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STLC2500A

STMicroelectronics

STLC2500A by STMicroelectronics

STLC2500A by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a compact 84-terminal grid array package. It operates within -40 °C to 85 °C and utilizes CMOS technology with a nominal voltage of 2.75V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,774 parts In-Stock

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2,774

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Vyrian

USA . 1,083 parts In-Stock

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1,083

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Anansix

USA . 788 parts In-Stock

1+ parts

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788

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 745 parts In-Stock

1+ parts

$9.404

100+ parts

-

1k+ parts

$8.464

10k+ parts

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745

$9.404

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$8.464

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MKK Technologies

India . 785 parts In-Stock

1+ parts

$17.684

100+ parts

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785

$17.684

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DigiPath Technology Company

USA . 785 parts In-Stock

1+ parts

$17.684

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785

$17.684

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Corphita

USA . 4,027 parts In-Stock

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4,027

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Parana Technologies

USA . 390 parts In-Stock

1+ parts

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$11.244

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390

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$11.244

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Overview

Elevate your telecom solutions with the STLC2500A from STMicroelectronics, a leader in innovation and quality. Designed for industrial applications, this compact interface IC ensures reliability and outstanding performance in demanding environments. Its advanced technology delivers seamless connectivity, empowering your projects while minimizing energy consumption. Experience superior benefits and unmatched value that streamline operations and enhance productivity—your trusted partner in progress!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and reliability in various environments, making this IC suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact designs and higher density integration, enhancing the overall performance and space efficiency of the circuit.

Package Shape: SQUARE

The square package shape contributes to efficient use of PCB space, facilitating easier layout design and optimizing the overall footprint.

No. of Terminals: 84

Having 84 terminals enables versatile connectivity and extensive functionality, making it ideal for complex telecom applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array design with a thin profile and fine pitch enables superior electrical performance while allowing for a compact component arrangement.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can perform reliably in demanding environments, providing excellent thermal stability.

Minimum Operating Temperature: -40 °C

Its capability to operate in extreme cold temperatures ensures functionality in harsh environments, making it perfect for industrial and outdoor applications.

Terminal Position: BOTTOM

Bottom terminal positioning allows for better thermal management and electrical performance, enhancing the product's efficiency.

Maximum Seated Height: 1.2 mm

The low seated height contributes to a compact design, making it suitable for space-constrained applications.

Width: 6 mm

The 6 mm width enables efficient layout planning and integration into various telecommunications circuits without occupying excessive space.

Length: 6 mm

Similar to its width, the 6 mm length ensures a balanced and compact package, facilitating easy incorporation into existing designs.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperatures indicates reliability and ruggedness, ensuring that it functions well in challenging conditions.

Technology: CMOS

The CMOS technology utilized in this IC offers low power consumption and high integration density, making it ideal for modern telecom solutions.

Terminal Form: BALL

Ball terminal form provides reliable connections and excellent performance, particularly beneficial in high-density applications.

Telecom IC Type: TELECOM CIRCUIT

As a dedicated telecom circuit IC, it is specifically optimized for telecommunications, ensuring high performance and reliability in communications applications.

Nominal Supply Voltage: 2.75 V

The nominal supply voltage of 2.75 V supports low-power applications, reducing energy costs and improving overall efficiency.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density layouts, making this IC suitable for space-constrained designs while maintaining performance.

Technical Specifications

Other Function Telecom Interface ICs STLC2500A attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B84

Length:

6 mm

No. of Functions:

1

No. of Terminals:

84

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

6 mm

Trade Compliance

STLC2500A Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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