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TPS657051YZHT

Texas Instruments

TPS657051YZHT by Texas Instruments

TPS657051YZHT by Texas Instruments is a 16-terminal IC with operating temp range -40 to 85°C. Telecom circuit type, it has nominal voltage of 3.6V and peak reflow temp of 260°C. Ideal for telecom interfaces due to its very thin profile and fine pitch grid array package style.

Median Price

$2.288

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 250 parts In-Stock

1+ parts

-

100+ parts

$1.830

1k+ parts

$1.640

10k+ parts

$1.540

250

-

$1.830

$1.640

$1.540

DigiKey

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.410

10k+ parts

-

250

-

-

$2.410

-

Verical

USA . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.288

10k+ parts

-

250

-

-

$2.288

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,756 parts In-Stock

1+ parts

$1.938

100+ parts

-

1k+ parts

-

10k+ parts

-

2,756

$1.938

-

-

-

Vyrian

USA . 8,620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,620

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 250 parts In-Stock

1+ parts

$1.730

100+ parts

$1.687

1k+ parts

$1.678

10k+ parts

-

250

$1.730

$1.687

$1.678

-

Corphita

USA . 646 parts In-Stock

1+ parts

$1.836

100+ parts

-

1k+ parts

-

10k+ parts

-

646

$1.836

-

-

-

Corohmni

South Africa . 302 parts In-Stock

1+ parts

$2.040

100+ parts

-

1k+ parts

-

10k+ parts

-

302

$2.040

-

-

-

Component Stockers USA

USA . 638 parts In-Stock

1+ parts

$2.070

100+ parts

$1.950

1k+ parts

-

10k+ parts

-

638

$2.070

$1.950

-

-

Ampacity Inc.

Singapore . 98 parts In-Stock

1+ parts

$3.770

100+ parts

-

1k+ parts

-

10k+ parts

-

98

$3.770

-

-

-

Parana Technologies

USA . 2,374 parts In-Stock

1+ parts

$14.084

100+ parts

$1,307.936

1k+ parts

$12.676

10k+ parts

-

2,374

$14.084

$1,307.936

$12.676

-

Microchip USA

USA . 2,378 parts In-Stock

1+ parts

$15.106

100+ parts

-

1k+ parts

-

10k+ parts

-

2,378

$15.106

-

-

-

DigiPath Technology Company

USA . 1,242 parts In-Stock

1+ parts

$15.508

100+ parts

$14.268

1k+ parts

-

10k+ parts

-

1,242

$15.508

$14.268

-

-

ChromeModa Solutions

Germany . 5,228 parts In-Stock

1+ parts

$15.825

100+ parts

$12.976

1k+ parts

-

10k+ parts

-

5,228

$15.825

$12.976

-

-

IDEA Electronic Components Group

UK . 1,493 parts In-Stock

1+ parts

$15.825

100+ parts

$15.034

1k+ parts

$14.242

10k+ parts

-

1,493

$15.825

$15.034

$14.242

-

Overview

Enhance your telecommunications projects with the TPS657051YZHT by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-quality telecom interface ICs like this one. From grid arrays to fine pitch terminals, this product offers reliability and performance. Whether you're working on networking equipment or communication systems, the TPS657051YZHT provides value and efficiency with its industrial-grade temperature range and low profile design. Elevate your projects with the benefits and advantages of this innovative telecom circuit solution.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on a circuit board, saving time and labor costs.

Package Shape: SQUARE

Square shape helps in optimizing space on the circuit board and ensures a compact design.

No. of Terminals: 16

Provides multiple connection points for enhanced functionality and versatility.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid Array design with a thin profile and fine pitch allows for high density mounting and better signal integrity.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where higher temperature resistance is required.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the product can operate in a variety of environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides reliable and durable terminal finish for long-term performance.

Terminal Position: BOTTOM

Bottom terminal position allows for easier soldering and connection to the circuit board.

Maximum Seated Height: 0.625 mm

Low profile design helps in reducing overall height of the assembly.

Width: 2.3 mm

Compact width allows for space-saving on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures the product can withstand reflow soldering process without degradation.

Peak Reflow Temperature °C: 260

Withstands high reflow temperature for reliable soldering and board attachment.

Length: 2.3 mm

Compact length ensures minimal footprint on the circuit board.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with stringent temperature requirements.

Terminal Form: BALL

Ball terminal form provides reliable electrical connection and facilitates soldering.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring optimal performance in related functions.

Nominal Supply Voltage: 3.6 V

Suitable operating voltage for telecom applications, ensuring compatibility with industry standards.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting and precise connections.

Technical Specifications

Other Function Telecom Interface ICs TPS657051YZHT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-XBGA-B16

JESD-609 Code:

e1

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.3 mm

Trade Compliance

TPS657051YZHT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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