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TLK100PHPR

Texas Instruments

TLK100PHPR by Texas Instruments

TLK100PHPR by Texas Instruments is a telecom interface IC with 48 terminals and operates at data rates up to 100 Mbps. It has a supply voltage of 3.3V, temperature range from -40 to 85°C, and is suitable for industrial applications requiring high-speed communication in compact spaces.

Median Price

$8.050

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 190 parts In-Stock

1+ parts

$4.190

100+ parts

$4.110

1k+ parts

$4.020

10k+ parts

-

190

$4.190

$4.110

$4.020

-

Mouser Electronics

USA . 550 parts In-Stock

1+ parts

$11.910

100+ parts

$7.790

1k+ parts

$5.820

10k+ parts

-

550

$11.910

$7.790

$5.820

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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4,969

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-

-

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Vyrian

USA . 4,498 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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4,498

-

-

-

-

Cyclops Electronics Ltd

UK . 3,900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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3,900

-

-

-

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Resion

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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260

-

-

-

-

Bristol Electronics

USA . 10 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 32 parts In-Stock

1+ parts

$12.987

100+ parts

$11.818

1k+ parts

$10.649

10k+ parts

-

32

$12.987

$11.818

$10.649

-

Parana Technologies

USA . 6 parts In-Stock

1+ parts

$15.032

100+ parts

-

1k+ parts

$15.447

10k+ parts

-

6

$15.032

-

$15.447

-

DigiPath Technology Company

USA . 514 parts In-Stock

1+ parts

$16.552

100+ parts

-

1k+ parts

-

10k+ parts

-

514

$16.552

-

-

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ChromeModa Solutions

Germany . 6,832 parts In-Stock

1+ parts

$16.890

100+ parts

$13.850

1k+ parts

-

10k+ parts

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6,832

$16.890

$13.850

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IDEA Electronic Components Group

UK . 454 parts In-Stock

1+ parts

$16.890

100+ parts

$16.046

1k+ parts

$15.201

10k+ parts

-

454

$16.890

$16.046

$15.201

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One Stop Electronics

USA . 1,486 parts In-Stock

1+ parts

$541.000

100+ parts

-

1k+ parts

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10k+ parts

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1,486

$541.000

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-

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Lixinc

USA . 5,558 parts In-Stock

1+ parts

-

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5,558

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Corphita

USA . 4,293 parts In-Stock

1+ parts

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4,293

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Kepictronics

USA . 158 parts In-Stock

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158

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Overview

Elevate your telecom interface IC experience with the TLK100PHPR by Texas Instruments! Crafted with precision and expertise, this cutting-edge product offers unmatched quality and reliability. From its sleek design to its versatile applications, this innovative solution provides exceptional value and performance for all your communication needs. Say goodbye to compromise and hello to seamless connectivity with the TLK100PHPR – where excellence meets affordability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, reducing overall product weight and manufacturing costs.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto a PCB, saving space and enabling automated manufacturing processes.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on the PCB, especially when size is a critical factor in the design.

Power Supplies (V): 1.1, 1.8, 3.3

The availability of multiple power supply options enables flexibility in system design, allowing compatibility with different voltage requirements.

No. of Terminals: 48

With 48 terminals, this IC provides a sufficient number of connections for interfacing with other components, enhancing the functionality of the product.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The variety of package styles available cater to different application needs, providing options for thermal management, space constraints, and high-density PCB layouts.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even under challenging environmental conditions, making this product suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for operation in cold conditions without compromising performance, increasing the product's versatility.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish provides excellent corrosion resistance and ensures stable electrical connections for long-term reliability.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure mounting on the PCB, enhancing mechanical stability and simplifying the assembly process.

Maximum Seated Height: 1.2 mm

The low maximum seated height helps in reducing the overall profile of the product, making it suitable for compact designs and applications with height restrictions.

Width: 7 mm

The compact width of 7 mm allows for space-efficient placement on the PCB, optimizing board real estate and enabling denser circuit layouts.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures reliable solder joints during the assembly process, contributing to the overall robustness of the product.

Length: 7 mm

With a length of 7 mm, this IC is suitable for applications where board space is limited, offering a compact footprint for efficient PCB design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates the product's reliability and suitability for operation in harsh industrial environments, ensuring consistent performance under challenging conditions.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and secure solder connections, reducing the risk of electrical discontinuities and ensuring robust performance.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC type, this product is specifically designed and optimized for telecom applications, offering high-speed data processing capabilities and superior signal integrity.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying integration into existing systems and reducing the need for additional voltage regulation components.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm enables high-density packaging and precise connections, allowing for more terminals in a smaller space and facilitating complex circuit designs.

Data Rate: 100 Mbps

With a data rate of 100 Mbps, this IC is capable of handling high-speed data transmission, making it ideal for telecom applications that require fast and reliable communication.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates that this product has a moderate sensitivity to moisture during the soldering process, requiring standard handling procedures for moisture protection.

Technical Specifications

Other Function Telecom Interface ICs TLK100PHPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

TLK100PHPR Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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