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TLK1002ARGERG4

Texas Instruments

TLK1002ARGERG4 by Texas Instruments

TLK1002ARGERG4 by Texas Instruments is a telecom interface IC with 24 terminals in a square chip carrier package. Operating at 1.8V, it has a max temperature of 70°C and consumes 0.158mA supply current. Ideal for telecom circuits, this CMOS technology IC is designed for commercial-grade applications requiring thin profile packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,616 parts In-Stock

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Vyrian

USA . 2,526 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,770 parts In-Stock

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$10.261

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$10.795

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1,770

$10.261

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$10.795

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AZTECH Wire

Italy . 853 parts In-Stock

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$11.139

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853

$11.139

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DigiPath Technology Company

USA . 1,131 parts In-Stock

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$11.298

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$10.395

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$11.298

$10.395

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ChromeModa Solutions

Germany . 4,261 parts In-Stock

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$11.529

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$9.454

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$11.529

$9.454

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IDEA Electronic Components Group

UK . 950 parts In-Stock

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$11.529

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$10.953

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$10.376

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950

$11.529

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$10.376

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One Stop Electronics

USA . 1,646 parts In-Stock

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$269.000

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$269.000

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,760 parts In-Stock

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Metaverse IC Inc.

Canada . 1,176 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the TLK1002ARGERG4 by Texas Instruments. Known for their exceptional craftsmanship, Texas Instruments delivers cutting-edge telecom interface ICs that are sure to exceed your expectations. Whether you're in telecommunications, data communications, or industrial applications, this product offers unmatched value with its high performance and innovative design. Trust in Texas Instruments to provide you with the best solutions for your needs, and see the difference for yourself. Unlock the full potential of your projects with the TLK1002ARGERG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material offers good heat dissipation, durability, and resistance to environmental factors, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing manufacturing costs and improving reliability.

Power Supplies (V): 1.8

Operates at a low voltage of 1.8V, making it suitable for power-sensitive applications and reducing power consumption.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the product can withstand harsh environmental conditions and ensure stable performance.

Technology: CMOS

Utilizing CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making the product efficient and reliable.

Nominal Supply Voltage: 1.8 V

Matching the power supply voltage of 1.8V ensures compatibility and optimal performance within the specified range.

Technical Specifications

Other Function Telecom Interface ICs TLK1002ARGERG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.158 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TLK1002ARGERG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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