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STA8088G

STMicroelectronics

STA8088G by STMicroelectronics

STA8088G by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a max operating temp of 85 °C and a min of -40 °C. It has a compact 7x7 mm size with 56 terminals and operates at a nominal voltage of 1.2V. Ideal for automotive and telecom systems, it meets AEC-Q100 standards.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,624 parts In-Stock

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6,624

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Anansix

USA . 2,871 parts In-Stock

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Digiode

USA . 252 parts In-Stock

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252

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Distributors (Availability)

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AZTECH Wire

Italy . 1,094 parts In-Stock

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$14.040

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1,094

$14.040

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IDEA Electronic Components Group

UK . 842 parts In-Stock

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$14.106

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$12.696

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842

$14.106

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$12.696

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MKK Technologies

India . 921 parts In-Stock

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$26.526

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921

$26.526

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DigiPath Technology Company

USA . 921 parts In-Stock

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$26.526

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921

$26.526

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Corphita

USA . 877 parts In-Stock

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877

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Parana Technologies

USA . 399 parts In-Stock

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$16.866

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399

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$16.866

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Overview

Elevate your telecom solutions with the STA8088G from STMicroelectronics—a trusted leader in innovation and quality. Designed for industrial applications, this state-of-the-art interface IC enhances communication reliability while operating seamlessly in extreme temperatures. With its compact, heat-efficient design, the STA8088G ensures superior performance and flexibility, empowering your projects to achieve greater efficiency and durability. Choose excellence; choose STA8088G.

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easier integration into compact designs, improving space efficiency.

Screening Level: AEC-Q100

Meeting AEC-Q100 ensures high reliability and quality, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for uniform thermal distribution and easier layout in PCB design.

No. of Terminals: 56

A high number of terminals facilitates complex functionality and robust interconnections in telecom applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style enables superior thermal management and contributes to a small overall footprint.

Maximum Operating Temperature: 85 °C

The extended maximum temperature range ensures reliable operation in diverse environmental conditions.

Minimum Operating Temperature: -40 °C

With a low operating temperature threshold, this product is ideal for harsh environments and extreme weather.

Terminal Position: QUAD

Quad terminal positioning enhances layout flexibility and supports various board designs.

Maximum Seated Height: 0.9 mm

The low seated height contributes to a slim profile, which is advantageous in space-constrained applications.

Width: 7 mm

The compact width is suitable for modern, miniaturized designs, allowing efficient use of PCB space.

Length: 7 mm

A consistent length with width creates a balanced package, facilitating easy layout and heat dissipation.

Temperature Grade: INDUSTRIAL

Industrial temperature grade indicates robustness, ensuring reliable performance even in demanding conditions.

Technology: CMOS

CMOS technology ensures low power consumption while providing high-speed operation, essential for telecom applications.

Terminal Form: NO LEAD

No lead form contributes to a reduction in environmental impact, aligning with modern industry standards.

Telecom IC Type: TELECOM CIRCUIT

Specifically designed as a telecom circuit, this IC is optimized for high-performance communication tasks.

Nominal Supply Voltage: 1.2 V

A low nominal supply voltage helps in energy efficiency, making it suitable for battery-powered devices.

Terminal Pitch: 0.4 mm

A small terminal pitch allows for denser packing of components on the PCB, benefitting advanced designs.

Technical Specifications

Other Function Telecom Interface ICs STA8088G attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

Length:

7 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

7 mm

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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