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STLC2410B

STMicroelectronics

STLC2410B by STMicroelectronics

STLC2410B by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 132-terminal grid array with a nominal voltage of 1.8V and supports surface mount technology. This CMOS device ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,617 parts In-Stock

1+ parts

-

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1k+ parts

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2,617

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-

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Vyrian

USA . 1,062 parts In-Stock

1+ parts

-

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-

1k+ parts

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1,062

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Anansix

USA . 972 parts In-Stock

1+ parts

-

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972

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,694 parts In-Stock

1+ parts

$9.497

100+ parts

-

1k+ parts

$8.547

10k+ parts

-

1,694

$9.497

-

$8.547

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MKK Technologies

India . 2,025 parts In-Stock

1+ parts

$17.859

100+ parts

-

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2,025

$17.859

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DigiPath Technology Company

USA . 2,025 parts In-Stock

1+ parts

$17.859

100+ parts

-

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10k+ parts

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2,025

$17.859

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Kepictronics

USA . 4,350 parts In-Stock

1+ parts

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4,350

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Parana Technologies

USA . 2,292 parts In-Stock

1+ parts

-

100+ parts

$11.355

1k+ parts

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2,292

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$11.355

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Corphita

USA . 1,189 parts In-Stock

1+ parts

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1,189

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Overview

Unlock the potential of your telecom applications with the STLC2410B from STMicroelectronics. Renowned for quality and innovation, STMicroelectronics delivers this advanced interface IC designed to enhance performance in diverse environments. With robust temperature tolerance and a compact design, it seamlessly fits into your projects, maximizing efficiency and reliability. Experience superior telecom solutions that empower your designs and elevate end-user satisfaction.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a durable and lightweight construction, suitable for various industrial applications.

Surface Mount: YES

Surface mount capability allows for a compact design and easier integration into modern PCB layouts.

Package Shape: SQUARE

A square package shape enhances layout flexibility and can lead to more efficient use of PCB space.

Power Supplies (V): 1.8, 3.3

Supports multiple power supply voltages, making it versatile for different applications and reducing design complexity.

No. of Terminals: 132

A higher number of terminals allows for more complex functionality and connectivity options.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Thin profile and fine pitch enable high-density mounting, which is essential for compact electronic devices.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC is reliable for use in applications that require thermal resilience.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures makes it suitable for harsh environments and outdoor applications.

Terminal Finish: TIN SILVER COPPER

The advanced terminal finish ensures excellent solderability and improves the reliability of connections.

Terminal Position: BOTTOM

Bottom terminal positioning helps in effective heat dissipation and enhances space efficiency on the PCB.

Maximum Seated Height: 1.2 mm

A low profile height allows for stacking and close placement of components, vital for space-constrained designs.

Width: 8 mm

A compact width aids in minimizing the footprint of the device on the PCB, promoting design efficiency.

Length: 8 mm

The equal length and width (8 mm) create a balanced design, which is beneficial for symmetrical PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures long-term stability and reliability in demanding applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher integration, making it suitable for advanced telecom applications.

Terminal Form: BALL

Ball terminals provide robust mechanical and electrical connectivity, enhancing the reliability of the IC.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, ensuring optimized performance in communication systems.

Nominal Supply Voltage: 1.8 V

A low nominal supply voltage supports energy-efficient designs, vital for portable and battery-operated devices.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density connections without compromising on reliability.

Technical Specifications

Other Function Telecom Interface ICs STLC2410B attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B132

JESD-609 Code:

e1

Length:

8 mm

No. of Functions:

1

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA132,14X14,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

8 mm

Trade Compliance

STLC2410B Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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