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STLC1502

STMicroelectronics

STLC1502 by STMicroelectronics

STLC1502 by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 208-terminal flatpack design, operates b/w 0 °C to 70°C, and runs on a nominal voltage of 2.5V. Ideal for surface mount technology in telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,766 parts In-Stock

1+ parts

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100+ parts

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1,766

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Anansix

USA . 1,546 parts In-Stock

1+ parts

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1,546

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Vyrian

USA . 1,005 parts In-Stock

1+ parts

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1,005

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 342 parts In-Stock

1+ parts

$10.906

100+ parts

-

1k+ parts

$9.815

10k+ parts

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342

$10.906

-

$9.815

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MKK Technologies

India . 68 parts In-Stock

1+ parts

$20.507

100+ parts

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68

$20.507

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DigiPath Technology Company

USA . 68 parts In-Stock

1+ parts

$20.507

100+ parts

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68

$20.507

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Parana Technologies

USA . 1,116 parts In-Stock

1+ parts

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100+ parts

$13.039

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1,116

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$13.039

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Corphita

USA . 495 parts In-Stock

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495

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Overview

Elevate your telecom projects with the STLC1502 from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality interface IC combines reliability and superior performance, ensuring seamless communication in diverse applications—from telecommunications to data transfer systems. With its robust design and compact packaging, the STLC1502 enhances efficiency, reduces costs, and offers long-term value, empowering customers to stay ahead in today’s competitive landscape.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental factors, ensuring reliable performance in various conditions.

Surface Mount: YES

Surface mount technology allows for high-density PCB design, making it suitable for space-constrained applications.

Package Shape: SQUARE

The square package shape facilitates easy integration into a wide range of circuit designs while ensuring optimal space utilization.

No. of Terminals: 208

A higher number of terminals enables more connectivity options, making the product versatile for complex telecom applications.

Package Style (Meter): FLATPACK, FINE PITCH

Flatpack, fine pitch design minimizes the footprint while maintaining a reliable electrical connection, essential for high-speed applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suitable for commercial environments without overheating issues.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C ensures functionality in various temperature environments, enhancing reliability for outdoor or unconditioned spaces.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish improves solderability and provides excellent corrosion resistance, ensuring a long-lasting connection.

Terminal Position: QUAD

Quad terminal positioning supports better electrical performance and helps in achieving lower inductance in high-frequency applications.

Maximum Seated Height: 4.1 mm

A low maximum seated height aids in compact design and enhances compatibility with other components on the PCB.

Width: 28 mm

A 28 mm width strikes a balance between space-saving and operational capabilities, fitting well in various telecom devices.

Length: 28 mm

Similar to width, the length of 28 mm helps maintain a compact form factor essential for efficient use in telecom applications.

Temperature Grade: COMMERCIAL

This commercial temperature grade ensures consistent performance in a wide range of everyday operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for power-sensitive telecom applications.

Terminal Form: GULL WING

Gull wing terminals simplify soldering processes and improve mechanical stability, enhancing reliability in various applications.

Telecom IC Type: TELECOM CIRCUIT

Being specifically designed as a telecom circuit IC makes this product well-suited for telecom infrastructure and service applications.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5 V optimizes power consumption, making it efficient for battery-operated devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density arrangements and modern PCB layouts, ideal for complex telecom functions.

Technical Specifications

Other Function Telecom Interface ICs STLC1502 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e4

Length:

28 mm

No. of Functions:

1

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

STLC1502 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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