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STLC60845

STMicroelectronics

STLC60845 by STMicroelectronics

STLC60845 by STMicroelectronics is a CMOS telecom circuit IC designed for efficient communication. It features a 1.8 V nominal voltage, 292 terminals in a square grid array package, and supports surface mount technology. Ideal for advanced telecom applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,248 parts In-Stock

1+ parts

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4,248

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Digiode

USA . 3,884 parts In-Stock

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3,884

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Anansix

USA . 2,112 parts In-Stock

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2,112

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 637 parts In-Stock

1+ parts

$14.551

100+ parts

-

1k+ parts

$13.096

10k+ parts

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637

$14.551

-

$13.096

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AZTECH Wire

Italy . 936 parts In-Stock

1+ parts

$19.790

100+ parts

-

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936

$19.790

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MKK Technologies

India . 2,123 parts In-Stock

1+ parts

$27.362

100+ parts

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2,123

$27.362

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DigiPath Technology Company

USA . 2,123 parts In-Stock

1+ parts

$27.362

100+ parts

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2,123

$27.362

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Microchip USA

USA . 471 parts In-Stock

1+ parts

$147.576

100+ parts

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471

$147.576

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QUARKTWIN TECHNOLOGY LTD

USA . 17,406 parts In-Stock

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17,406

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Vigor

Singapore . 5,000 parts In-Stock

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5,000

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Parana Technologies

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$17.398

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750

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$17.398

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Corphita

USA . 129 parts In-Stock

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129

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Overview

Elevate your telecom solutions with the STLC60845 from STMicroelectronics, a trusted leader in innovative technology. This high-quality interface IC combines reliability and performance, making it ideal for various communication applications. Its compact design ensures seamless integration into modern systems, while its energy-efficient operation reduces costs. Experience enhanced connectivity and superior functionality that empowers your projects to thrive in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design, improving efficiency in space-constrained applications.

Package Shape: SQUARE

The square package shape enables efficient board layout and facilitates better heat distribution.

No. of Terminals: 292

A high number of terminals allows for extensive connectivity options, making it versatile for complex designs.

Package Style (Meter): GRID ARRAY

The grid array style optimizes performance and simplifies multi-layer PCB design, providing excellent electrical performance.

Terminal Position: BOTTOM

Bottom-terminal positions are beneficial for floor mounting, ensuring easier routing of signals in compact spaces.

Technology: CMOS

CMOS technology offers low power consumption and high-speed operation, ideal for energy-sensitive applications.

Terminal Form: BALL

Ball terminal form enhances soldering reliability and improves thermal management, ensuring stable performance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimized performance for communication systems.

Nominal Supply Voltage: 1.8 V

The low nominal supply voltage contributes to energy efficiency and makes the IC suitable for battery-operated devices.

Technical Specifications

Other Function Telecom Interface ICs STLC60845 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B292

No. of Functions:

1

No. of Terminals:

292

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Qualification:

Not Qualified

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Position:

BOTTOM

Trade Compliance

STLC60845 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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