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TLK1521PAP

Texas Instruments

TLK1521PAP by Texas Instruments

TLK1521PAP by Texas Instruments is a telecom IC with 64 terminals in a square package. Operating temp range -40 to 85°C, supply voltage 2.5V. Ideal for telecom circuits, it features GULL WING terminals and is surface mountable for industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,068 parts In-Stock

1+ parts

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8,068

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Digiode

USA . 1,847 parts In-Stock

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1,847

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 763 parts In-Stock

1+ parts

$9.441

100+ parts

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763

$9.441

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Parana Technologies

USA . 2,119 parts In-Stock

1+ parts

$13.702

100+ parts

$1,272.479

1k+ parts

$12.332

10k+ parts

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2,119

$13.702

$1,272.479

$12.332

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DigiPath Technology Company

USA . 1,588 parts In-Stock

1+ parts

$15.088

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1,588

$15.088

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ChromeModa Solutions

Germany . 6,084 parts In-Stock

1+ parts

$15.396

100+ parts

$12.625

1k+ parts

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6,084

$15.396

$12.625

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IDEA Electronic Components Group

UK . 2,018 parts In-Stock

1+ parts

$15.396

100+ parts

$14.626

1k+ parts

$13.856

10k+ parts

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2,018

$15.396

$14.626

$13.856

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One Stop Electronics

USA . 1,190 parts In-Stock

1+ parts

$576.000

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1,190

$576.000

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Corphita

USA . 488 parts In-Stock

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488

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Overview

Elevate your telecom interface IC needs with the TLK1521PAP by Texas Instruments. Known for their top-notch quality and innovation, Texas Instruments delivers yet again with this versatile product. Whether you're in need of reliable connectivity solutions for networking equipment or telecommunications devices, this IC is sure to exceed your expectations. Experience seamless performance and efficiency with the TLK1521PAP, designed to elevate your projects to the next level. Trust in Texas Instruments to provide you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and cost-effective, making the product suitable for applications requiring a reliable and affordable telecom interface IC.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, saving time and enabling high-density layouts.

Package Shape: SQUARE

The square shape helps optimize space on circuit boards, making it easier to integrate this telecom interface IC into compact electronic devices.

No. of Terminals: 64

With a high number of terminals, this product offers versatile connectivity options for various telecom applications, ensuring compatibility with different systems.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The multiple package styles provide flexibility in design and heat dissipation capabilities, allowing for efficient thermal management in telecom systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments, making this product suitable for a wide range of telecom applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can withstand extreme cold conditions, increasing its versatility and reliability in various environments.

Terminal Position: QUAD

The quad terminal position offers a stable and secure connection, enhancing the overall durability and performance of this telecom interface IC.

Maximum Seated Height: 1.2 mm

The low seated height allows for a compact design and efficient use of space on circuit boards, enabling sleek and streamlined electronic devices.

Width: 10 mm

The moderate width of the product facilitates easy integration into standard circuit board layouts, ensuring compatibility with existing telecom systems.

Length: 10 mm

The compact length of the product offers design flexibility and versatility in various electronic applications, making it a convenient choice for telecom interface ICs.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in harsh environmental conditions, making this product suitable for industrial-grade telecom applications.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable electrical connection, reducing the risk of signal loss or disruptions in telecom systems.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC type offers optimized performance and functionality for efficient communication systems, making it a reliable choice for telecom projects.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5 V ensures compatibility with standard power sources in telecom systems, providing stable operation and efficient power consumption.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for precise and secure connections, enhancing the overall reliability and performance of this telecom interface IC in various applications.

Technical Specifications

Other Function Telecom Interface ICs TLK1521PAP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

TLK1521PAP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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