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STLC1502D

STMicroelectronics

STLC1502D by STMicroelectronics

STLC1502D by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 208-terminal flatpack design, operates b/w 0 °C and 70 °C, and requires a nominal voltage of 2.5V. Ideal for surface mount technology in telecom systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,810 parts In-Stock

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4,810

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Vyrian

USA . 3,778 parts In-Stock

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3,778

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Anansix

USA . 1,602 parts In-Stock

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1,602

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Cyclops Electronics Ltd

UK . 1,590 parts In-Stock

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1,590

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 161 parts In-Stock

1+ parts

$10.348

100+ parts

-

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$9.313

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161

$10.348

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$9.313

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MKK Technologies

India . 935 parts In-Stock

1+ parts

$19.459

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935

$19.459

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DigiPath Technology Company

USA . 935 parts In-Stock

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$19.459

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935

$19.459

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A-Z Elektronik GmbH

Germany . 5,075 parts In-Stock

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5,075

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Kepictronics

USA . 1,590 parts In-Stock

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1,590

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Metaverse IC Inc.

Canada . 1,590 parts In-Stock

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1,590

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Corphita

USA . 1,307 parts In-Stock

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1,307

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Parana Technologies

USA . 1,221 parts In-Stock

1+ parts

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$12.373

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1,221

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$12.373

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Overview

Unlock unparalleled performance with the STLC1502D from STMicroelectronics, a leader in innovative semiconductor solutions. This cutting-edge telecom interface IC is designed for reliability and efficiency, making it ideal for a wide range of applications, from mobile communications to advanced networking systems. With its robust construction and superior thermal management, you can trust the STLC1502D to enhance your designs while reducing time-to-market. Elevate your projects with proven technology that delivers quality you can count on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Allows for a compact design and provides flexibility in circuit board layouts, enhancing overall efficiency.

Package Shape: SQUARE

The square shape optimizes space on printed circuit boards (PCBs), enabling better arrangement of components.

No. of Terminals: 208

A high number of terminals allows for greater connectivity options and complex functionalities without needing multiple chips.

Package Style (Meter): FLATPACK, FINE PITCH

This style minimizes the overall footprint and supports high-density applications, useful in modern telecom designs.

Maximum Operating Temperature: 70 °C

The ability to operate up to 70 °C increases design flexibility, allowing the product to function in various environments.

Minimum Operating Temperature: 0 °C

Ensures functionality in low temperature conditions, making it suitable for a wide range of applications.

Terminal Finish: TIN LEAD

Tin-lead finishes provide robust solderability and reliability, reducing the risk of connections failing.

Terminal Position: QUAD

Quad terminal positioning provides excellent layout versatility for circuit designs, optimizing performance in telecom applications.

Maximum Seated Height: 4.1 mm

Low seated height ensures efficient usage of vertical space on PCBs, beneficial for compact designs.

Width: 28 mm

Standard width facilitates compatibility with existing PCB designs and enhances ease of integration.

Length: 28 mm

Standard length ensures it fits well in conventional packaging, making it easier to design around.

Temperature Grade: COMMERCIAL

Designed for commercial-grade applications, ensuring reliability under typical conditions encountered in telecom environments.

Technology: HCMOS

High-speed CMOS technology enables efficient processing, lower power consumption, and high performance for telecom applications.

Terminal Form: GULL WING

Gull wing terminals provide effective soldering reliability and enhance the thermal performance of the component.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed for telecom applications, ensuring compatibility and optimized performance in communication systems.

Nominal Supply Voltage: 2.5 V

Low nominal supply voltage helps in reducing overall power consumption, contributing to energy-efficient designs.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables more compact designs and high-density component layouts, ideal for modern electronics.

Technical Specifications

Other Function Telecom Interface ICs STLC1502D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G208

JESD-609 Code:

e0

Length:

28 mm

No. of Functions:

1

No. of Terminals:

208

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

HCMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

28 mm

Trade Compliance

STLC1502D Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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