPT by Texas Instruments

BQ51010BYFPT

Texas Instruments

BQ51010BYFPT by Texas Instruments is a RECTANGULAR GRID ARRAY IC with 28 terminals, operating from -40 to 85 °C. It features TIN SILVER COPPER finish, 0.5 mm seated height, and 0.4 mm terminal pitch. Ideal for TELECOM CIRCUITS in INDUSTRIAL settings due to its fine pitch and thin profile package style.

R-XBGA-B28

e1

3 mm

1

1

28

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

1.88 mm

BQ51021YFPT by Texas Instruments

BQ51021YFPT

Texas Instruments

BQ51021YFPT by Texas Instruments is a Telecom Interface IC with 42 terminals in a grid array package. It operates b/w -40 to 125°C, suitable for automotive applications. With a very thin profile and fine pitch, it offers high reliability and performance in telecom circuits.

R-XBGA-B42

e1

3.556 mm

1

1

42

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

AUTOMOTIVE

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

2.844 mm

GC5328IZER by Texas Instruments

GC5328IZER

Texas Instruments

GC5328IZER by Texas Instruments is a 484-terminal grid array IC with a package size of 23x23mm. Operating b/w -40 to 85°C, it has a telecom circuit type and requires 1.2V supply voltage. Ideal for telecom interfaces, this IC is surface-mountable and features TIN SILVER COPPER terminal finish.

S-PBGA-B484

e1

23 mm

4

1

484

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY

260

Not Qualified

2.48 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

TLK3138ZDU by Texas Instruments

TLK3138ZDU

Texas Instruments

TLK3138ZDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, with 484 terminals and power supplies ranging from 1.2V to 2.5V. Ideal for telecom circuit applications due to its CMOS technology and commercial temperature grade suitability.

3125 Mbps

S-PBGA-B484

e1

23 mm

4

2

484

2

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

260

1.2,1.5,2.5

Not Qualified

2.42 mm

Network Interfaces

1.2 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

23 mm

STPAC01F2 by STMicroelectronics

STPAC01F2

STMicroelectronics

STPAC01F2 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It features an operating temp range of -30 °C to 85°C, a nominal voltage of 2.7V, and an ultra-thin profile with 8 terminals. Ideal for compact telecom devices, it ensures reliable performance in various environments.

S-PBGA-B8

1.57 mm

1

8

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Not Qualified

.715 mm

2.7 V

YES

TELECOM CIRCUIT

OTHER

BALL

.5 mm

BOTTOM

1.57 mm

TPS65720YFFT by Texas Instruments

TPS65720YFFT

Texas Instruments

TPS65720YFFT by Texas Instruments is a 25-terminal IC with a nominal voltage of 3.6V, suitable for telecom circuits. It features a very thin profile, fine pitch package style and operates in industrial temperature range (-40 to 85°C). Ideal for telecom interface applications.

S-XBGA-B25

e1

2.3 mm

1

1

25

85 Cel

-40 Cel

UNSPECIFIED

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

Not Qualified

.625 mm

3.6 V

YES

TELECOM CIRCUIT

INDUSTRIAL

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

NOT SPECIFIED

2.3 mm

DS31256B by Maxim Integrated

DS31256B

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;

S-PBGA-B256

e0

27 mm

1

256

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

2.54 mm

3.3 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

BALL

1.27 mm

BOTTOM

27 mm

TLK3138GDU by Texas Instruments

TLK3138GDU

Texas Instruments

TLK3138GDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, suitable for commercial temperature grade applications. The IC supports power supplies of 1.2V, 1.5V, and 2.5V in a square package shape with 484 terminals.

3125 Mbps

S-PBGA-B484

e0

4

2

484

2

70 Cel

0 Cel

PLASTIC/EPOXY

BGA

BGA484,22X22,40

SQUARE

GRID ARRAY

220

1.2,1.5,2.5

Not Qualified

Network Interfaces

1.2 V

YES

CMOS

TELECOM CIRCUIT

COMMERCIAL

TIN LEAD

BALL

1 mm

BOTTOM

20

AD9993BBCZ by Analog Devices

AD9993BBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

AD9364BBCZREEL by Analog Devices

AD9364BBCZREEL

Analog Devices

AD9364BBCZREEL by Analog Devices is a 144-terminal telecom IC with a supply voltage of 1.8V, operating b/w -40 to 85°C. It features a grid array package style and is suitable for telecom circuit applications requiring low profile and fine pitch components.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

AD9364BBCZ by Analog Devices

AD9364BBCZ

Analog Devices

AD9364BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.8V. Ideal for telecom circuits, it features a fine pitch and bottom terminal position for surface mount applications.

S-PBGA-B144

e1

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

10 mm

STHVDAC-253MF3 by STMicroelectronics

STHVDAC-253MF3

STMicroelectronics

STHVDAC-253MF3 by STMicroelectronics is a 16-terminal IC with plastic package, suitable for telecom circuits. It operates b/w -30 °C to 85°C, with a nominal voltage of 3.3V. The grid array package style has very thin profile and fine pitch, making it ideal for telecom interface applications.

R-PBGA-B16

1.7 mm

1

16

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.655 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.6 mm

TLK2711AJRZQE by Texas Instruments

TLK2711AJRZQE

Texas Instruments

TLK2711AJRZQE by Texas Instruments is a telecom interface IC with 80 terminals in a square grid array package. Operating at 2.5V, it has a temperature range of 0-70°C and terminal finish of Tin Silver Copper. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for commercial applications.

S-PBGA-B80

e1

5 mm

3

1

80

70 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

BGA80,9X9,20

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

2.5

Not Qualified

1 mm

Other Telecom ICs

2.5 V

YES

TELECOM CIRCUIT

COMMERCIAL

TIN SILVER COPPER

BALL

.5 mm

BOTTOM

30

5 mm

TLK3134ZEL by Texas Instruments

TLK3134ZEL

Texas Instruments

TLK3134ZEL by Texas Instruments is a telecom IC with data rate of 3750 Mbps, operating temperature range of -40 to 85°C, and supply voltage options of 1.2V. It features a grid array package style, CMOS technology, and is suitable for telecom circuit applications.

3750 Mbps

S-PBGA-B289

e1

19 mm

4

1

289

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

BGA289,17X17,40

SQUARE

GRID ARRAY

260

1.2,1.5,2.5

Not Qualified

2.48 mm

Other Telecom ICs

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

19 mm

STLC60845 by STMicroelectronics

STLC60845

STMicroelectronics

STLC60845 by STMicroelectronics is a CMOS telecom circuit IC designed for efficient communication. It features a 1.8 V nominal voltage, 292 terminals in a square grid array package, and supports surface mount technology. Ideal for advanced telecom applications, it ensures reliable performance in compact designs.

S-PBGA-B292

1

292

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

Not Qualified

1.8 V

YES

CMOS

TELECOM CIRCUIT

BALL

BOTTOM

DS1852B-000 by Maxim Integrated

DS1852B-000

Maxim Integrated

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 25; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B25

e0

5 mm

3

1

25

100 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

Not Qualified

1.5 mm

3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN LEAD

BALL

.8 mm

BOTTOM

5 mm

BQ51025YFPT by Texas Instruments

BQ51025YFPT

Texas Instruments

BQ51025YFPT by Texas Instruments is a telecom interface IC with 42 terminals in a grid array package. It operates b/w -40 to 125°C, making it suitable for automotive applications. With a very thin profile and fine pitch, this IC is ideal for telecom circuits requiring high reliability.

R-XBGA-B42

e1

3.556 mm

1

1

42

125 Cel

-40 Cel

UNSPECIFIED

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

YES

TELECOM CIRCUIT

AUTOMOTIVE

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

30

2.844 mm