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STA8088A

STMicroelectronics

STA8088A by STMicroelectronics

STA8088A by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 56-terminal, very thin profile package with a nominal voltage of 1.2V. Ideal for space-constrained environments, it utilizes CMOS technology for efficient performance.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,643 parts In-Stock

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4,643

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Vyrian

USA . 1,597 parts In-Stock

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1,597

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Anansix

USA . 1,073 parts In-Stock

1+ parts

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1,073

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,188 parts In-Stock

1+ parts

$9.320

100+ parts

-

1k+ parts

$8.388

10k+ parts

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1,188

$9.320

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$8.388

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MKK Technologies

India . 2,122 parts In-Stock

1+ parts

$17.525

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2,122

$17.525

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DigiPath Technology Company

USA . 2,122 parts In-Stock

1+ parts

$17.525

100+ parts

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2,122

$17.525

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Corphita

USA . 3,413 parts In-Stock

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3,413

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Parana Technologies

USA . 2,207 parts In-Stock

1+ parts

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100+ parts

$11.143

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2,207

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$11.143

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Overview

Unlock unparalleled performance with the STA8088A from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for robust telecom applications, this sleek and compact IC ensures reliability across diverse environments, operating seamlessly from -40 °C to 85 °C. Its high-quality construction offers exceptional value, making it the ideal choice for advanced communication systems. Elevate your projects with precision and efficiency that only STMicroelectronics can deliver!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for compact integration onto PCBs, facilitating space-saving and efficient layouts.

Package Shape: SQUARE

The square package shape promotes uniform thermal distribution, enhancing performance and reliability in applications.

No. of Terminals: 56

With 56 terminals, this IC provides ample connections for complex circuitry, making it suitable for advanced telecom applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style supports effective heat dissipation while maintaining a low profile, ideal for space-constrained environments.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that this IC can function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature, this IC is suitable for use in extreme temperature conditions, ensuring wide operational flexibility.

Terminal Position: QUAD

The quad terminal position allows for efficient layout design and straightforward soldering, enhancing assembly reliability.

Maximum Seated Height: 0.9 mm

A maximum seated height of just 0.9 mm enables thin-profile designs and is well-suited for modern electronic devices.

Width: 7 mm

At a width of 7 mm, this product strikes a balance between size and functionality, fitting well in various telecom applications.

Length: 7 mm

This length contributes to a compact footprint, making it easy to integrate into dense PCB layouts.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures reliability and performance in harsh conditions, ideal for telecom infrastructure.

Technology: CMOS

The CMOS technology used provides low power consumption while maintaining high-speed performance, perfect for telecom applications.

Terminal Form: NO LEAD

The no-lead design reduces overall package size and enhances reliability by minimizing potential failure points in solder joints.

Telecom IC Type: TELECOM CIRCUIT

Tailored as a telecom circuit IC, it meets specific requirements for communication systems, ensuring optimized performance.

Nominal Supply Voltage: 1.2 V

The low nominal supply voltage allows for energy-efficient designs, aligning with modern trends toward green electronics.

Terminal Pitch: 0.4 mm

A terminal pitch of 0.4 mm supports high-density interconnections, enabling complex and compact circuit designs.

Technical Specifications

Other Function Telecom Interface ICs STA8088A attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-XQCC-N56

Length:

7 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Maximum Seated Height:

.9 mm

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

7 mm

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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