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TLK1002ARGET

Texas Instruments

TLK1002ARGET by Texas Instruments

TLK1002ARGET by Texas Instruments is a 24-terminal telecom IC with 1.8V supply voltage and data rate of 1300 Mbps. It features CMOS technology, operates b/w 0-70°C, and has a compact square package suitable for telecom circuit applications.

Median Price

$12.032

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,250 parts In-Stock

1+ parts

$12.450

100+ parts

$10.875

1k+ parts

$7.500

10k+ parts

-

6,250

$12.450

$10.875

$7.500

-

Rochester

USA . 23,735 parts In-Stock

1+ parts

-

100+ parts

$9.380

1k+ parts

$8.390

10k+ parts

$7.900

23,735

-

$9.380

$8.390

$7.900

DigiKey

USA . 23,735 parts In-Stock

1+ parts

-

100+ parts

$12.340

1k+ parts

-

10k+ parts

-

23,735

-

$12.340

-

-

Verical

USA . 16,250 parts In-Stock

1+ parts

-

100+ parts

$11.725

1k+ parts

$10.488

10k+ parts

$9.875

16,250

-

$11.725

$10.488

$9.875

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,433 parts In-Stock

1+ parts

$9.899

100+ parts

-

1k+ parts

-

10k+ parts

-

1,433

$9.899

-

-

-

Vyrian

USA . 3,772 parts In-Stock

1+ parts

$10.420

100+ parts

-

1k+ parts

-

10k+ parts

-

3,772

$10.420

-

-

-

Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 2,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,016

-

-

-

-

Cyclops Electronics Ltd

UK . 1,253 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,253

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 16,623 parts In-Stock

1+ parts

$8.860

100+ parts

$8.638

1k+ parts

$8.594

10k+ parts

-

16,623

$8.860

$8.638

$8.594

-

Corphita

USA . 412 parts In-Stock

1+ parts

$9.378

100+ parts

-

1k+ parts

-

10k+ parts

-

412

$9.378

-

-

-

Parana Technologies

USA . 448 parts In-Stock

1+ parts

$14.535

100+ parts

-

1k+ parts

$14.975

10k+ parts

-

448

$14.535

-

$14.975

-

ChromeModa Solutions

Germany . 3,166 parts In-Stock

1+ parts

$16.332

100+ parts

$13.392

1k+ parts

-

10k+ parts

-

3,166

$16.332

$13.392

-

-

IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$16.332

100+ parts

$15.515

1k+ parts

$14.699

10k+ parts

-

1,784

$16.332

$15.515

$14.699

-

A-Z Elektronik GmbH

Germany . 7,479 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,479

-

-

-

-

DigiPath Technology Company

USA . 1,439 parts In-Stock

1+ parts

-

100+ parts

$14.725

1k+ parts

-

10k+ parts

-

1,439

-

$14.725

-

-

Overview

Enhance your telecom interface systems with the TLK1002ARGET by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products like this one, designed for various applications in the telecom sector. With its advanced technology and high-speed data rate of 1300 Mbps, this IC offers exceptional performance and reliability. Experience seamless connectivity and superior functionality with the TLK1002ARGET, making it the perfect choice for your telecom interface needs. Upgrade your systems now and enjoy the benefits of this cutting-edge product!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making the product reliable for long-term use.

Surface Mount: YES

Surface mount capability allows for efficient and easy assembly onto circuit boards, saving time and effort during production.

Power Supplies (V): 1.8

Operating at a low voltage of 1.8V helps to minimize power consumption and heat generation, leading to energy efficiency.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperatures and maintain stable performance in various environments.

Technology: CMOS

The CMOS technology offers low power consumption, high speed, and integration capabilities, making this product suitable for telecom applications that require efficient processing.

Data Rate: 1300 Mbps

With a high data rate of 1300 Mbps, this product can handle large volumes of data quickly and efficiently, making it ideal for high-speed telecom operations.

Technical Specifications

Other Function Telecom Interface ICs TLK1002ARGET attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

1300 Mbps

JESD-30 Code:

S-PQCC-N24

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.158 mA

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

TLK1002ARGET Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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