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STA8058TR

STMicroelectronics

STA8058TR by STMicroelectronics

STA8058TR by STMicroelectronics is a BICMOS technology IC with 104 terminals in a grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With power supplies of 2.7-3.3V, it's ideal for telecom interfaces due to its fine pitch and bottom terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,050 parts In-Stock

1+ parts

-

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4,050

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-

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Anansix

USA . 1,692 parts In-Stock

1+ parts

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-

1k+ parts

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1,692

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Digiode

USA . 1,426 parts In-Stock

1+ parts

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1,426

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ComSIT Distribution GmbH

Germany . 1,266 parts In-Stock

1+ parts

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1,266

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 906 parts In-Stock

1+ parts

$15.620

100+ parts

-

1k+ parts

$14.058

10k+ parts

-

906

$15.620

-

$14.058

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MKK Technologies

India . 1,359 parts In-Stock

1+ parts

$29.372

100+ parts

-

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10k+ parts

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1,359

$29.372

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DigiPath Technology Company

USA . 1,359 parts In-Stock

1+ parts

$29.372

100+ parts

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1k+ parts

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10k+ parts

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1,359

$29.372

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Parana Technologies

USA . 1,294 parts In-Stock

1+ parts

-

100+ parts

$18.676

1k+ parts

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10k+ parts

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1,294

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$18.676

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Corphita

USA . 951 parts In-Stock

1+ parts

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951

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GreenTree Electronics

Israel . 627 parts In-Stock

1+ parts

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627

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Overview

Enhance your telecom systems with the STA8058TR by STMicroelectronics, a high-quality interface IC designed to optimize performance and reliability. Manufactured by the reputable STMicroelectronics, this product offers unparalleled value and benefits to customers in various applications. Its advanced technology, industrial temperature grade, and fine pitch package style make it a versatile choice for telecom projects. Upgrade your systems today with the STA8058TR and experience improved efficiency and functionality like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures durability and protection for the IC, making it suitable for long-term use in various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient placement on PCBs, simplifying the manufacturing process.

Package Shape: RECTANGULAR

Rectangular shape provides a standardized form factor for compatibility with common mounting configurations.

Power Supplies (V): 2.7,3.3

Support for multiple power supply voltages enables flexibility in the design and operation of the device in different systems.

No. of Terminals: 104

A higher number of terminals allows for more connections and functionalities, making the IC versatile in handling various input/output operations.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array with fine pitch design enhances the overall performance and reliability of the IC, especially in high-frequency applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures stability and resilience of the IC under extreme environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the IC to function effectively even in cold or harsh environments.

Terminal Position: BOTTOM

Bottom-terminal position facilitates efficient heat dissipation and simplifies the routing of signals in the PCB layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade certification ensures reliability and performance over a wide range of operating temperatures in industrial environments.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high-speed operation and low power consumption in a single IC.

Terminal Form: BALL

Ball terminal form provides secure and reliable connections, improving the overall stability and longevity of the IC in various applications.

Terminal Pitch: 0.8 mm

Fine terminal pitch enables high-density packaging of the IC, saving space and enhancing the overall efficiency of the device in crowded PCB layouts.

Technical Specifications

Other Function Telecom Interface ICs STA8058TR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PBGA-B104

No. of Terminals:

104

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA104,8X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

2.7,3.3

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

STA8058TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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