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TPS657201YFFT

Texas Instruments

TPS657201YFFT by Texas Instruments

TPS657201YFFT by Texas Instruments is a 25-terminal GRID ARRAY IC with operating temp range of -40 to 85°C. Telecom circuit type with nominal voltage of 3.6V, suitable for telecom interface applications due to its very thin profile and fine pitch package design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,170 parts In-Stock

1+ parts

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7,170

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Digiode

USA . 2,308 parts In-Stock

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2,308

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 702 parts In-Stock

1+ parts

$10.474

100+ parts

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702

$10.474

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Parana Technologies

USA . 2,245 parts In-Stock

1+ parts

$13.431

100+ parts

$1,247.271

1k+ parts

$12.088

10k+ parts

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2,245

$13.431

$1,247.271

$12.088

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DigiPath Technology Company

USA . 428 parts In-Stock

1+ parts

$14.789

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428

$14.789

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ChromeModa Solutions

Germany . 6,660 parts In-Stock

1+ parts

$15.091

100+ parts

$12.375

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6,660

$15.091

$12.375

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IDEA Electronic Components Group

UK . 832 parts In-Stock

1+ parts

$15.091

100+ parts

$14.336

1k+ parts

$13.582

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832

$15.091

$14.336

$13.582

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One Stop Electronics

USA . 1,355 parts In-Stock

1+ parts

$994.000

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1,355

$994.000

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Infinite Electronics LLP (Excess)

. 990 parts In-Stock

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990

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Formix International (Excess)

India . 982 parts In-Stock

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982

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Corphita

USA . 607 parts In-Stock

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607

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Overview

Enhance your telecommunications systems with the TPS657201YFFT by Texas Instruments. Crafted with precision and reliability in mind, this telecom interface IC offers unparalleled performance and efficiency. Ideal for a wide range of applications, this product provides seamless connectivity and enhanced functionality. Invest in quality with Texas Instruments and experience the difference in your communication networks. Elevate your systems with the TPS657201YFFT and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various industrial applications.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving time and effort during production.

Package Shape: SQUARE

Square shape offers better utilization of space on the PCB, optimizing the overall design layout.

No. of Terminals: 25

Sufficient number of terminals for versatile connectivity options and functionality.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ensuring reliable performance in various environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides excellent conductivity and corrosion resistance for long-term usage.

Width: 2.086 mm

Compact width size for efficient use of PCB space and design flexibility.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements, suitable for rugged applications.

Nominal Supply Voltage: 3.6 V

Compatible with common power supply voltages, facilitating easy integration into existing systems.

Terminal Pitch: 0.4 mm

Fine pitch allows for denser packing of components on the PCB, enabling high functionality in a compact space.

Technical Specifications

Other Function Telecom Interface ICs TPS657201YFFT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

2.086 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.086 mm

Trade Compliance

TPS657201YFFT Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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