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TPS657201YFFR

Texas Instruments

TPS657201YFFR by Texas Instruments

TPS657201YFFR by Texas Instruments is a 25-terminal GRID ARRAY IC with operating temp range -40 to 85°C. Telecom circuit type with nominal voltage of 3.6V, suitable for telecom interface applications due to its very thin profile and fine pitch package design.

Median Price

$1.387

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,060 parts In-Stock

1+ parts

$0.071

100+ parts

$0.067

1k+ parts

$0.064

10k+ parts

-

1,060

$0.071

$0.067

$0.064

-

Texas Instruments

USA . 9,535 parts In-Stock

1+ parts

$1.929

100+ parts

$1.593

1k+ parts

$0.861

10k+ parts

-

9,535

$1.929

$1.593

$0.861

-

Mouser Electronics

USA . 3,271 parts In-Stock

1+ parts

$2.300

100+ parts

$1.590

1k+ parts

$1.410

10k+ parts

$1.280

3,271

$2.300

$1.590

$1.410

$1.280

Rochester

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

63,000

-

$1.240

$1.110

$1.040

DigiKey

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.630

10k+ parts

-

63,000

-

-

$1.630

-

Verical

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.300

63,000

-

-

$1.387

$1.300

Chip1Stop

Japan . 1,060 parts In-Stock

1+ parts

-

100+ parts

$0.561

1k+ parts

$0.545

10k+ parts

-

1,060

-

$0.561

$0.545

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 936 parts In-Stock

1+ parts

$0.544

100+ parts

-

1k+ parts

-

10k+ parts

-

936

$0.544

-

-

-

Vyrian

USA . 4,044 parts In-Stock

1+ parts

$0.561

100+ parts

-

1k+ parts

-

10k+ parts

-

4,044

$0.561

-

-

-

DigiKey Marketplace

USA . 63,000 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

-

10k+ parts

-

63,000

-

$1.240

-

-

Chip Stock

USA . 8,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,975

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,086 parts In-Stock

1+ parts

$0.516

100+ parts

-

1k+ parts

-

10k+ parts

-

4,086

$0.516

-

-

-

Parana Technologies

USA . 2,318 parts In-Stock

1+ parts

$6.183

100+ parts

-

1k+ parts

$6.949

10k+ parts

-

2,318

$6.183

-

$6.949

-

DigiPath Technology Company

USA . 515 parts In-Stock

1+ parts

$6.808

100+ parts

$6.263

1k+ parts

-

10k+ parts

-

515

$6.808

$6.263

-

-

ChromeModa Solutions

Germany . 3,443 parts In-Stock

1+ parts

$6.947

100+ parts

$5.697

1k+ parts

-

10k+ parts

-

3,443

$6.947

$5.697

-

-

IDEA Electronic Components Group

UK . 635 parts In-Stock

1+ parts

$6.947

100+ parts

-

1k+ parts

$6.252

10k+ parts

-

635

$6.947

-

$6.252

-

Microchip USA

USA . 5,264 parts In-Stock

1+ parts

$7.782

100+ parts

-

1k+ parts

-

10k+ parts

-

5,264

$7.782

-

-

-

Kepictronics

USA . 24,993 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,993

-

-

-

-

iBuyXS LLC

. 11,421 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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11,421

-

-

-

-

ChipstoGo Electronic ltd

UK . 2,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,413

-

-

-

-

Formix International (Excess)

India . 982 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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982

-

-

-

-

Infinite Electronics LLP (Excess)

. 832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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832

-

-

-

-

Overview

Unlock the power of seamless connectivity with the TPS657201YFFR by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This telecom interface IC is perfect for a wide range of applications, providing unparalleled performance and efficiency. Say goodbye to connectivity issues and hello to a smoother user experience with the TPS657201YFFR. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly, saving time and cost during production.

No. of Terminals: 25

Having 25 terminals provides ample connectivity options for various telecom interfaces, making the product versatile and adaptable.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand demanding environmental conditions, ensuring reliability in a wide range of settings.

Width: 2.086 mm

The compact width allows for space-saving installation, making the product suitable for applications with limited space constraints.

Technical Specifications

Other Function Telecom Interface ICs TPS657201YFFR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.086 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.086 mm

Trade Compliance

TPS657201YFFR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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