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STA8088

STMicroelectronics

STA8088 by STMicroelectronics

STA8088 by STMicroelectronics is a telecom interface IC designed for industrial applications, featuring a -40 °C to 85 °C operating temp range. It has a compact 7mm x 7mm square package with AEC-Q100 screening and operates at a nominal voltage of 1.2V. Ideal for space-constrained environments, it supports advanced telecom functions with its no-lead terminal design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,564 parts In-Stock

1+ parts

-

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3,564

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Vyrian

USA . 2,679 parts In-Stock

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2,679

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Anansix

USA . 994 parts In-Stock

1+ parts

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994

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,195 parts In-Stock

1+ parts

$8.228

100+ parts

-

1k+ parts

$7.406

10k+ parts

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2,195

$8.228

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$7.406

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MKK Technologies

India . 2,193 parts In-Stock

1+ parts

$15.473

100+ parts

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2,193

$15.473

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DigiPath Technology Company

USA . 2,193 parts In-Stock

1+ parts

$15.473

100+ parts

-

1k+ parts

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10k+ parts

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2,193

$15.473

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A-Z Elektronik GmbH

Germany . 5,114 parts In-Stock

1+ parts

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5,114

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Corphita

USA . 1,886 parts In-Stock

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1,886

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Parana Technologies

USA . 1,690 parts In-Stock

1+ parts

-

100+ parts

$9.838

1k+ parts

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1,690

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$9.838

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Kepictronics

USA . 300 parts In-Stock

1+ parts

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300

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Perfect Parts

USA . 54 parts In-Stock

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54

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Overview

Elevate your telecom projects with the STA8088 from STMicroelectronics—a trusted leader in cutting-edge technology. Designed for demanding industrial applications, this compact interface IC offers unmatched performance and reliability, even in extreme temperatures. With superior quality backed by AEC-Q100 screening, it ensures longevity and efficiency. Choose the STA8088 to unlock innovative solutions that enhance connectivity and drive your success forward!

Feature Benefit Bullets

Surface Mount: YES

The surface mount capability allows for easier and more compact PCB designs, making this IC ideal for space-constrained applications.

Screening Level: AEC-Q100

This level of screening ensures high reliability, making it suitable for automotive and other mission-critical applications.

Package Shape: SQUARE

The square package design provides uniformity in layout and optimization in space, facilitating efficient thermal management.

No. of Terminals: 56

A higher number of terminals allows for more functionalities and connections, which increases versatility in design.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Thin profile and heat sink integration improve thermal performance and density, making this IC suitable for high-performance applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this product is reliable for industrial applications and can function effectively in hot environments.

Minimum Operating Temperature: -40 °C

This wide temperature operating range ensures reliability in extreme environments, making it an excellent choice for outdoor or harsh applications.

Terminal Position: QUAD

Quad terminal position facilitates easy routing of traces on the PCB, enhancing design flexibility.

Maximum Seated Height: 0.9 mm

The low seated height allows for a compact design, which is critical in miniature devices and applications.

Width: 7 mm

A width of 7 mm provides a balance between space utilization and functionality, enabling it to fit in various modules.

Length: 7 mm

The length of 7 mm complements the width, ensuring a square and compact footprint that is ideal for efficient layout.

Temperature Grade: INDUSTRIAL

Industrial grade rating signifies enhanced durability and reliability, ensuring consistent performance in various applications.

Technology: CMOS

CMOS technology offers high speed and low power consumption, making this IC energy-efficient while delivering excellent performance.

Terminal Form: NO LEAD

No lead design allows for a more compact package and reduced weight, as well as improved performance due to their reduced inductance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC ensures optimal performance and reliability in communication systems.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage of 1.2 V helps in reducing power consumption, ideal for battery-powered devices.

Terminal Pitch: 0.4 mm

The finer terminal pitch allows for a more compact layout on PCBs, enabling higher density designs and enhanced functionality.

Technical Specifications

Other Function Telecom Interface ICs STA8088 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

Length:

7 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

7 mm

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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