Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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STLC1502D by STMicroelectronics is a telecom interface IC designed for commercial applications. It features a 208-terminal flatpack design, operates b/w 0 °C and 70 °C, and requires a nominal voltage of 2.5V. Ideal for surface mount technology in telecom systems.
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This material provides durability and resistance to environmental factors, making the product reliable for long-term use.
Allows for a compact design and provides flexibility in circuit board layouts, enhancing overall efficiency.
The square shape optimizes space on printed circuit boards (PCBs), enabling better arrangement of components.
A high number of terminals allows for greater connectivity options and complex functionalities without needing multiple chips.
This style minimizes the overall footprint and supports high-density applications, useful in modern telecom designs.
The ability to operate up to 70 °C increases design flexibility, allowing the product to function in various environments.
Ensures functionality in low temperature conditions, making it suitable for a wide range of applications.
Tin-lead finishes provide robust solderability and reliability, reducing the risk of connections failing.
Quad terminal positioning provides excellent layout versatility for circuit designs, optimizing performance in telecom applications.
Low seated height ensures efficient usage of vertical space on PCBs, beneficial for compact designs.
Standard width facilitates compatibility with existing PCB designs and enhances ease of integration.
Standard length ensures it fits well in conventional packaging, making it easier to design around.
Designed for commercial-grade applications, ensuring reliability under typical conditions encountered in telecom environments.
High-speed CMOS technology enables efficient processing, lower power consumption, and high performance for telecom applications.
Gull wing terminals provide effective soldering reliability and enhance the thermal performance of the component.
Specifically designed for telecom applications, ensuring compatibility and optimized performance in communication systems.
Low nominal supply voltage helps in reducing overall power consumption, contributing to energy-efficient designs.
Fine terminal pitch enables more compact designs and high-density component layouts, ideal for modern electronics.
Other Function Telecom Interface ICs STLC1502D attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics
JESD-30 Code:
JESD-609 Code:
Length:
No. of Functions:
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Maximum Operating Temperature:
Minimum Operating Temperature:
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Package Code:
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Qualification:
Maximum Seated Height:
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Technology:
Telecom IC Type:
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STLC1502D Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.
President, CEO
Jean-Marc Chery
President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience
Lorenzo Grandi
President, Sales & Marketing
Jerome Roux
Castelletto
Fabrication
Fab Initiation
1968
Italy
Wafer Capacity
SGFAB AMK 6
2000
Singapore
29,000
AG200
Agrate Brianza
14,000
RST 8
France
Rousset
35,000
Crolles 1
1993
Crolles
30,000
Crolles 2-ext. mod 5
Crolles 2-ext. mod 2
2022
Crolles 2-ext. mod 3
2023
Crolles 2
2004
28,000
1985
SiC Fab
2006
Sweden
Norrköping
10,000
Fab 3
2005
Tours
2,000
Fab 1 & Fab 2
1978
55,000
Fab 2
1997
Catania
SGFAB-AMK 6E
2003
145,000
SGFAB-AMJ 9
1984
152,000
AG300 (R3)
1980
25,000
1987
34,000
AG300
2024
Crolles 2-ext. mod 1
2020
Fab 1 6-inch fab
2013
11,000
SiC 6-inch line
2021
2,500
200mm GaN
2018
SGFAB-AMK 8
2001
Crolles 2- JV Fab
SGFAB-AMK 6
2016
38,125
SGFAB-AMK 2E
2010
20,000
Silicon Carbide A.B.
SiC wafer/EPI Fab
SiC Device Fab
2025
LM358MX
Texas Instruments
LM358MX by Texas Instruments is a dual operational amplifier with a max input offset voltage of 9000 uV. It has a nominal voltage of 5V and a min voltage gain of 15000. This op amp is commonly used in applications requiring amplification and signal conditioning.
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Comchip Technology
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; Operating Mode: ENHANCEMENT MODE;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
ULN2803ADWG4
ULN2803ADWG4 by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates at temperatures ranging from -40 to 85°C and has a max supply voltage of 3V. Ideal for applications requiring sink current flow direction in a small outline package style.
Eic Semiconductor
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138
Calogic
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Drain Current (Abs) (ID): .2 A;
LM2931AZ-5.0G
Onsemi
LM2931AZ-5.0G by Onsemi is a fixed positive single output LDO regulator with a nominal output voltage of 5V and max output current of 0.1A. It has a max dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature-sensitive environments up to 125°C. The package style is cylindrical with wire terminals, ideal for rail packing methods in various electronic devices.
LM358N
Harris Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
M24308/2-1F
Air Electro
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; MIL Conformity: YES; Additional Features: STANDARD: MIL-DTL-24308;
2N2222A
Forward International Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .625 W; Maximum Collector Current (IC): .6 A;
BAV99
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
PIC18F4550T-I/PT
Microchip Technology
The Microchip Technology PIC18F4550T-I/PT microcontroller operates at a max clock frequency of 48 MHz with 8-bit architecture. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it suitable for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this device offers efficient performance in compact designs.
OPA2277UA/2K5
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
Sangdest Microelectronics (Nanjing)
LM7805CT/NOPB
National Semiconductor
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Max): 125 Cel; Maximum Output Voltage-1: 5.25 V;
ABS07-32.768KHZ-T
Abracon
Abracon ABS07-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 144% stability, and 70000 ohm series resistance. Ideal for applications requiring 0.032768 MHz frequency precision in a compact surface-mount design with gold over nickel finish.
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MGM240PB32VNA3
Silicon Labs
TELECOM CIRCUIT;
LTC5596IDC#TRMPBF
Linear Technology
TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 8; Package Code: HVSON; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
CC2640F128RSMR
CC2640F128RSMR by Texas Instruments is a telecom IC with 32 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom applications, it features nickel/palladium/gold/silver terminal finish and very thin profile design.
BLUENRG-234N
STMicroelectronics
BM70BLES1FC2-0002AA
BM70BLES1FC2-0002AA by Microchip Tech is a 33-terminal IC with temp range -20 to 70°C. It operates at 3V, data rate of 0.0086 Mbps, ideal for telecom applications due to its nickel/gold finish and no-lead terminal form.
ADTR1107ACCZ-R7
Analog Devices
ADTR1107ACCZ-R7 by Analog Devices is a 24-terminal telecom IC with a square package style. It operates b/w -40 to 85°C, suitable for industrial use. With a nominal voltage of 5V, it features a thin profile and fine pitch grid array package, making it ideal for telecom circuit applications.
DC-ME4-01T-S-UPW
Digi International
DC-ME4-01T-S-UPW by Digi Int. is a SERIAL DEVICE SERVER with 100 Mbps Data Rate, operating at -40 to 85°C. Its MICROELECTRONIC ASSEMBLY package measures 19.05mm x 36.7mm x 18.67mm, ideal for telecom interfaces in various applications.
NORA-B106-00B
U-blox Ag
CYW43439KUBGT
Infineon Technologies
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 1;
BG95M3LA-64-SGNS
Quectel Wireless Solutions
BG95M3LA-64-SGNS by Quectel Wireless Solutions is a telecom IC with 1.119 Mbps data rate, operating at -35 to 75 °C. It has 102 terminals, measures 19.9mm in width, and is suitable for commercial extended temperature grade applications.
ADRV9002BBCZ-RL
ADRV9002BBCZ-RL by Analog Devices is a telecom IC with 1 function. It has a package style of grid array, thin profile, and fine pitch. With an operating temperature range of -40 to 110 °C, it is suitable for industrial applications.
MGM240PA32VNA3R
RN4020-V/RMBEC133
RN4020-V/RMBEC133 by Microchip Tech is a telecom IC with 24 terminals, operating at -30 to 85°C. It has a data rate of 1 Mbps and operates at 3.3V supply voltage. Ideal for telecom applications due to its TS16949 screening level and compact rectangular package style.
SA606DK/01
NXP Semiconductors
SA606DK/01 by NXP Semiconductors is a telecom interface IC with 20 terminals in a small outline package. Operating temperature range from -40 to 85°C, peak reflow temp of 260°C. Ideal for telecom circuits requiring nominal voltage of 3V, featuring gull wing terminal form and shrink pitch package style.
LXMS33HCNG-134
Murata Manufacturing
Murata's LXMS33HCNG-134 is a telecom IC with small outline, very thin profile package. Operating temp range -40 to 85°C. Dual terminal position, no lead form for industrial applications in telecom interfaces.
SN65DSI83ZQER
SN65DSI83ZQER by Texas Instruments is a telecom interface IC with 64 terminals in a grid array package. It operates b/w -40 to 85°C, has a data rate of 1 Mbps, and requires a nominal voltage of 1.8V. This IC is suitable for industrial applications requiring thin profile and fine pitch components.
CLRC66302HN,151
CLRC66302HN,151 by NXP Semiconductors is a telecom interface IC with 1 function. It has a square package shape with 32 terminals and a max seated height of 1mm. This IC operates at temperatures ranging from -25 to 85 °C and is suitable for telecom circuit applications.
NINA-B112-03B
TELECOM CIRCUIT; Moisture Sensitivity Level (MSL): 4;
RCB-F9T-0
LBEE5HY1MW-230
Murata Manufacturing's LBEE5HY1MW-230 is a telecom IC with 72 terminals, operating at -30 to 85°C. With a compact size of 7.9mm x 7.3mm x 1.1mm, it has a supply voltage of 3.3V and peak reflow temp of 250°C. Ideal for telecom applications due to its no-lead terminal form and MSL level of 3.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
STLC5464
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
STLC2500
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 84; Package Code: TFBGA; Package Shape: SQUARE;
STLC1512
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
STLC5460FN
Other Telecom ICs;
STLC2500ATR
STLC2415
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 120; Package Code: LFBGA; Package Shape: SQUARE;
STLC5465
Other Telecom ICs; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 160; Package Code: QFP; Package Shape: SQUARE;
STLC2500A
STLC2150
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: VQCCN; Package Shape: SQUARE;
STLC5460
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
STLC2690WTR
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 61; Package Code: VFBGA; Package Shape: RECTANGULAR;
STLC2411
TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 132; Package Code: TFBGA; Package Shape: SQUARE;
STLC5460P
STLC1511
TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: LFQFP; Package Shape: SQUARE;
STLC2416
STLC1502
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
STLC1502P
STLC2410B
STLC5432Q
TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 44; Package Code: LQFP; Package Shape: SQUARE;
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