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STLC2416

STMicroelectronics

STLC2416 by STMicroelectronics

STLC2416 by STMicroelectronics is a low-profile telecom interface IC designed for industrial applications. It operates at 1.8V and 3.3V, with a max temp of 85 °C and features a compact 10mm x 10mm grid array package. Ideal for reliable telecom circuit integration in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,358 parts In-Stock

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3,358

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Anansix

USA . 2,365 parts In-Stock

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2,365

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Digiode

USA . 969 parts In-Stock

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969

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ComSIT Distribution GmbH

Germany . 83 parts In-Stock

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83

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 289 parts In-Stock

1+ parts

$9.397

100+ parts

-

1k+ parts

$8.457

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289

$9.397

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$8.457

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MKK Technologies

India . 1,893 parts In-Stock

1+ parts

$17.670

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1,893

$17.670

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DigiPath Technology Company

USA . 1,893 parts In-Stock

1+ parts

$17.670

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1,893

$17.670

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Authorized Procurement Solutions

USA . 6,500 parts In-Stock

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6,500

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Corphita

USA . 3,223 parts In-Stock

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3,223

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Parana Technologies

USA . 1,582 parts In-Stock

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$11.235

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1,582

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$11.235

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Perfect Parts

USA . 560 parts In-Stock

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560

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Overview

Unlock unparalleled performance with the STLC2416 from STMicroelectronics, a leader in innovative technology. This state-of-the-art Telecom Interface IC boasts a compact design, ensuring seamless integration into your systems while delivering exceptional reliability even in extreme temperatures. Ideal for a range of applications, it enhances communication efficiency and minimizes power consumption. Elevate your projects with ST's proven quality and support, maximizing your investment for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliable performance, making this IC suitable for a variety of environments.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern PCBs, saving space and reducing assembly costs.

Package Shape: SQUARE

A square package shape facilitates efficient layout on PCBs, optimizing space utilization for better overall design.

Power Supplies (V): 1.8, 3.3

Dual power supply options (1.8V and 3.3V) provide flexibility in design, allowing compatibility with a wider range of application requirements.

No. of Terminals: 120

With 120 terminals, this IC offers extensive connectivity options for complex functions, enhancing its versatility in diverse applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array design allows for better thermal performance and minimizes the overall height of the mounted component.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability and stability under relatively high operational conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C ensures this IC performs well in extreme environmental conditions, ideal for outdoor and rugged applications.

Terminal Finish: TIN LEAD

Tin lead finishing offers good solderability and conductivity, enhancing the performance and longevity of the connections.

Terminal Position: BOTTOM

Bottom-mounted terminals help in achieving a compact layout, optimizing space while reducing signal path lengths for improved performance.

Maximum Seated Height: 1.4 mm

A low seated height of 1.4 mm contributes to a slim profile, which is beneficial for thin-device applications and space-constrained designs.

Width: 10 mm

An appropriate width of 10 mm makes it suitable for various PCB layouts without taking up excessive space.

Length: 10 mm

A length of 10 mm matches the width, maintaining a square footprint that is advantageous for uniformity in PCB design.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, the IC offers enhanced reliability and performance in harsh environments, making it ideal for industrial telecommunications.

Technology: CMOS

Utilizing CMOS technology allows for lower power consumption and higher speed operation, making it efficient for telecommunications.

Terminal Form: BALL

BGA (Ball Grid Array) configuration provides better thermal and electrical performance, making the IC more reliable under various operational conditions.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit, this IC is optimized for communication applications, ensuring suitability for telecom-specific tasks.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V is energy-efficient, reducing overall power consumption and prolonging device battery life.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for higher terminal density, facilitating more complex designs in compact layouts.

Technical Specifications

Other Function Telecom Interface ICs STLC2416 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B120

JESD-609 Code:

e0

Length:

10 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,18X18,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

STLC2416 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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