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STLC2411

STMicroelectronics

STLC2411 by STMicroelectronics

STLC2411 by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates at 1.8V and 3.3V, features a thin profile grid array package with 132 terminals, and withstands temperatures from -40 °C to 85 °C. Ideal for reliable communication in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,529 parts In-Stock

1+ parts

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4,529

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Anansix

USA . 2,875 parts In-Stock

1+ parts

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2,875

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Digiode

USA . 810 parts In-Stock

1+ parts

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810

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PC Components Company LLC

USA . 164 parts In-Stock

1+ parts

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164

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Bristol Electronics

USA . 164 parts In-Stock

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164

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,584 parts In-Stock

1+ parts

$14.818

100+ parts

-

1k+ parts

$13.337

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1,584

$14.818

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$13.337

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MKK Technologies

India . 96 parts In-Stock

1+ parts

$27.865

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96

$27.865

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DigiPath Technology Company

USA . 96 parts In-Stock

1+ parts

$27.865

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96

$27.865

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Corphita

USA . 3,971 parts In-Stock

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3,971

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Parana Technologies

USA . 1,028 parts In-Stock

1+ parts

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100+ parts

$17.718

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1,028

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$17.718

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Overview

Elevate your telecom solutions with the STLC2411 from STMicroelectronics—a trusted leader in innovation. This versatile interface IC seamlessly integrates into various applications, ensuring top-notch performance and reliability even in extreme conditions. With its compact design and robust temperature range, it delivers exceptional value, empowering you to create cutting-edge products that stand out in the market. Choose STMicroelectronics for quality and excellence that drive success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and prevents environmental damage, making this product suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for easier assembly and a more compact design, optimizing the circuit layout in modern electronics.

Package Shape: SQUARE

The square package shape provides efficient space utilization on PCBs, contributing to a compact overall design.

Power Supplies (V): 1.8, 3.3

Dual voltage supply options (1.8V and 3.3V) enhance versatility, allowing it to be used in a wide range of applications.

No. of Terminals: 132

With 132 terminals, this IC offers a wide array of connectivity options, facilitating complex interfacing within telecommunication systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The thin profile and fine pitch design improve the performance of high-density applications while enabling advanced thermal management.

Maximum Operating Temperature: 85 °C

An operational temperature range extending to 85 °C ensures reliability in demanding environments typical of industrial applications.

Minimum Operating Temperature: -40 °C

Surviving temperatures as low as -40 °C allows this IC to function effectively in extreme conditions, making it suitable for outdoor or harsh applications.

Terminal Finish: TIN LEAD

Tin-lead finish provides excellent solderability and reliability, ensuring stable electrical connections for long-term use.

Terminal Position: BOTTOM

Bottom terminal positioning allows for effective thermal conduction and minimizes the footprint on the PCB.

Maximum Seated Height: 1.2 mm

The low seated height enables the design of thinner electronic devices, which is essential for portable and space-constrained applications.

Width: 8 mm

The compact width of 8 mm is ideal for integration into various electronic products without increasing overall size.

Length: 8 mm

An 8 mm length complements the width for a uniform design, ensuring consistency and easy alignment in assembly.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature applications guarantees robust performance under challenging conditions, promoting long-term reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it excellent for efficient telecommunication circuits.

Terminal Form: BALL

Ball form terminals facilitate a strong mechanical connection and excellent electrical performance, essential for reliable telecom operations.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, this product is optimized for communication applications, ensuring compatibility and performance excellence.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V makes the IC suitable for low-power applications, enhancing battery life in portable devices.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density layouts, crucial for modern electronics that require compact and efficient designs.

Technical Specifications

Other Function Telecom Interface ICs STLC2411 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B132

JESD-609 Code:

e0

Length:

8 mm

No. of Functions:

1

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

STLC2411 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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