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TLK1002RGER

Texas Instruments

TLK1002RGER by Texas Instruments

TLK1002RGER by Texas Instruments is a CMOS telecom IC with 24 terminals in a square chip carrier package. It operates at 1.8V, consuming 158mA max current, suitable for commercial temperature grades from 0 to 70°C. Ideal for surface-mount applications requiring high-speed data transmission.

Median Price

$10.760

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 144,000 parts In-Stock

1+ parts

-

100+ parts

$9.310

1k+ parts

$8.330

10k+ parts

$7.840

144,000

-

$9.310

$8.330

$7.840

DigiKey

USA . 84,000 parts In-Stock

1+ parts

-

100+ parts

$10.760

1k+ parts

-

10k+ parts

-

84,000

-

$10.760

-

-

Verical

USA . 45,000 parts In-Stock

1+ parts

-

100+ parts

$11.637

1k+ parts

$10.412

10k+ parts

$9.800

45,000

-

$11.637

$10.412

$9.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,353 parts In-Stock

1+ parts

$9.832

100+ parts

-

1k+ parts

-

10k+ parts

-

2,353

$9.832

-

-

-

Vyrian

USA . 3,475 parts In-Stock

1+ parts

$10.350

100+ parts

-

1k+ parts

-

10k+ parts

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3,475

$10.350

-

-

-

DigiKey Marketplace

USA . 144,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

144,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 857 parts In-Stock

1+ parts

$8.264

100+ parts

-

1k+ parts

$8.881

10k+ parts

-

857

$8.264

-

$8.881

-

DigiPath Technology Company

USA . 502 parts In-Stock

1+ parts

$9.099

100+ parts

$8.371

1k+ parts

-

10k+ parts

-

502

$9.099

$8.371

-

-

ChromeModa Solutions

Germany . 5,252 parts In-Stock

1+ parts

$9.285

100+ parts

$7.614

1k+ parts

-

10k+ parts

-

5,252

$9.285

$7.614

-

-

IDEA Electronic Components Group

UK . 1,549 parts In-Stock

1+ parts

$9.285

100+ parts

$8.821

1k+ parts

$8.356

10k+ parts

-

1,549

$9.285

$8.821

$8.356

-

Corphita

USA . 1,926 parts In-Stock

1+ parts

$9.315

100+ parts

-

1k+ parts

-

10k+ parts

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1,926

$9.315

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-

-

Assy Fe

Spain . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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Microchip USA

USA . 279 parts In-Stock

1+ parts

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100+ parts

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279

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Overview

Enhance your telecommunications systems with the TLK1002RGER by Texas Instruments, a top-quality interface IC that delivers unparalleled performance and reliability. Manufactured by the renowned Texas Instruments, this chip carrier package boasts a durable plastic/epoxy body and surface mount technology for easy installation. Ideal for a wide range of applications, this innovative product offers customers exceptional value, benefits, and advantages, making it a must-have for anyone looking to upgrade their telecom infrastructure. Elevate your communication capabilities with the TLK1002RGER today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable package for the IC, ensuring easy handling and long-term reliability.

Surface Mount: YES

Enables easy and reliable mounting on PCBs, saving space and making assembly more efficient.

Package Shape: SQUARE

Square packages are generally easier to handle and store, making it a practical choice for manufacturing and maintenance.

Power Supplies (V): 1.8

Operates at a low voltage, making it energy-efficient and suitable for applications requiring low power consumption.

No. of Terminals: 24

Offers multiple connection points for versatile integration into different circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are compact and offer good thermal performance, making them suitable for high-density applications.

Maximum Operating Temperature: 70 °C

Can operate efficiently at higher temperatures, ensuring reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Capable of functioning in cold environments without compromising performance, increasing its versatility.

Terminal Finish: TIN LEAD

Tin-lead finish provides good solderability and electrical conductivity, ensuring reliable connections.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications, offering a cost-effective solution for various projects.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and industry standards, making it a sustainable choice.

Maximum Supply Current: 158 mA

Capable of delivering a sufficient current to meet the requirements of the connected circuitry while maintaining efficiency.

Nominal Supply Voltage: 1.8 V

Operates at a low voltage, reducing power consumption and heat dissipation for improved energy efficiency.

Terminal Pitch: 0.5 mm

Offers a fine terminal pitch for precise connections, enabling compact designs and efficient PCB layouts.

Technical Specifications

Other Function Telecom Interface ICs TLK1002RGER attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

158 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Trade Compliance

TLK1002RGER Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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