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STLC2415

STMicroelectronics

STLC2415 by STMicroelectronics

STLC2415 by STMicroelectronics is a low-profile telecom interface IC designed for industrial applications. It operates at nominal voltages of 1.8V and 3.3V, with a wide temp range from -40 °C to 85 °C. Its compact grid array package features 120 terminals for efficient connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

A&K Electronics

USA . 11,014 parts In-Stock

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11,014

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Bristol Electronics

USA . 11,014 parts In-Stock

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11,014

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Rotakorn

Sweden . 9,936 parts In-Stock

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9,936

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Digiode

USA . 4,594 parts In-Stock

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4,594

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Anansix

USA . 1,929 parts In-Stock

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1,929

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Vyrian

USA . 1,295 parts In-Stock

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1,295

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,780 parts In-Stock

1+ parts

$11.113

100+ parts

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$10.001

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1,780

$11.113

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$10.001

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MKK Technologies

India . 67 parts In-Stock

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$20.897

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67

$20.897

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DigiPath Technology Company

USA . 67 parts In-Stock

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$20.897

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67

$20.897

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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20,000

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Corphita

USA . 4,231 parts In-Stock

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4,231

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Parana Technologies

USA . 1,462 parts In-Stock

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$13.287

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1,462

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$13.287

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Overview

Elevate your telecom solutions with the STLC2415 from STMicroelectronics, a leader in innovative semiconductor technology. This high-performance interface IC is designed for reliability and efficiency, ensuring optimal connectivity for your applications. With its robust temperature range and low-profile design, the STLC2415 excels in demanding environments. Experience exceptional value and enhanced functionality, empowering your projects while streamlining integration effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers excellent durability and protects the components from environmental factors, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology ensures a compact design, saving space on circuit boards and allowing for higher density layouts.

Package Shape: SQUARE

The square package shape allows for efficient use of space on printed circuit boards and enhances thermal performance.

Power Supplies (V): 1.8, 3.3

Dual voltage support of 1.8 V and 3.3 V makes this IC versatile and compatible with a wide range of systems.

No. of Terminals: 120

With 120 terminals, this IC offers the capability to handle complex functions and interconnections, ideal for advanced telecom applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

The low-profile grid array design aids in efficient heat dissipation and makes it suitable for high-density applications.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliability in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this IC suitable for extreme temperature applications, ensuring consistent performance.

Terminal Position: BOTTOM

Bottom terminal positioning provides better connectivity and improves soldering quality during installation.

Maximum Seated Height: 1.4 mm

A low seated height of 1.4 mm helps minimize the overall profile of the device, making it ideal for compact designs.

Width: 10 mm

A consistent width of 10 mm ensures compatibility with various mounting systems and PCB layouts.

Length: 10 mm

The 10 mm length provides a balanced footprint, facilitating efficient board layout and placement.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliability for long-term operation in harsh environments, suitable for telecom applications.

Terminal Form: BALL

Ball terminals enhance soldering reliability and provide superior mechanical and thermal performance.

Telecom IC Type: TELECOM CIRCUIT

Being categorized as a telecom circuit IC positions it as an optimal choice for telecommunications applications and network devices.

Nominal Supply Voltage: 1.8 V

A nominal supply voltage of 1.8 V contributes to lower power consumption, making it energy-efficient for modern applications.

Terminal Pitch: 0.5 mm

The fine 0.5 mm terminal pitch allows for high-density interconnections, accommodating advanced functionalities within a compact size.

Technical Specifications

Other Function Telecom Interface ICs STLC2415 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B120

Length:

10 mm

No. of Functions:

1

No. of Terminals:

120

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA120,18X18,20

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

10 mm

Trade Compliance

STLC2415 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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