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TLK1002ARGER

Texas Instruments

TLK1002ARGER by Texas Instruments

TLK1002ARGER by Texas Instruments is a telecom IC with 24 terminals, operating at 1.8V. It features CMOS technology, quad terminal position, and nickel palladium gold finish. Ideal for telecom circuits, it has a compact square package style suitable for surface mount applications.

Median Price

$8.100

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

$7.010

1k+ parts

$6.270

10k+ parts

$5.900

60,000

-

$7.010

$6.270

$5.900

Verical

USA . 33,000 parts In-Stock

1+ parts

-

100+ parts

$8.762

1k+ parts

$7.838

10k+ parts

$7.375

33,000

-

$8.762

$7.838

$7.375

DigiKey

USA . 30,000 parts In-Stock

1+ parts

-

100+ parts

$8.100

1k+ parts

-

10k+ parts

-

30,000

-

$8.100

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,766 parts In-Stock

1+ parts

$7.400

100+ parts

-

1k+ parts

-

10k+ parts

-

2,766

$7.400

-

-

-

Vyrian

USA . 274 parts In-Stock

1+ parts

$7.790

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$7.790

-

-

-

DigiKey Marketplace

USA . 60,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

60,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 276 parts In-Stock

1+ parts

$7.011

100+ parts

-

1k+ parts

-

10k+ parts

-

276

$7.011

-

-

-

Parana Technologies

USA . 1,503 parts In-Stock

1+ parts

$11.141

100+ parts

-

1k+ parts

$11.594

10k+ parts

-

1,503

$11.141

-

$11.594

-

DigiPath Technology Company

USA . 418 parts In-Stock

1+ parts

$12.268

100+ parts

$11.286

1k+ parts

-

10k+ parts

-

418

$12.268

$11.286

-

-

ChromeModa Solutions

Germany . 1,466 parts In-Stock

1+ parts

$12.518

100+ parts

$10.265

1k+ parts

-

10k+ parts

-

1,466

$12.518

$10.265

-

-

IDEA Electronic Components Group

UK . 946 parts In-Stock

1+ parts

$12.518

100+ parts

$11.892

1k+ parts

$11.266

10k+ parts

-

946

$12.518

$11.892

$11.266

-

A-Z Elektronik GmbH

Germany . 6,827 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,827

-

-

-

-

Kepictronics

USA . 6,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,488

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,000

-

-

-

-

Microchip USA

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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115

-

-

-

-

Overview

Experience superior quality and reliability with the TLK1002ARGER by Texas Instruments, a leading manufacturer in the industry. This innovative telecom interface IC is designed to meet the demands of various applications, offering unmatched performance and efficiency. With a package body material of PLASTIC/EPOXY and a compact square shape, this product is perfect for space-constrained designs. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations, providing customers with exceptional value and benefits. Elevate your projects with the TLK1002ARGER and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Being surface mountable makes it suitable for automated assembly processes, leading to improved efficiency and accuracy in production.

Power Supplies (V): 1.8

Operating at a low power supply voltage of 1.8V helps in reducing power consumption and overall energy efficiency.

No. of Terminals: 24

Having a higher number of terminals provides more connectivity options and flexibility in usage.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures stable performance even under demanding conditions.

Technology: CMOS

Utilizing CMOS technology allows for low power consumption, high noise immunity, and compatibility with a wide range of applications.

Technical Specifications

Other Function Telecom Interface ICs TLK1002ARGER attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.158 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TLK1002ARGER Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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