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TLK1501AIRCPR

Texas Instruments

TLK1501AIRCPR by Texas Instruments

TLK1501AIRCPR by Texas Instruments is a 64-terminal telecom IC with a supply voltage of 2.5V. It operates b/w -40 to 85°C, featuring nickel palladium gold finish and gull wing terminals. Ideal for telecom circuits, it comes in a square package style with very thin profile and fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,676 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,676

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-

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Digiode

USA . 1,294 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,294

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 267 parts In-Stock

1+ parts

$8.454

100+ parts

-

1k+ parts

-

10k+ parts

-

267

$8.454

-

-

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Parana Technologies

USA . 212 parts In-Stock

1+ parts

$14.137

100+ parts

-

1k+ parts

$14.597

10k+ parts

-

212

$14.137

-

$14.597

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DigiPath Technology Company

USA . 164 parts In-Stock

1+ parts

$15.566

100+ parts

-

1k+ parts

-

10k+ parts

-

164

$15.566

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-

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ChromeModa Solutions

Germany . 4,064 parts In-Stock

1+ parts

$15.884

100+ parts

$13.025

1k+ parts

-

10k+ parts

-

4,064

$15.884

$13.025

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IDEA Electronic Components Group

UK . 1,266 parts In-Stock

1+ parts

$15.884

100+ parts

$15.090

1k+ parts

$14.296

10k+ parts

-

1,266

$15.884

$15.090

$14.296

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One Stop Electronics

USA . 579 parts In-Stock

1+ parts

$442.000

100+ parts

-

1k+ parts

-

10k+ parts

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579

$442.000

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-

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Corphita

USA . 3,543 parts In-Stock

1+ parts

-

100+ parts

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3,543

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Overview

Experience unparalleled quality and reliability with the TLK1501AIRCPR by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge telecom interface ICs that are essential for various applications. This product offers exceptional value, providing customers with seamless connectivity and optimal performance. Say goodbye to connectivity issues and hello to efficiency with the TLK1501AIRCPR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a lightweight and durable housing for the IC, making it suitable for various applications.

Surface Mount: YES

Enables easy and efficient installation on PCBs, saving time and effort during manufacturing.

No. of Terminals: 64

Offers a high number of connection points for added functionality and versatility.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-lasting connections.

Width: 10 mm

Compact size allows for space-efficient PCB design and integration.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial conditions, ensuring durability and reliability.

Nominal Supply Voltage: 2.5 V

Optimal supply voltage for efficient performance and power consumption.

Technical Specifications

Other Function Telecom Interface ICs TLK1501AIRCPR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1501AIRCPR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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