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BQ51025YFPT

Texas Instruments

BQ51025YFPT by Texas Instruments

BQ51025YFPT by Texas Instruments is a telecom interface IC with 42 terminals in a grid array package. It operates b/w -40 to 125°C, making it suitable for automotive applications. With a very thin profile and fine pitch, this IC is ideal for telecom circuits requiring high reliability.

Median Price

$6.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

RS (Exports)

UK . 51 parts In-Stock

1+ parts

$3.510

100+ parts

$4.575

1k+ parts

$4.400

10k+ parts

-

51

$3.510

$4.575

$4.400

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Texas Instruments

USA . 123 parts In-Stock

1+ parts

$5.031

100+ parts

$4.101

1k+ parts

$2.734

10k+ parts

-

123

$5.031

$4.101

$2.734

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Farnell

UK . 250 parts In-Stock

1+ parts

$7.050

100+ parts

$4.790

1k+ parts

$3.440

10k+ parts

-

250

$7.050

$4.790

$3.440

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DigiKey

USA . 283 parts In-Stock

1+ parts

$8.910

100+ parts

$6.757

1k+ parts

-

10k+ parts

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283

$8.910

$6.757

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-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,036 parts In-Stock

1+ parts

$4.779

100+ parts

-

1k+ parts

-

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1,036

$4.779

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-

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Vyrian

USA . 3,055 parts In-Stock

1+ parts

-

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3,055

-

-

-

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NAC Semi

USA . 220 parts In-Stock

1+ parts

-

100+ parts

$4.250

1k+ parts

-

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220

-

$4.250

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 735 parts In-Stock

1+ parts

$4.528

100+ parts

-

1k+ parts

-

10k+ parts

-

735

$4.528

-

-

-

Parana Technologies

USA . 578 parts In-Stock

1+ parts

$9.883

100+ parts

$917.746

1k+ parts

$8.894

10k+ parts

-

578

$9.883

$917.746

$8.894

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DigiPath Technology Company

USA . 1,827 parts In-Stock

1+ parts

$10.882

100+ parts

-

1k+ parts

-

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1,827

$10.882

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-

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ChromeModa Solutions

Germany . 1,578 parts In-Stock

1+ parts

$11.104

100+ parts

$9.105

1k+ parts

-

10k+ parts

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1,578

$11.104

$9.105

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IDEA Electronic Components Group

UK . 574 parts In-Stock

1+ parts

$11.104

100+ parts

$10.549

1k+ parts

$9.994

10k+ parts

-

574

$11.104

$10.549

$9.994

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Microchip USA

USA . 399 parts In-Stock

1+ parts

$30.750

100+ parts

$30.660

1k+ parts

$30.660

10k+ parts

$30.560

399

$30.750

$30.660

$30.660

$30.560

Lixinc

USA . 6,711 parts In-Stock

1+ parts

-

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-

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6,711

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,000

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-

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Northwest PG Solutions

USA . 950 parts In-Stock

1+ parts

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950

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Native Components

USA . 420 parts In-Stock

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420

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Overview

Enhance your telecom interface systems with the high-quality BQ51025YFPT by Texas Instruments. This cutting-edge IC offers unmatched performance and reliability in a compact rectangular package, making it perfect for a wide range of applications. With its surface mount design and automotive-grade temperature grade, this versatile IC ensures seamless integration and long-lasting durability. Trust Texas Instruments to deliver top-tier telecom solutions that bring value, efficiency, and innovation to your projects. Elevate your designs with the BQ51025YFPT and experience the difference today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount package allows for easy and efficient PCB assembly, saving time and cost on production.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly and testing processes.

No. of Terminals: 42

With a higher number of terminals, this product can offer more functionality and connectivity options.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability even in demanding environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in both extreme cold and hot conditions.

Terminal Finish: TIN SILVER COPPER

Tin, silver, and copper terminal finish provides good conductivity and corrosion resistance for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position can allow for more efficient heat dissipation and better signal integrity.

Height: 0.5 mm

Low seated height saves space on the PCB and can enable more compact designs.

Width: 2.844 mm

Narrow width allows for high-density packaging and integration of multiple components on the PCB.

Peak Reflow Temperature: 260 °C

High peak reflow temperature ensures proper soldering and reliability during assembly process.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates that this product is suitable for automotive applications with strict temperature requirements.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density mounting and can support complex circuit designs.

Technical Specifications

Other Function Telecom Interface ICs BQ51025YFPT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XBGA-B42

JESD-609 Code:

e1

Length:

3.556 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

42

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.844 mm

Trade Compliance

BQ51025YFPT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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