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TLK10022CTR

Texas Instruments

TLK10022CTR by Texas Instruments

TLK10022CTR by Texas Instruments is a 144-terminal, telecom interface IC with data rate of 10 Gbps. It operates b/w -40 to 85°C and has a supply voltage of 1V. Ideal for industrial applications requiring high-speed telecommunications circuitry in compact form factor.

Median Price

$38.428

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,541 parts In-Stock

1+ parts

$35.343

100+ parts

$31.416

1k+ parts

$23.100

10k+ parts

-

1,541

$35.343

$31.416

$23.100

-

Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$52.390

100+ parts

$42.930

1k+ parts

$38.910

10k+ parts

-

101

$52.390

$42.930

$38.910

-

Rochester

USA . 279 parts In-Stock

1+ parts

-

100+ parts

$33.210

1k+ parts

$29.720

10k+ parts

$27.970

279

-

$33.210

$29.720

$27.970

DigiKey

USA . 279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

279

-

-

-

-

Verical

USA . 279 parts In-Stock

1+ parts

-

100+ parts

$41.513

1k+ parts

$37.150

10k+ parts

$34.962

279

-

$41.513

$37.150

$34.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,866 parts In-Stock

1+ parts

$30.476

100+ parts

-

1k+ parts

-

10k+ parts

-

4,866

$30.476

-

-

-

DigiKey Marketplace

USA . 678 parts In-Stock

1+ parts

$33.370

100+ parts

-

1k+ parts

-

10k+ parts

-

678

$33.370

-

-

-

Vyrian

USA . 7,814 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,814

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,684 parts In-Stock

1+ parts

$12.451

100+ parts

-

1k+ parts

$12.890

10k+ parts

-

1,684

$12.451

-

$12.890

-

DigiPath Technology Company

USA . 1,118 parts In-Stock

1+ parts

$13.710

100+ parts

$12.613

1k+ parts

-

10k+ parts

-

1,118

$13.710

$12.613

-

-

ChromeModa Solutions

Germany . 6,165 parts In-Stock

1+ parts

$13.990

100+ parts

$11.472

1k+ parts

-

10k+ parts

-

6,165

$13.990

$11.472

-

-

IDEA Electronic Components Group

UK . 1,369 parts In-Stock

1+ parts

$13.990

100+ parts

$13.290

1k+ parts

$12.591

10k+ parts

-

1,369

$13.990

$13.290

$12.591

-

Corphita

USA . 4,024 parts In-Stock

1+ parts

$28.872

100+ parts

-

1k+ parts

-

10k+ parts

-

4,024

$28.872

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,000

-

-

-

-

Overview

Experience unparalleled quality and reliability with the TLK10022CTR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge solutions for Other Function Telecom Interface ICs. This product offers exceptional value with its high-performance capabilities, making it ideal for a wide range of applications. From telecommunications to networking, the TLK10022CTR provides customers with unparalleled benefits and advantages, ensuring seamless operation and optimal performance. Trust Texas Instruments for all your telecom interface needs and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good durability and resistance to external elements, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and simplifies the layout design.

No. of Terminals: 144

Having a higher number of terminals enables the IC to handle a large amount of data and connections, making it suitable for complex telecom applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this IC can function effectively in demanding industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extremely cold conditions, making this IC versatile and suitable for a wide range of applications.

Terminal Finish: TIN SILVER COPPER

The use of multiple terminal finishes enhances both electrical conductivity and corrosion resistance, improving the overall performance and longevity of the IC.

Package Style: GRID ARRAY, HEAT SINK/SLUG

The grid array package style with heat sink/slug ensures efficient heat dissipation, allowing the IC to operate optimally even under high data rates and heavy loads.

Technical Specifications

Other Function Telecom Interface ICs TLK10022CTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

10000 Mbps

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

13.05 mm

Moisture Sensitivity Level (MSL):

4

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

3.25 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

13.05 mm

Trade Compliance

TLK10022CTR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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