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TLK1501IRCP

Texas Instruments

TLK1501IRCP by Texas Instruments

TLK1501IRCP by Texas Instruments is a telecom IC with 64 terminals, operating at -40 to 85°C. It has a data rate of 2500 Mbps and operates at 2.5V supply voltage. Ideal for telecom circuits, it features a flatpack package style and gull wing terminal form for industrial applications.

Median Price

$19.701

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 140 parts In-Stock

1+ parts

$10.776

100+ parts

$10.190

1k+ parts

$10.053

10k+ parts

-

140

$10.776

$10.190

$10.053

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Chip1Stop

Japan . 190 parts In-Stock

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$14.300

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190

$14.300

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Texas Instruments

USA . 16,785 parts In-Stock

1+ parts

$20.893

100+ parts

$18.250

1k+ parts

$12.586

10k+ parts

-

16,785

$20.893

$18.250

$12.586

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Mouser Electronics

USA . 143 parts In-Stock

1+ parts

$29.590

100+ parts

$22.500

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-

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143

$29.590

$22.500

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Rochester

USA . 2,615 parts In-Stock

1+ parts

-

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$18.090

1k+ parts

$16.180

10k+ parts

$15.230

2,615

-

$18.090

$16.180

$15.230

DigiKey

USA . 2,615 parts In-Stock

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-

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$23.800

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2,615

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$23.800

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Verical

USA . 1,441 parts In-Stock

1+ parts

-

100+ parts

$22.613

1k+ parts

$20.225

10k+ parts

$19.038

1,441

-

$22.613

$20.225

$19.038

Avnet

USA . 76 parts In-Stock

1+ parts

-

100+ parts

$18.509

1k+ parts

$16.610

10k+ parts

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76

-

$18.509

$16.610

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 154 parts In-Stock

1+ parts

$13.915

100+ parts

$14.611

1k+ parts

$13.776

10k+ parts

-

154

$13.915

$14.611

$13.776

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Digiode

USA . 2,928 parts In-Stock

1+ parts

$16.606

100+ parts

-

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2,928

$16.606

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Vyrian

USA . 968 parts In-Stock

1+ parts

$17.480

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968

$17.480

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DigiKey Marketplace

USA . 2,615 parts In-Stock

1+ parts

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2,615

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ComSIT Distribution GmbH

Germany . 131 parts In-Stock

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131

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ComSIT USA

USA . 131 parts In-Stock

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131

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Connect4Technologies Inc.

Canada . 19 parts In-Stock

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Zilex Electronics Inc.

Canada . 17 parts In-Stock

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Inventory MP

USA . 6 parts In-Stock

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6

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Cyclops Electronics Ltd

UK . 5 parts In-Stock

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5

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 271 parts In-Stock

1+ parts

$12.884

100+ parts

-

1k+ parts

$13.367

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271

$12.884

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$13.367

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DigiPath Technology Company

USA . 33 parts In-Stock

1+ parts

$14.186

100+ parts

$13.052

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33

$14.186

$13.052

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ChromeModa Solutions

Germany . 3,286 parts In-Stock

1+ parts

$14.476

100+ parts

$11.870

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3,286

$14.476

$11.870

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IDEA Electronic Components Group

UK . 2,015 parts In-Stock

1+ parts

$14.476

100+ parts

$13.752

1k+ parts

$13.028

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2,015

$14.476

$13.752

$13.028

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Corphita

USA . 4,457 parts In-Stock

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$15.732

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4,457

$15.732

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A-Z Elektronik GmbH

Germany . 6,600 parts In-Stock

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6,600

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Lixinc

USA . 3,009 parts In-Stock

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Perfect Parts

USA . 2,713 parts In-Stock

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2,713

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Kepictronics

USA . 188 parts In-Stock

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188

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Overview

Unlock the potential of your telecom applications with the TLK1501IRCP by Texas Instruments. Known for their high-quality products, Texas Instruments delivers top-notch performance and reliability. This telecom interface IC offers seamless communication at lightning-fast speeds of up to 2500 Mbps, making it ideal for a wide range of telecom circuit applications. Experience the value and benefits of this cutting-edge technology, designed to elevate your projects to new heights. Choose Texas Instruments for unparalleled quality and performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easier and more efficient integration into circuit boards.

Power Supplies (V): 2.5

Operating at 2.5V provides energy efficiency and compatibility with a wide range of systems.

No. of Terminals: 64

Having 64 terminals enables increased connectivity options and functionality for the product.

Maximum Operating Temperature: 85 °C

Being able to operate at up to 85°C ensures the product can handle high temperature conditions without compromising performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V ensures stable and consistent power delivery for the product's operation.

Data Rate: 2500 Mbps

With a data rate of 2500 Mbps, the product can transmit data at high speeds, making it suitable for telecommunications applications.

Technical Specifications

Other Function Telecom Interface ICs TLK1501IRCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

2500 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

TTL

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1501IRCP Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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