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STA8090FGB

STMicroelectronics

STA8090FGB by STMicroelectronics

STA8090FGB by STMicroelectronics is a Telecom Interface IC with 99 terminals in a grid array package. Operating temperature range from -40 to 85°C, suitable for industrial use. Features CMOS technology, 1.2V supply voltage, and thin profile design for telecom circuit applications.

Median Price

$9.986

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,184 parts In-Stock

1+ parts

$4.964

100+ parts

-

1k+ parts

-

10k+ parts

-

2,184

$4.964

-

-

-

Chip1Stop

Japan . 2,184 parts In-Stock

1+ parts

$9.753

100+ parts

$6.356

1k+ parts

-

10k+ parts

-

2,184

$9.753

$6.356

-

-

Mouser Electronics

USA . 63 parts In-Stock

1+ parts

$10.220

100+ parts

$7.710

1k+ parts

-

10k+ parts

-

63

$10.220

$7.710

-

-

DigiKey

USA . 1,178 parts In-Stock

1+ parts

$10.990

100+ parts

$7.351

1k+ parts

$6.762

10k+ parts

$6.677

1,178

$10.990

$7.351

$6.762

$6.677

Verical

USA . 2,184 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,184

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,368 parts In-Stock

1+ parts

$9.265

100+ parts

-

1k+ parts

-

10k+ parts

-

3,368

$9.265

-

-

-

Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$9.389

100+ parts

-

1k+ parts

-

10k+ parts

-

95

$9.389

-

-

-

Vyrian

USA . 1,459 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,459

-

-

-

-

Anansix

USA . 356 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

356

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,558 parts In-Stock

1+ parts

$5.850

100+ parts

-

1k+ parts

-

10k+ parts

-

1,558

$5.850

-

-

-

Advanced Electronics

New Zealand . 95 parts In-Stock

1+ parts

$7.448

100+ parts

$6.778

1k+ parts

$6.107

10k+ parts

-

95

$7.448

$6.778

$6.107

-

Corphita

USA . 700 parts In-Stock

1+ parts

$8.778

100+ parts

-

1k+ parts

-

10k+ parts

-

700

$8.778

-

-

-

Continental Prestige Electronics

USA . 2,049 parts In-Stock

1+ parts

$9.389

100+ parts

-

1k+ parts

-

10k+ parts

$9.201

2,049

$9.389

-

-

$9.201

Netroflash

USA . 500 parts In-Stock

1+ parts

$9.389

100+ parts

$9.201

1k+ parts

$8.919

10k+ parts

$8.731

500

$9.389

$9.201

$8.919

$8.731

Corohmni

South Africa . 26 parts In-Stock

1+ parts

$10.155

100+ parts

-

1k+ parts

-

10k+ parts

-

26

$10.155

-

-

-

Aztec Data Supply Inc.

USA . 1,751 parts In-Stock

1+ parts

$11.297

100+ parts

-

1k+ parts

-

10k+ parts

-

1,751

$11.297

-

-

-

IDEA Electronic Components Group

UK . 117 parts In-Stock

1+ parts

$13.690

100+ parts

-

1k+ parts

$12.321

10k+ parts

-

117

$13.690

-

$12.321

-

MKK Technologies

India . 1,437 parts In-Stock

1+ parts

$25.742

100+ parts

-

1k+ parts

-

10k+ parts

-

1,437

$25.742

-

-

-

DigiPath Technology Company

USA . 1,437 parts In-Stock

1+ parts

$25.742

100+ parts

-

1k+ parts

-

10k+ parts

-

1,437

$25.742

-

-

-

Kepictronics

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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40,000

-

-

-

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Lixinc

USA . 18,064 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18,064

-

-

-

-

Perfect Parts

USA . 17,457 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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17,457

-

-

-

-

A-Z Elektronik GmbH

Germany . 1,931 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,931

-

-

-

-

Argo Parts USA

USA . 1,455 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,455

-

-

-

-

Parana Technologies

USA . 286 parts In-Stock

1+ parts

-

100+ parts

$16.368

1k+ parts

-

10k+ parts

-

286

-

$16.368

-

-

Overview

Enhance your telecommunications systems with the STA8090FGB by STMicroelectronics. This cutting-edge Telecom Interface IC offers unmatched quality and reliability, backed by a trusted manufacturer. With applications in various telecom functions, this product provides exceptional value to customers looking for seamless connectivity and optimal performance. Say goodbye to connectivity issues and hello to efficiency with the STA8090FGB.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and cost-effective, ideal for mass production.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and simplifying manufacturing processes.

Package Shape: RECTANGULAR

Rectangular shape ensures compatibility with standard PCB layouts and facilitates efficient placement within electronic systems.

No. of Terminals: 99

Having a high number of terminals allows for more connectivity options and versatility in system integration.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliability and stability under varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables the product to function in cold environments without any issues.

Terminal Position: BOTTOM

Bottom terminal position simplifies soldering and ensures the stability of the connection.

Width: 5 mm

Narrow width allows for a compact design, saving space in electronic devices.

Length: 6 mm

Short length enables the product to fit into small spaces, making it suitable for applications with limited room.

Technology: CMOS

CMOS technology offers high performance, low power consumption, and compatibility with a wide range of devices.

Nominal Supply Voltage: 1.2 V

Low nominal supply voltage reduces power consumption and heat generation, enhancing energy efficiency.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting, increasing the number of components that can be placed on a PCB.

Technical Specifications

Other Function Telecom Interface ICs STA8090FGB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B99

Length:

6 mm

No. of Functions:

1

No. of Terminals:

99

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

STA8090FGB Telecommunications trade compliance attributes, and parameters.

ECCN

7A994

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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