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ADP5589ACBZ-00-R7

Analog Devices

ADP5589ACBZ-00-R7 by Analog Devices

ADP5589ACBZ-00-R7 by Analog Devices is a 25-terminal GRID ARRAY IC with operating temp range -40 to 85°C. Telecom circuit type with nominal voltage of 1.8V, ideal for telecom interface applications. Package style: SQUARE, PLASTIC/EPOXY material, suitable for surface mount assembly.

Median Price

$1.757

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 3,000 parts In-Stock

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$1.757

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$1.757

Distributors (In-Stock)

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Digiode

USA . 698 parts In-Stock

1+ parts

$4.360

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698

$4.360

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Vyrian

USA . 6,901 parts In-Stock

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6,901

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Distributors (Availability)

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Vigor

Singapore . 2,220 parts In-Stock

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$1.420

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$1.420

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Semicontronic

India . 2,568 parts In-Stock

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$1.490

100+ parts

$1.453

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$1.445

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2,568

$1.490

$1.453

$1.445

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Northwest PG Solutions

USA . 1,522 parts In-Stock

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$2.469

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$2.469

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Corphita

USA . 316 parts In-Stock

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$4.131

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316

$4.131

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Parana Technologies

USA . 2,162 parts In-Stock

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$16.540

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$15.382

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$16.540

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AZTECH Wire

Italy . 1,212 parts In-Stock

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$17.060

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$17.060

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IDEA Electronic Components Group

UK . 608 parts In-Stock

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$17.785

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$16.896

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$16.896

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608

$17.785

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$16.896

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DigiPath Technology Company

USA . 3,317 parts In-Stock

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$27.745

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$26.635

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$26.635

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$26.635

Microchip USA

USA . 2,391 parts In-Stock

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Component Stockers USA

USA . 1,889 parts In-Stock

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Native Components

USA . 763 parts In-Stock

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$2.177

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763

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$2.177

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Overview

Unlock the power of seamless communication with the ADP5589ACBZ-00-R7 by Analog Devices. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. From grid arrays to fine pitch packages, this product is designed to meet the demands of various applications in the telecom industry. With a focus on efficiency and performance, Analog Devices brings value and innovation to customers looking for cutting-edge solutions. Experience the benefits of superior connectivity and functionality with the ADP5589ACBZ-00-R7.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and resistance to environmental factors, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, reducing production time and costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand a wide range of environmental conditions, making it suitable for various applications.

Nominal Supply Voltage: 1.8 V

This low supply voltage requirement helps in reducing power consumption and heat generation, making the product energy efficient.

Technical Specifications

Other Function Telecom Interface ICs ADP5589ACBZ-00-R7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B25

JESD-609 Code:

e1

Length:

1.99 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.56 mm

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.99 mm

Trade Compliance

ADP5589ACBZ-00-R7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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