Loading...

TLK1501AIRCP

Texas Instruments

TLK1501AIRCP by Texas Instruments

TLK1501AIRCP by Texas Instruments is a 64-terminal, telecom interface IC with a supply voltage of 2.5V. It operates b/w -40 to 85°C and has a peak reflow temperature of 260°C. Ideal for telecom circuits, it features a flatpack package style and gull wing terminal form for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,015 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

16,015

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,951 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,951

-

-

-

-

Vyrian

USA . 3,174 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,174

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 497 parts In-Stock

1+ parts

$5.851

100+ parts

-

1k+ parts

$6.634

10k+ parts

-

497

$5.851

-

$6.634

-

ChromeModa Solutions

Germany . 6,778 parts In-Stock

1+ parts

$6.574

100+ parts

$5.391

1k+ parts

-

10k+ parts

-

6,778

$6.574

$5.391

-

-

IDEA Electronic Components Group

UK . 1,050 parts In-Stock

1+ parts

$6.574

100+ parts

-

1k+ parts

$5.917

10k+ parts

-

1,050

$6.574

-

$5.917

-

Semicontronic

India . 15,554 parts In-Stock

1+ parts

$483.000

100+ parts

$470.925

1k+ parts

$468.510

10k+ parts

-

15,554

$483.000

$470.925

$468.510

-

Ampacity Inc.

Singapore . 15,630 parts In-Stock

1+ parts

$980.000

100+ parts

-

1k+ parts

-

10k+ parts

-

15,630

$980.000

-

-

-

DigiPath Technology Company

USA . 808 parts In-Stock

1+ parts

-

100+ parts

$5.927

1k+ parts

-

10k+ parts

-

808

-

$5.927

-

-

Corphita

USA . 489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

489

-

-

-

-

Corohmni

South Africa . 335 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

335

-

-

-

-

Overview

Unlock seamless communication with the TLK1501AIRCP by Texas Instruments, a cutting-edge telecom interface IC designed to deliver unparalleled quality and reliability. Manufactured by industry leader Texas Instruments, this product boasts a wide range of applications in the telecom sector. With its advanced features and benefits, including a robust package body material and nickel palladium gold terminal finish, customers can trust in the superior performance and value that this product offers. Elevate your communication systems with the TLK1501AIRCP and experience unmatched efficiency and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and flexibility, making the product resistant to physical damage.

Surface Mount: YES

Being surface mountable ensures easy and efficient installation on PCBs, saving space and reducing assembly time.

Package Shape: SQUARE

Square package shape helps optimize space utilization on the board, allowing for efficient layout and placement.

No. of Terminals: 64

Having 64 terminals allows for multiple connectivity options, enhancing the functionality and versatility of the product.

Package Style: FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

The combination of flatpack style, heat sink/slug, thin profile, and fine pitch design enhances heat dissipation, space efficiency, and overall performance of the product.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

The wide temperature range allows the product to function effectively in both high and low temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity, corrosion resistance, and solderability, enhancing the reliability and longevity of the product.

Terminal Position: QUAD

Quad terminal position ensures stable and secure connections, reducing the risk of disconnection and signal loss.

Maximum Seated Height: 1 mm

Low seated height facilitates compact design and integration, making the product suitable for space-constrained applications.

Width: 10 mm

Compact width dimension enables easy placement and installation of the product on the circuit board, optimizing board space.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures quick and efficient soldering, speeding up the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures thorough soldering and strong joints, enhancing the reliability and durability of the product.

Length: 10 mm

Compact length dimension helps in space-saving integration of the product in PCB designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in industrial environments with varying temperature conditions.

Terminal Form: GULL WING

Gull wing terminal form offers secure mechanical support and easy soldering, ensuring stable connections for optimal performance.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, the product provides optimized performance and functionality for telecommunications applications.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V is suitable for telecom applications, ensuring compatibility and efficient power consumption.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for high density mounting, enabling the product to accommodate complex circuit designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate precautions are required during storage and handling, ensuring product integrity.

Technical Specifications

Other Function Telecom Interface ICs TLK1501AIRCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1501AIRCP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 18