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TLK3138GDU

Texas Instruments

TLK3138GDU by Texas Instruments

TLK3138GDU by Texas Instruments is a telecom IC with 2 transceivers, operating at 3125 Mbps data rate. It has a package style of grid array, suitable for commercial temperature grade applications. The IC supports power supplies of 1.2V, 1.5V, and 2.5V in a square package shape with 484 terminals.

Median Price

$53.786

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,193 parts In-Stock

1+ parts

-

100+ parts

$47.810

1k+ parts

$42.780

10k+ parts

$40.260

1,193

-

$47.810

$42.780

$40.260

DigiKey

USA . 833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

833

-

-

-

-

Verical

USA . 491 parts In-Stock

1+ parts

-

100+ parts

$59.763

1k+ parts

$53.475

10k+ parts

$50.325

491

-

$59.763

$53.475

$50.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,304 parts In-Stock

1+ parts

$50.474

100+ parts

-

1k+ parts

-

10k+ parts

-

1,304

$50.474

-

-

-

DigiKey Marketplace

USA . 1,193 parts In-Stock

1+ parts

$55.260

100+ parts

-

1k+ parts

-

10k+ parts

-

1,193

$55.260

-

-

-

Vyrian

USA . 6,879 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,879

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,598 parts In-Stock

1+ parts

$6.491

100+ parts

$602.766

1k+ parts

$5.842

10k+ parts

-

1,598

$6.491

$602.766

$5.842

-

DigiPath Technology Company

USA . 1,606 parts In-Stock

1+ parts

$7.147

100+ parts

$6.575

1k+ parts

-

10k+ parts

-

1,606

$7.147

$6.575

-

-

ChromeModa Solutions

Germany . 5,899 parts In-Stock

1+ parts

$7.293

100+ parts

$5.980

1k+ parts

-

10k+ parts

-

5,899

$7.293

$5.980

-

-

IDEA Electronic Components Group

UK . 1,012 parts In-Stock

1+ parts

$7.293

100+ parts

-

1k+ parts

$6.564

10k+ parts

-

1,012

$7.293

-

$6.564

-

Corphita

USA . 2,105 parts In-Stock

1+ parts

$47.817

100+ parts

-

1k+ parts

-

10k+ parts

-

2,105

$47.817

-

-

-

Kepictronics

USA . 1,193 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,193

-

-

-

-

Microchip USA

USA . 408 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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408

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-

-

-

Overview

Elevate your telecom interface solutions with the TLK3138GDU by Texas Instruments. With a solid reputation for quality and innovation, Texas Instruments delivers cutting-edge technology that meets the demands of today's fast-paced world. This versatile product offers a wide range of applications in the telecom industry, providing customers with reliable performance and seamless connectivity. Experience the value and benefits of this top-of-the-line IC, designed to enhance your communication systems and streamline your operations. Choose Texas Instruments for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation in various devices.

No. of Functions: 2

Having 2 functions in one IC increases functionality and versatility in telecom interfaces.

Package Shape: SQUARE

Square package shape allows for easy and compact integration into electronic devices.

Power Supplies (V): 1.2,1.5,2.5

Support for multiple power supply voltages offers flexibility in design and compatibility with different systems.

No. of Terminals: 484

Having a high number of terminals allows for more connections and features in the IC.

Package Style (Meter): GRID ARRAY

Grid array package style provides efficient thermal management and space-saving design.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures stable performance even in harsh conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of environments.

Terminal Finish: TIN LEAD

Tin lead terminal finish offers good solderability and conductivity for reliable connections.

Terminal Position: BOTTOM

Bottom terminal position makes it easier to integrate the IC into circuit boards.

Peak Reflow Temperature °C: 220

High peak reflow temperature ensures proper soldering and reliability during assembly.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance for telecom applications.

Terminal Form: BALL

Ball terminal form offers reliable connections and good electrical properties.

No. of Transceivers: 2

Having 2 transceivers enhances communication capabilities and data transfer speeds in the IC.

Data Rate: 3125 Mbps

High data rate of 3125 Mbps ensures fast and efficient data transmission in telecommunications.

Moisture Sensitivity Level (MSL): 4

MSL level 4 indicates that the IC can withstand exposure to moisture during manufacturing and storage.

Technical Specifications

Other Function Telecom Interface ICs TLK3138GDU attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

3125 Mbps

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

4

No. of Functions:

2

No. of Terminals:

484

No. of Transceivers:

2

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA484,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.2,1.5,2.5

Qualification:

Not Qualified

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Trade Compliance

TLK3138GDU Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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