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TLK1002RGE

Texas Instruments

TLK1002RGE by Texas Instruments

TLK1002RGE by Texas Instruments is a CMOS telecom IC with 24 terminals, operating at 1.8V. It has a peak reflow temp of 235°C and max supply current of 158mA. Ideal for commercial applications requiring high-speed data transmission in a compact chip carrier package.

Median Price

$10.510

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,594 parts In-Stock

1+ parts

-

100+ parts

$9.100

1k+ parts

$8.140

10k+ parts

$7.660

1,594

-

$9.100

$8.140

$7.660

DigiKey

USA . 1,502 parts In-Stock

1+ parts

-

100+ parts

$10.510

1k+ parts

-

10k+ parts

-

1,502

-

$10.510

-

-

Verical

USA . 1,472 parts In-Stock

1+ parts

-

100+ parts

$11.375

1k+ parts

$10.175

10k+ parts

$9.575

1,472

-

$11.375

$10.175

$9.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 375 parts In-Stock

1+ parts

$9.604

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$9.604

-

-

-

Vyrian

USA . 872 parts In-Stock

1+ parts

$10.110

100+ parts

-

1k+ parts

-

10k+ parts

-

872

$10.110

-

-

-

DigiKey Marketplace

USA . 1,594 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,594

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,856 parts In-Stock

1+ parts

$9.099

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

$9.099

-

-

-

Component Stockers USA

USA . 1,991 parts In-Stock

1+ parts

$10.420

100+ parts

$9.800

1k+ parts

$8.860

10k+ parts

-

1,991

$10.420

$9.800

$8.860

-

Parana Technologies

USA . 2,322 parts In-Stock

1+ parts

$11.672

100+ parts

-

1k+ parts

$12.065

10k+ parts

-

2,322

$11.672

-

$12.065

-

DigiPath Technology Company

USA . 1,505 parts In-Stock

1+ parts

$12.853

100+ parts

-

1k+ parts

-

10k+ parts

-

1,505

$12.853

-

-

-

IDEA Electronic Components Group

UK . 2,198 parts In-Stock

1+ parts

$13.115

100+ parts

$12.459

1k+ parts

$11.804

10k+ parts

-

2,198

$13.115

$12.459

$11.804

-

ChromeModa Solutions

Germany . 389 parts In-Stock

1+ parts

$13.115

100+ parts

$10.754

1k+ parts

-

10k+ parts

-

389

$13.115

$10.754

-

-

Microchip USA

USA . 488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

488

-

-

-

-

Overview

Upgrade your telecom interface systems with the TLK1002RGE by Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. The TLK1002RGE offers exceptional value, providing customers with enhanced performance and efficiency. Say goodbye to connectivity issues and hello to seamless communication with this advanced IC. Trust Texas Instruments to elevate your telecom experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this product lightweight and durable, ideal for portable or mobile applications.

Surface Mount: YES

Being surface mountable, this product is easy to integrate onto printed circuit boards, saving space and enabling automated assembly processes.

Power Supplies (V): 1.8

The low power supply requirement of 1.8V makes this product energy efficient and suitable for battery-powered devices.

Package Style: CHIP CARRIER

The chip carrier package style offers a compact form factor and excellent thermal performance, making it suitable for applications where space is limited.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably operate in various environmental conditions without overheating.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high noise immunity, enhancing the overall performance and reliability of the product.

Technical Specifications

Other Function Telecom Interface ICs TLK1002RGE attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

158 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

20

Trade Compliance

TLK1002RGE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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