Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STLC1502D by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 208-terminal flatpack design, operates b/w 0 °C and 70 °C, and requires a nominal voltage of 2.5V. Ideal for surface mount technology in telecom systems.
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Anansix
Cyclops Electronics Ltd
IDEA Electronic Components Group
$10.348
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$19.459
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$12.373
This material provides durability and resistance to environmental factors, making the product reliable for long-term use.
Allows for a compact design and provides flexibility in circuit board layouts, enhancing overall efficiency.
The square shape optimizes space on printed circuit boards (PCBs), enabling better arrangement of components.
A high number of terminals allows for greater connectivity options and complex functionalities without needing multiple chips.
This style minimizes the overall footprint and supports high-density applications, useful in modern telecom designs.
The ability to operate up to 70 °C increases design flexibility, allowing the product to function in various environments.
Ensures functionality in low temperature conditions, making it suitable for a wide range of applications.
Tin-lead finishes provide robust solderability and reliability, reducing the risk of connections failing.
Quad terminal positioning provides excellent layout versatility for circuit designs, optimizing performance in telecom applications.
Low seated height ensures efficient usage of vertical space on PCBs, beneficial for compact designs.
Standard width facilitates compatibility with existing PCB designs and enhances ease of integration.
Standard length ensures it fits well in conventional packaging, making it easier to design around.
Designed for commercial-grade applications, ensuring reliability under typical conditions encountered in telecom environments.
High-speed CMOS technology enables efficient processing, lower power consumption, and high performance for telecom applications.
Gull wing terminals provide effective soldering reliability and enhance the thermal performance of the component.
Specifically designed for telecom applications, ensuring compatibility and optimized performance in communication systems.
Low nominal supply voltage helps in reducing overall power consumption, contributing to energy-efficient designs.
Fine terminal pitch enables more compact designs and high-density component layouts, ideal for modern electronics.
Other Function Telecom Interface ICs STLC1502D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Qualification:
Maximum Seated Height:
Nominal Supply Voltage:
Surface Mount:
Technology:
Telecom IC Type:
Temperature Grade:
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Width:
STLC1502D Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
2N2222A
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SS14
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3.5 ohm; Maximum Drain Current (ID): .2 A; Peak Reflow Temperature (C): NOT SPECIFIED;
LL4148
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
CRGCQ0805F10R
TE Connectivity
TE Connectivity's CRGCQ0805F10R is a 10 ohm fixed resistor with 1% tolerance and 400 ppm/°C temperature coefficient. It is a surface mount thick film resistor in an 0805 package, suitable for applications requiring precise resistance values in compact electronic circuits.
Zetex Plc
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM317LMX/NOPB
National Semiconductor
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 8; Package Code: SOP; Terminal Form: GULL WING; Maximum Seated Height: 1.75 mm; Nominal Dropout Voltage-1: 3 V;
Minilogic Device
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .001 A;
Panjit International
1554216002
Molex
WIRE AND CABLE;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
1N5819HW-7-F
Diodes Incorporated
1N5819HW-7-F by Diodes Inc. is a Schottky rectifier diode with 40V reverse test voltage, 1A output current, and 0.75V forward voltage. It's a surface mount device in a small outline package ideal for efficiency applications at temperatures ranging from -65 to 125°C.
Gec Plessey Semiconductors
LM2675M-ADJ/NOPB
Texas Instruments
LM2675M-ADJ/NOPB by Texas Instruments is a voltage-mode switching regulator with 1A output current, 37V max output voltage, and 260kHz max switching frequency. Ideal for automotive applications due to its -40°C to 125°C operating temperature range and compact small outline package design.
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Boca Semiconductor
4554
Jw Miller Magnetics
Other Semiconductors;
North American Philips Discrete Products Div
OHN3140U
Tt Electronics Plc
OHN3140U by Tt Electronics Plc is a magnetic field sensor with a max supply voltage of 24V and hysteresis of 2mT. It features an output range of 25mA and operates b/w -20 to 85°C. Ideal for applications requiring precise detection and measurement of magnetic fields in various industries.
MAX24287ETK+T
Microchip Technology
MAX24287ETK+T by Microchip Tech is a 68-terminal IC with 1.2V supply voltage, supporting SONET applications at 1000Mbps data rate. It operates in industrial temperature range (-40 to 85°C) and features a square chip carrier package style with 0.4mm terminal pitch.
CC2520RHDR
CC2520RHDR by Texas Instruments is a Telecom IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 125°C, suitable for automotive applications. With a data rate of 0.25 Mbps and terminal pitch of 0.5 mm, it's ideal for telecom circuits requiring a 3V supply voltage.
TDK5101FHTMA1
Infineon Technologies
Infineon's TDK5101FHTMA1 is a telecom IC with 10 terminals in a small outline, thin profile package. Operating b/w -40°C to 125°C, it has matte tin finish and dual terminal position suitable for automotive applications. With a nominal voltage of 3V, it is designed for telecom circuits requiring precise temperature control.
RS9116W-SB00-B00
Redpine Signals
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 126; Package Code: LGA; Package Shape: RECTANGULAR;
HMC624ALP4ETR
Analog Devices
Analog Devices' HMC624ALP4ETR is a 24-terminal CMOS telecom IC with a square chip carrier package. Operating from -40 to 85°C, it has a very thin profile and matte tin finish. Ideal for telecom circuits, this IC has a terminal pitch of 0.5mm and no lead terminal form.
MAX3799ETJ+T
Maxim Integrated
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
BQ51003YFPR
BQ51003YFPR by Texas Instruments is a telecom interface IC with 28 terminals in a grid array package. It operates b/w -40 to 85°C, with a battery supply of 5V. With a very thin profile and fine pitch, it's ideal for industrial telecom circuits requiring precise power management.
SJA1105TELY
NXP Semiconductors
The NXP SJA1105TELY is a telecom interface IC with 159 terminals in a grid array package. It operates b/w -40°C to 105°C, supporting data rates up to 100 Mbps. Designed for telecom circuits, it has a low profile and fine pitch, making it suitable for various applications.
BG96MATEA-128-SGN
Quectel Wireless Solutions
BG96MATEA-128-SGN by Quectel is a surface mount telecom IC with 102 terminals. It operates at temperatures ranging from -35 to 75 °C and has a data rate of 0.375 Mbps. This IC is commonly used in applications requiring reliable and high-speed communication.
SL3S1002FTB1,115
NXP Semiconductors SL3S1002FTB1,115 is a telecom interface IC in chip carrier package. Operating temp range -40 to 85°C with peak reflow temp of 260°C. Features CMOS technology, suitable for industrial telecom circuit applications.
DC-ME4-01T-S-UPW
Digi International
DC-ME4-01T-S-UPW by Digi Int. is a SERIAL DEVICE SERVER with 100 Mbps Data Rate, operating at -40 to 85°C. Its MICROELECTRONIC ASSEMBLY package measures 19.05mm x 36.7mm x 18.67mm, ideal for telecom interfaces in various applications.
ADF7012BRUZ-RL7
ADF7012BRUZ-RL7 by Analog Devices is a telecom IC with 24 terminals, operating at temperatures from -40 to 85°C. It has a supply voltage of 3V and uses CMOS technology. This surface-mount IC in a small outline package is ideal for telecom circuit applications.
PN5120A0HN1/C1,151
PN5120A0HN1/C1,151 by NXP Semiconductors is a telecom interface IC with 32 terminals and power supplies of 1.8/3.3V, suitable for telecom circuits. It operates b/w -30 to 85°C, has a terminal pitch of 0.5mm, and features a nickel palladium gold finish for robust connectivity in various applications.
ESP32-WROVER-B
Espressif Systems (shanghai)
ESP32-WROVER-B by Espressif Systems is a telecom IC with 38 terminals, operating at -40 to 85°C. It has a data rate of 150 Mbps and runs on a nominal voltage of 3.3V. Ideal for applications requiring high-speed wireless connectivity in compact devices.
BMD-300-A-R
Rigado
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 47; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
NEO-M8M-0
U-blox Ag
NEO-M8M-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. Its package style is MICROELECTRONIC ASSEMBLY, suitable for industrial applications. AEC-Q100 and TS 16949 screening levels ensure high quality in automotive and telecom sectors.
MAX2769CETI+T
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: Matte Tin (Sn) - annealed; JESD-609 Code: e3; Peak Reflow Temperature (C): 260;
CC2530F256RHAR
CC2530F256RHAR by Texas Instruments is a telecom IC with 40 terminals, operating from -40 to 125°C. It has a supply voltage of 3V, terminal pitch of 0.5mm, and MSL level of 3. Ideal for automotive applications due to its nickel palladium gold finish and no-lead terminal form.
ATWILC1000-MR110UB-T
Microchip Technology's ATWILC1000-MR110UB-T is a telecom IC with 28 terminals, operating at -40 to 85°C. It has a data rate of 72.2 Mbps and operates at 3.3V supply voltage. Ideal for applications requiring high-speed wireless communication in industrial settings.
ETRX357
Silicon Labs
ETRX357 by Silicon Labs is a telecom IC with 33 terminals, operating b/w -40 to 85°C. It has a supply voltage of 3V and terminal pitch of 1.27mm. This industrial-grade IC is used in telecom circuits for various applications due to its compact rectangular package style and no-lead terminal form.
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STLC5464
STMicroelectronics
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
STLC2500
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 84; Package Code: TFBGA; Package Shape: SQUARE;
STLC1512
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
STLC5460FN
Other Telecom ICs;
STLC2500ATR
STLC2415
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 120; Package Code: LFBGA; Package Shape: SQUARE;
STLC5465
Other Telecom ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
STLC2500A
STLC2150
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
STLC5460
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
STLC2690WTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 61; Package Code: VFBGA; Package Shape: RECTANGULAR;
STLC2411
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;
STLC5460P
STLC1511
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
STLC2416
STLC1502
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
STLC1502P
STLC2410B
STLC5432Q
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
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