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TLK1501IRCPG4

Texas Instruments

TLK1501IRCPG4 by Texas Instruments

TLK1501IRCPG4 by Texas Instruments is a telecom IC with 64 terminals, operating at 2.5V. It offers data rate of 2500 Mbps and operates in industrial temperature range (-40 to 85°C). This square-shaped IC is ideal for telecom circuit applications requiring high-speed data transmission.

Median Price

$33.220

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 101 parts In-Stock

1+ parts

$24.060

100+ parts

$18.530

1k+ parts

$17.930

10k+ parts

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101

$24.060

$18.530

$17.930

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Mouser Electronics

USA . 185 parts In-Stock

1+ parts

$33.220

100+ parts

$24.270

1k+ parts

$22.750

10k+ parts

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185

$33.220

$24.270

$22.750

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Element14

Singapore . 101 parts In-Stock

1+ parts

$37.660

100+ parts

$30.000

1k+ parts

$26.820

10k+ parts

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101

$37.660

$30.000

$26.820

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,612 parts In-Stock

1+ parts

$25.422

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4,612

$25.422

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Vyrian

USA . 9,296 parts In-Stock

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ComSIT Distribution GmbH

Germany . 115 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Holdelec - ElecDif-Pro

France . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 724 parts In-Stock

1+ parts

$15.005

100+ parts

-

1k+ parts

$15.426

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724

$15.005

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$15.426

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DigiPath Technology Company

USA . 1,017 parts In-Stock

1+ parts

$16.522

100+ parts

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1,017

$16.522

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ChromeModa Solutions

Germany . 4,936 parts In-Stock

1+ parts

$16.859

100+ parts

$13.824

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-

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4,936

$16.859

$13.824

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IDEA Electronic Components Group

UK . 211 parts In-Stock

1+ parts

$16.859

100+ parts

$16.016

1k+ parts

$15.173

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211

$16.859

$16.016

$15.173

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Corphita

USA . 3,421 parts In-Stock

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$24.084

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3,421

$24.084

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QUARKTWIN TECHNOLOGY LTD

USA . 22,533 parts In-Stock

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22,533

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Microchip USA

USA . 12,727 parts In-Stock

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12,727

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Overview

Experience seamless communication with the TLK1501IRCPG4 by Texas Instruments. Crafted with precision and expertise, this telecom interface IC offers unparalleled quality and reliability. Whether in industrial or commercial settings, this product ensures smooth data transmission at high speeds of up to 2500 Mbps. Say goodbye to connectivity issues and hello to efficiency with Texas Instruments' cutting-edge technology. Unlock a world of possibilities with the TLK1501IRCPG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into electronic circuits and reduces assembly time.

Power Supplies (V): 2.5

The product operates at a low voltage of 2.5V, making it energy efficient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand thermal stress in various environments.

Data Rate: 2500 Mbps

The high data rate of 2500 Mbps ensures fast and efficient data transmission for telecom applications.

Technical Specifications

Other Function Telecom Interface ICs TLK1501IRCPG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

2500 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

TTL

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1501IRCPG4 Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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