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TLK3101RCP

Texas Instruments

TLK3101RCP by Texas Instruments

TLK3101RCP by Texas Instruments is a telecom interface IC with 64 terminals, operating b/w -40°C to 85°C. It has a supply voltage of 2.5V and terminal pitch of 0.5mm, suitable for industrial applications requiring high-speed data transmission in a compact square package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,019 parts In-Stock

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Digiode

USA . 3,628 parts In-Stock

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3,628

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R&J Components

USA . 1 parts In-Stock

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Parana Technologies

USA . 2,231 parts In-Stock

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$11.974

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$12.381

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2,231

$11.974

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$12.381

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IDEA Electronic Components Group

UK . 2,104 parts In-Stock

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$13.454

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$12.781

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$12.109

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$13.454

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$12.109

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ChromeModa Solutions

Germany . 1,925 parts In-Stock

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$13.454

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$11.032

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$13.454

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AZTECH Wire

Italy . 716 parts In-Stock

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$18.438

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716

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One Stop Electronics

USA . 941 parts In-Stock

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$908.000

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941

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Corphita

USA . 3,952 parts In-Stock

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DigiPath Technology Company

USA . 1,552 parts In-Stock

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$12.130

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Overview

Elevate your telecom interface with the TLK3101RCP by Texas Instruments, a top-of-the-line solution designed for unparalleled performance and reliability. Crafted by industry leader Texas Instruments, this product boasts superior quality and precision engineering. Ideal for a wide range of applications in the telecom industry, this IC provides seamless connectivity and enhanced functionality. Experience the value and benefits of the TLK3101RCP, offering advanced features and unmatched advantages that will elevate your projects to new heights. Trust Texas Instruments for all your interface needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective, suitable for applications where weight and cost are important factors.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product onto circuit boards, increasing manufacturing productivity.

Package Shape: SQUARE

The square package shape provides efficient use of space on circuit boards, optimizing the layout for more compact and efficient designs.

Power Supplies (V): 2.5

Operating at a low power supply voltage of 2.5V can result in energy efficiency and reduced power consumption, making the product suitable for battery-powered devices.

No. of Terminals: 64

Having 64 terminals allows for a higher level of connectivity and functionality, making the product versatile and capable of handling complex telecom interface tasks.

Package Style (Meter): FLATPACK

The flatpack package style offers a low-profile design, enabling the product to be used in space-constrained applications or where height restrictions are a concern.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, the product can withstand high temperature environments, ensuring reliable performance in various operating conditions.

Minimum Operating Temperature: -40 °C

The product can operate effectively even in extremely low temperatures down to -40°C, making it suitable for use in cold environments or outdoor applications.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections, enabling efficient integration of the product into the overall system design.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature standards, the product can withstand harsh industrial environments, ensuring reliable operation in demanding conditions.

Terminal Form: GULL WING

The gull wing terminal form offers a sturdy and reliable connection to the circuit board, minimizing the risk of damage or disconnection during operation or assembly.

Nominal Supply Voltage: 2.5 V

Operating at a nominal supply voltage of 2.5V provides consistent and stable performance, making the product reliable and suitable for various telecom interface applications.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density packaging and precise connections, enhancing the overall functionality and performance of the product.

Technical Specifications

Other Function Telecom Interface ICs TLK3101RCP attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G64

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

2.5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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