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STLC1511

STMicroelectronics

STLC1511 by STMicroelectronics

STLC1511 by STMicroelectronics is a BICMOS technology telecom IC with 64 terminals in a square package. Operating at temperatures from -40 to 80 °C, it has a nominal voltage of 5V and terminal pitch of 0.5mm. Ideal for telecom circuits, this IC is surface mountable and features nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,288 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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3,288

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-

-

Digiode

USA . 2,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,577

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-

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Anansix

USA . 291 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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291

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,084 parts In-Stock

1+ parts

$10.524

100+ parts

-

1k+ parts

$9.471

10k+ parts

-

1,084

$10.524

-

$9.471

-

MKK Technologies

India . 668 parts In-Stock

1+ parts

$19.789

100+ parts

-

1k+ parts

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10k+ parts

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668

$19.789

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DigiPath Technology Company

USA . 668 parts In-Stock

1+ parts

$19.789

100+ parts

-

1k+ parts

-

10k+ parts

-

668

$19.789

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Parana Technologies

USA . 2,163 parts In-Stock

1+ parts

-

100+ parts

$12.583

1k+ parts

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10k+ parts

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2,163

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$12.583

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Corphita

USA . 895 parts In-Stock

1+ parts

-

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895

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Overview

Elevate your telecommunication systems with the STLC1511 by STMicroelectronics. Known for their top-notch quality and reliability, STMicroelectronics delivers cutting-edge telecom interface ICs that are sure to exceed expectations. With a wide range of applications in the telecom industry, this product offers unparalleled value and benefits to customers looking to enhance their communication networks. Experience seamless connectivity and unmatched performance with the STLC1511.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and heat resistance, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology enables easy installation and saves space on the PCB, making the overall design more compact.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and helps in designing a neat and organized layout.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with various systems and power sources.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options and flexibility in integrating with other components.

Maximum Operating Temperature: 80 °C

High maximum operating temperature ensures the product can perform reliably even in demanding conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature makes the product suitable for use in cold environments without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold terminal finish offers excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

Quad terminal position simplifies the connection process and enhances the overall efficiency of installation.

Maximum Seated Height: 1.6 mm

Low maximum seated height allows for a slim and compact design, saving space in the overall system layout.

Width: 10 mm

With a width of 10mm, the product can fit into a variety of PCB designs without taking up too much space.

Length: 10 mm

Compact length of 10mm further contributes to the space-saving design and flexibility in PCB layout.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form makes soldering easier and ensures secure connections, enhancing the overall reliability of the product.

Telecom IC Type: TELECOM CIRCUIT

Being a telecom circuit IC type, the product is specifically designed for telecom applications, ensuring reliable and efficient communication functionality.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the product compatible with standard power sources and systems, offering ease of integration.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm allows for high-density mounting and precise connections, making the product suitable for compact designs.

Technical Specifications

Other Function Telecom Interface ICs STLC1511 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC1511 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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