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STLC5465

STMicroelectronics

STLC5465 by STMicroelectronics

STMicroelectronics STLC5465 is a telecom interface IC with 160 terminals, operating at 0-70 °C. It has a supply voltage of 5V and terminal pitch of 0.635mm. The package style is flatpack, suitable for surface mount applications in commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,570 parts In-Stock

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1,570

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Digiode

USA . 859 parts In-Stock

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859

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Corel Iberica Componentes, S.L.

Spain . 92 parts In-Stock

1+ parts

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92

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Vyrian

USA . 54 parts In-Stock

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54

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ComSIT Distribution GmbH

Germany . 18 parts In-Stock

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,748 parts In-Stock

1+ parts

$11.300

100+ parts

-

1k+ parts

$10.170

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1,748

$11.300

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$10.170

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MKK Technologies

India . 1,077 parts In-Stock

1+ parts

$21.250

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1,077

$21.250

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DigiPath Technology Company

USA . 1,077 parts In-Stock

1+ parts

$21.250

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1,077

$21.250

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Parana Technologies

USA . 1,913 parts In-Stock

1+ parts

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100+ parts

$13.511

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1,913

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$13.511

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Corphita

USA . 1,353 parts In-Stock

1+ parts

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1,353

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Assy Fe

Spain . 92 parts In-Stock

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92

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Overview

Upgrade your telecommunications systems with the STLC5465 by STMicroelectronics. Known for their high-quality manufacturing, this telecom interface IC offers unparalleled reliability and performance. Ideal for a wide range of applications, this product provides value and benefits that exceed customer expectations. With its advanced features and innovative design, the STLC5465 is the perfect solution for your communication needs. Choose STMicroelectronics for cutting-edge technology you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material helps in reducing the weight of the product and also provides good insulation properties for safe operation.

Surface Mount: YES

Surface mount technology allows for efficient and compact assembly of the product, saving space and improving overall reliability.

Package Shape: SQUARE

The square package shape ensures easy handling and placement of the IC in a circuit board, optimizing space utilization.

Power Supplies (V): 5

Operating at a standard 5V power supply voltage makes this product compatible with most common power sources, enhancing its versatility.

No. of Terminals: 160

Having a high number of terminals allows for a greater number of connections and functionalities, making the IC suitable for complex telecom interface applications.

Package Style (Meter): FLATPACK

The flatpack package style offers a low profile design, facilitating easier integration into electronic systems with space constraints.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC can withstand high temperature environments, ensuring reliable performance.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0 °C ensures the IC can function in a wide range of ambient conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and conductivity, making it easier to assemble and maintain the IC.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connection to the circuit board, reducing the chances of signal interference or disconnection.

Temperature Grade: COMMERCIAL

Being classified as commercial grade ensures that the IC meets industry standards for performance and reliability in typical operating environments.

Terminal Form: GULL WING

The gull wing terminal form offers mechanical stability and ease of soldering, enhancing the durability and longevity of the connections.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems straightforward.

Terminal Pitch: 0.635 mm

The tight terminal pitch of 0.635mm allows for high-density mounting of components on a circuit board, maximizing the functionality in a limited space.

Technical Specifications

Other Function Telecom Interface ICs STLC5465 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G160

JESD-609 Code:

e0

No. of Terminals:

160

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP160,1.2SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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