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STLC2150

STMicroelectronics

STLC2150 by STMicroelectronics

STLC2150 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates at 2.7-3.3V, features a compact 48-terminal quad package, and withstands temps from -20 °C to 70 °C. Ideal for commercial telecom systems, it ensures reliable performance in tight spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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R&J Components

USA . 8,524 parts In-Stock

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Digiode

USA . 4,964 parts In-Stock

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Vyrian

USA . 3,874 parts In-Stock

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3,874

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A&K Electronics

USA . 817 parts In-Stock

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Rotakorn

Sweden . 817 parts In-Stock

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Bristol Electronics

USA . 817 parts In-Stock

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817

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Cyclops Electronics Ltd

UK . 502 parts In-Stock

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502

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Anansix

USA . 432 parts In-Stock

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IDEA Electronic Components Group

UK . 1,198 parts In-Stock

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$8.122

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$7.310

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MKK Technologies

India . 940 parts In-Stock

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$15.272

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$15.272

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DigiPath Technology Company

USA . 940 parts In-Stock

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$15.272

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940

$15.272

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GreenTree Electronics

Israel . 7,740 parts In-Stock

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Kepictronics

USA . 7,392 parts In-Stock

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Corphita

USA . 3,080 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,234 parts In-Stock

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Authorized Procurement Solutions

USA . 1,345 parts In-Stock

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Parana Technologies

USA . 1,159 parts In-Stock

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$9.711

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Assy Fe

Spain . 1,000 parts In-Stock

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Overview

Unlock superior communication solutions with the STLC2150 from STMicroelectronics, a leader in innovative semiconductor technology. This highly efficient telecom interface IC is designed for seamless integration in various applications, ensuring reliability and enhanced performance. With its compact footprint and robust operating range, the STLC2150 is perfect for modern telecom systems, delivering exceptional value and performance that empowers your designs and drives success.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for compact designs, making it ideal for modern electronic devices with limited space.

Package Shape: SQUARE

The square package shape provides uniform distribution of thermal and electrical properties, enhancing reliability and performance.

Power Supplies: 2.7V, 3V/3.3V

Support for multiple voltage levels ensures compatibility with various systems and power supply configurations.

No. of Terminals: 48

With 48 terminals, this IC offers extensive connectivity options, suitable for complex telecom applications.

Package Style: CHIP CARRIER, VERY THIN PROFILE

A very thin profile chip carrier contributes to reduced overall device height, advantageous for miniaturized devices.

Maximum Operating Temperature: 70 °C

A high maximum temperature rating allows reliable operation in warmer environments, enhancing durability.

Minimum Operating Temperature: -20 °C

The ability to operate at low temperatures makes this IC suitable for a wide range of applications, including outdoor environments.

Terminal Position: QUAD

Quad terminal positioning facilitates easier layout design on PCBs, optimizing space and routing efficiency.

Maximum Seated Height: 1 mm

A low seated height promotes board space saving, essential for compact electronic designs.

Width: 7 mm

The 7 mm width makes it versatile for integration into various circuit designs and layouts.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature accommodates a wide range of soldering processes, improving manufacturability.

Length: 7 mm

With a 7 mm length, this IC maintains a balanced footprint, suitable for efficient circuit board layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grading indicates suitability for general-purpose applications, providing reliability in typical operating conditions.

Technology: CMOS

CMOS technology ensures low power consumption, making it energy-efficient and ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead terminals support environmentally friendly manufacturing processes and comply with modern environmental regulations.

Telecom IC Type: TELECOM CIRCUIT

This IC is specifically designed for telecom applications, ensuring optimized performance for communication systems.

Nominal Supply Voltage: 2.7 V

The nominal supply voltage of 2.7V allows for compatibility with low-power circuits, extending battery life.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density connections, maximizing the number of contacts in compact layouts.

Technical Specifications

Other Function Telecom Interface ICs STLC2150 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e3/e4

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7,3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.7 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

STLC2150 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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