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STA8058

STMicroelectronics

STA8058 by STMicroelectronics

STA8058 by STMicroelectronics is a BICMOS technology IC with 104 terminals in a grid array package. Operating temperature ranges from -40 to 85 °C, suitable for industrial applications. It has power supplies of 2.7V and 3.3V, making it ideal for telecom interfaces requiring precise control and connectivity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,247 parts In-Stock

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6,247

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Digiode

USA . 3,067 parts In-Stock

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3,067

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Anansix

USA . 2,306 parts In-Stock

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2,306

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Cyclops Electronics Ltd

UK . 150 parts In-Stock

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150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,283 parts In-Stock

1+ parts

$16.431

100+ parts

-

1k+ parts

$14.788

10k+ parts

-

1,283

$16.431

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$14.788

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$20.917

100+ parts

$19.034

1k+ parts

$17.152

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-

5,000

$20.917

$19.034

$17.152

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AZTECH Wire

Italy . 1,105 parts In-Stock

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$22.010

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1,105

$22.010

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MKK Technologies

India . 2,128 parts In-Stock

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$30.898

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2,128

$30.898

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DigiPath Technology Company

USA . 2,128 parts In-Stock

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$30.898

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2,128

$30.898

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Component Stockers USA

USA . 303 parts In-Stock

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$99.990

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303

$99.990

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A-Z Elektronik GmbH

Germany . 4,566 parts In-Stock

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4,566

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Corphita

USA . 4,346 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Assy Fe

Spain . 1,020 parts In-Stock

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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Parana Technologies

USA . 677 parts In-Stock

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$19.646

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677

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$19.646

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ChipstoGo Electronic ltd

UK . 627 parts In-Stock

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627

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RC Electronics

USA . 320 parts In-Stock

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320

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Kepictronics

USA . 150 parts In-Stock

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150

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Overview

Discover the high-quality STA8058 by STMicroelectronics, a cutting-edge telecom interface IC that offers unmatched performance and reliability. Manufactured by the industry leader, this product is perfect for a wide range of applications in telecommunications. With its advanced technology and industrial-grade temperature rating, the STA8058 ensures optimal functionality in any environment. Experience the value and benefits of this exceptional product, designed to meet your every need with precision and efficiency. Unlock new possibilities with the STA8058 from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the product, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and effort during production.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board, making it suitable for compact designs.

Power Supplies (V): 2.7, 3.3

Support for multiple power supply voltages provides flexibility in system design and compatibility with different power sources.

No. of Terminals: 104

High number of terminals allows for connectivity to a wide range of external devices and components, increasing the versatility of the product.

Package Style: GRID ARRAY, FINE PITCH

Grid array with fine pitch configuration enables high-density mounting on circuit boards, ideal for applications with limited space.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in cold environments without any impact on functionality.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy connection to external devices and components, simplifying installation and maintenance.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures stable operation in demanding industrial environments, making it a reliable choice for industrial applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high speed and low power consumption for efficient performance.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and is suitable for automated assembly processes, ensuring consistent quality.

Terminal Pitch: 0.8 mm

Fine terminal pitch allows for high-density mounting on circuit boards, enabling compact designs and efficient use of space.

Technical Specifications

Other Function Telecom Interface ICs STA8058 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B104

No. of Terminals:

104

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA104,8X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

2.7,3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

STA8058 Telecommunications trade compliance attributes, and parameters.

ECCN

7A994

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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