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BALL Other Function Telecom Interface ICs 143

Other Function Telecom Interface ICs
Part# Info Specs
Part RoHS Manufacturer Description Additional Features Maximum Analog Input Companding Law Data Rate Filter Maximum Gain Tolerance Input Code Input Type JESD-30 Code JESD-609 Code Length Linear Coding Moisture Sensitivity Level (MSL) Nominal Negative Supply Voltage No. of Channels No. of Functions No. of Terminals No. of Transceivers Maximum Operating Temperature Minimum Operating Temperature Output (V) Output Code Package Body Material Package Code Package Equivalence Code Package Shape Package Style (Meter) Peak Reflow Temperature (C) Power Supplies (V) Qualification Resolution (um) Screening Level Maximum Seated Height Sub-Category Maximum Supply Current Nominal Supply Voltage Surface Mount Technology Telecom IC Type Temperature Grade Terminal Finish Terminal Form Terminal Pitch Terminal Position Maximum Time At Peak Reflow Temperature (s) Width
HPA01195YFPR by Texas Instruments

HPA01195YFPR

Texas Instruments

Texas Instruments HPA01195YFPR is a 28-terminal IC with a rectangular shape and very thin profile. Operating b/w 0-125°C, it has a peak reflow temperature of 260°C. Ideal for telecom circuits, it features a nominal voltage of 5V and tin/silver/copper terminal finish.

R-PBGA-B28

e1

3 mm

1

1

28

125 Cel

0 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.5 mm

5 V

YES

TELECOM CIRCUIT

OTHER

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

.4 mm

BOTTOM

30

1.88 mm

GC4016-PBZ by Texas Instruments

GC4016-PBZ

Texas Instruments

Texas Instruments GC4016-PBZ is a 160-terminal IC with CMOS technology, operating b/w -40 to 85°C. It features a 2.5V supply voltage, square package style, and ball terminal form. Ideal for telecom circuits, it has a peak reflow temp of 260°C and MSL level of 3 for industrial applications.

S-PBGA-B160

e1

15 mm

3

1

160

85 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

1.75 mm

2.5 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

1 mm

BOTTOM

30

15 mm

AD6652BBCZ by Analog Devices

AD6652BBCZ

Analog Devices

AD6652BBCZ by Analog Devices is a 256-terminal IC with CMOS technology. It operates b/w -40 to 70°C, suitable for telecom circuits with a 2.5V supply voltage requirement. The package is a square grid array measuring 17x17mm, designed for surface mount applications.

S-PBGA-B256

e1

17 mm

3

1

256

70 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

260

Not Qualified

2.5 V

YES

CMOS

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

17 mm

STA2500DCTR by STMicroelectronics

STA2500DCTR

STMicroelectronics

STA2500DCTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates at a nominal voltage of 2.75V, with a temperature range from -40 °C to 85 °C. This compact 48-terminal device features a square grid array package for efficient surface mounting.

S-PBGA-B48

6 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

NOT SPECIFIED

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

6 mm

STA2500DC by STMicroelectronics

STA2500DC

STMicroelectronics

STA2500DC by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates within -40 °C to 85 °C, features a compact 6mm x 6mm grid array package, and requires a nominal voltage of 2.75V. Ideal for reliable telecom solutions, it supports surface mount technology with 48 terminals.

S-PBGA-B48

6 mm

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

NOT SPECIFIED

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

6 mm

STA2500DTR by STMicroelectronics

STA2500DTR

STMicroelectronics

STA2500DTR by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and peak reflow temp of 260 °C. Ideal for reliable performance in demanding environments.

S-PBGA-B48

e1

6 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

260

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

6 mm

STA2500D by STMicroelectronics

STA2500D

STMicroelectronics

STA2500D by STMicroelectronics is a telecom interface IC designed for industrial applications, operating b/w -40 °C to 85 °C. It features a compact 48-terminal grid array with a nominal voltage of 2.75V and supports surface mount technology. Ideal for robust telecom systems, it ensures reliable performance in demanding environments.

S-PBGA-B48

e1

6 mm

3

1

48

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA48,7X7,32

SQUARE

GRID ARRAY

260

2.75

Not Qualified

1.25 mm

Other Telecom ICs

2.75 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

6 mm

ADRV9009BBCZ-REEL by Analog Devices

ADRV9009BBCZ-REEL

Analog Devices

ADRV9009BBCZ-REEL by Analog Devices is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-1REEL by Analog Devices

ADRV9008BBCZ-1REEL

Analog Devices

Analog Devices ADRV9008BBCZ-1REEL is a telecom IC with 196 terminals in a low profile grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1.3V. Ideal for telecom circuit applications requiring fine pitch and bottom terminal position.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

ADRV9008BBCZ-2REEL by Analog Devices

ADRV9008BBCZ-2REEL

Analog Devices

Analog Devices ADRV9008BBCZ-2REEL is a telecom IC with 196 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features low profile and fine pitch design for industrial applications.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.27 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

12 mm

VSC8484YJP by Microchip Technology

VSC8484YJP

Microchip Technology

VSC8484YJP by Microchip Technology is a telecom IC with 324 terminals in a square grid array package. It operates b/w -40°C to 105°C, suitable for industrial use. With a nominal voltage of 1.2V, it is designed for telecom circuit applications.

S-PBGA-B324

18.6 mm

1

324

105 Cel

-40 Cel

PLASTIC/EPOXY

BGA

SQUARE

GRID ARRAY

2.74 mm

1.2 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

1 mm

BOTTOM

18.6 mm

FIDO5100CBCZ by Analog Devices

FIDO5100CBCZ

Analog Devices

FIDO5100CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With a low profile of 1.24mm and CMOS technology, it has a nominal voltage of 1.2V for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5200CBCZ by Analog Devices

FIDO5200CBCZ

Analog Devices

FIDO5200CBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 105°C, suitable for industrial applications. With CMOS technology and a nominal voltage of 1.2V, it is ideal for telecom circuit integration.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5110BBCZ by Analog Devices

FIDO5110BBCZ

Analog Devices

FIDO5110BBCZ by Analog Devices is a Telecom Circuit IC with 144 terminals in a low profile, fine pitch grid array package. Operating temperature range from -40 to 85 °C makes it suitable for industrial applications. It operates at a nominal voltage of 1.2V and utilizes CMOS technology for efficient performance.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5110CBCZ by Analog Devices

FIDO5110CBCZ

Analog Devices

FIDO5110CBCZ by Analog Devices is a telecom IC with 144 terminals in a square grid array package. Operating temperature ranges from -40 to 105 °C, suitable for industrial use. It features CMOS technology, 1.2V supply voltage, and 0.8mm terminal pitch, ideal for telecom circuit applications.

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210BBCZ by Analog Devices

FIDO5210BBCZ

Analog Devices

FIDO5210BBCZ by Analog Devices is a telecom IC with 144 terminals in a low profile grid array package. It operates b/w -40 to 85 °C, suitable for industrial applications. With a nominal voltage of 1.2V and CMOS technology, it's ideal for telecom circuit interfaces.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

FIDO5210CBCZ by Analog Devices

FIDO5210CBCZ

Analog Devices

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: LFBGA; Package Shape: SQUARE;

S-PBGA-B144

10 mm

1

144

105 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

BGA144,12X12,32

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

NOT SPECIFIED

1.24 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9082BBPZ-4D2AC by Analog Devices

AD9082BBPZ-4D2AC

Analog Devices

AD9082BBPZ-4D2AC by Analog Devices is a telecom IC with 324 terminals in a grid array package. It operates b/w -40 to 85 °C, with a peak reflow temperature of 260°C. Ideal for telecom circuits, it has a nominal voltage of 1V and terminal pitch of 0.8mm.

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

S-PBGA-B324

15 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.72 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

15 mm

AD9082BBPZRL-4D2AC by Analog Devices

AD9082BBPZRL-4D2AC

Analog Devices

AD9082BBPZRL-4D2AC by Analog Devices is a telecom IC with 324 terminals, operating temperature range of -40 to 85 °C. It features a grid array package style, ball terminal form, and nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial applications requiring fine pitch surface mount technology.

IT CAN ALSO OPERATE WITH 1.8 AND 2 V

S-PBGA-B324

15 mm

3

1

324

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

BGA324,18X18,32

SQUARE

GRID ARRAY, FINE PITCH

260

1.72 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

15 mm

BGU8004X by NXP Semiconductors

BGU8004X

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

BGU8004Z by NXP Semiconductors

BGU8004Z

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 6; Package Code: VFBGA; Package Shape: RECTANGULAR;

R-PBGA-B6

.65 mm

1

1

6

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.32 mm

1.8 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.22 mm

BOTTOM

.44 mm

NRF51822-CEAA-R7 by Nordic Semiconductor Asa

NRF51822-CEAA-R7

Nordic Semiconductor Asa

NRF51822-CEAA-R7 by Nordic Semiconductor Asa is a Telecom IC with 62 terminals in a grid array package. Operating from -25 to 75°C, it has a nominal voltage of 1.8V. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design.

R-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.5 mm

NRF51822-CFAC-R by Nordic Semiconductor Asa

NRF51822-CFAC-R

Nordic Semiconductor Asa

NRF51822-CFAC-R by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile grid array packages.

S-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.83 mm

NRF51822-CEAA-R by Nordic Semiconductor Asa

NRF51822-CEAA-R

Nordic Semiconductor Asa

NRF51822-CEAA-R by Nordic Semiconductor Asa is a Telecom IC with 62 terminals in a grid array package. Operating from -25 to 75°C, it has a nominal voltage of 1.8V. Ideal for telecom circuits, this IC features a very thin profile and fine pitch design for compact applications.

R-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.5 mm

NRF51822-CFAC-R7 by Nordic Semiconductor Asa

NRF51822-CFAC-R7

Nordic Semiconductor Asa

NRF51822-CFAC-R7 by Nordic Semiconductor Asa is a telecom IC with 62 terminals in a square grid array package. It operates b/w -25°C to 75°C, with a supply voltage of 1.8V. Ideal for applications requiring fine pitch and thin profile components in the commercial extended temperature range.

S-PBGA-B62

3.83 mm

1

62

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

SQUARE

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

NOT SPECIFIED

3.83 mm

NRF51822-CDAB-R by Nordic Semiconductor Asa

NRF51822-CDAB-R

Nordic Semiconductor Asa

NRF51822-CDAB-R by Nordic Semiconductor Asa is a telecom IC with 56 terminals in a rectangular package. It operates b/w -25°C to 75°C, with a nominal voltage of 1.8V. The package style is grid array, very thin profile, fine pitch, making it suitable for various telecom circuit applications.

R-PBGA-B56

3.5 mm

1

1

56

75 Cel

-25 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.55 mm

1.8 V

YES

TELECOM CIRCUIT

COMMERCIAL EXTENDED

BALL

.4 mm

BOTTOM

3.33 mm

AD6679BBPZ-500 by Analog Devices

AD6679BBPZ-500

Analog Devices

AD6679BBPZ-500 by Analog Devices is a GRID ARRAY IC with 196 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 1.25V and terminal pitch of 0.8mm. Ideal for TELECOM CIRCUITS, it features TIN SILVER COPPER finish and is suitable for industrial temperature grades.

S-PBGA-B196

e1

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.49 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.8 mm

BOTTOM

30

12 mm

AD6679BBPZRL7-500 by Analog Devices

AD6679BBPZRL7-500

Analog Devices

AD6679BBPZRL7-500 by Analog Devices is a SQUARE GRID ARRAY IC with 196 terminals. It operates b/w -40 to 85 °C, suitable for TELECOM CIRCUITS. With a supply voltage of 1.25 V and terminal pitch of 0.8 mm, it's ideal for industrial applications requiring high performance telecom interface solutions.

S-PBGA-B196

12 mm

3

1

196

85 Cel

-40 Cel

PLASTIC/EPOXY

HBGA

SQUARE

GRID ARRAY, HEAT SINK/SLUG

260

1.49 mm

1.25 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

12 mm

GS2971-IBE3 by Semtech

GS2971-IBE3

Semtech

Semtech's GS2971-IBE3 is a telecom IC with 100 terminals in a square grid array package. Operating temp range -20 to 85°C, terminal pitch of 1mm, and nominal voltage of 1.2V make it ideal for telecom circuit applications. The low-profile design with tin silver copper finish and ball terminal form ensures reliable performance.

S-PBGA-B100

e1

11 mm

1

1

100

85 Cel

-20 Cel

PLASTIC/EPOXY

LBGA

SQUARE

GRID ARRAY, LOW PROFILE

260

1.7 mm

1.2 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

1 mm

BOTTOM

11 mm

PN5180A0ET/C1,151 by NXP Semiconductors

PN5180A0ET/C1,151

NXP Semiconductors

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 64; Package Code: TFBGA; Package Shape: SQUARE;

S-PBGA-B64

e1

5.5 mm

1

1

64

85 Cel

-30 Cel

PLASTIC/EPOXY

TFBGA

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

260

1.15 mm

1.8 V

YES

TELECOM CIRCUIT

OTHER

TIN SILVER COPPER

BALL

.65 mm

BOTTOM

30

5.5 mm

TCP-4112UB-DT by Onsemi

TCP-4112UB-DT

Onsemi

TCP-4112UB-DT by Onsemi is a Telecom IC with 4 terminals in a grid array package. It operates b/w -30 °C to 85°C, with terminal finish in nickel gold. With a very thin profile of 0.345mm, it is suitable for telecom circuit applications.

R-PBGA-B4

e4

.626 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

STHVDAC-256MTGF3 by STMicroelectronics

STHVDAC-256MTGF3

STMicroelectronics

STHVDAC-256MTGF3 by STMicroelectronics is a telecom interface IC designed for surface mount applications. It operates b/w -30 °C to 85 °C, with a nominal voltage of 3.3V and features a very thin profile in a 20-terminal grid array package. Ideal for compact telecom systems, it ensures efficient signal processing.

R-PBGA-B20

2.23 mm

1

20

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

NOT SPECIFIED

.64 mm

3.3 V

YES

TELECOM CIRCUIT

OTHER

BALL

.4 mm

BOTTOM

NOT SPECIFIED

1.94 mm

TCP-4182UB-DT by Onsemi

TCP-4182UB-DT

Onsemi

TCP-4182UB-DT by Onsemi is a telecom IC with 4 terminals, nickel gold finish, and very thin profile. It operates b/w -30 to 85 °C, suitable for telecom circuit applications requiring fine pitch grid array packaging.

R-PBGA-B4

e4

1.009 mm

1

1

4

85 Cel

-30 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.345 mm

YES

TELECOM CIRCUIT

OTHER

NICKEL GOLD

BALL

.42 mm

BOTTOM

.609 mm

AD9671KBCZ by Analog Devices

AD9671KBCZ

Analog Devices

AD9671KBCZ by Analog Devices is a 144-terminal GRID ARRAY IC with low profile and fine pitch. Operating b/w 0-85°C, it has a supply voltage of 1.4V and terminal pitch of 0.8mm. Ideal for telecom circuits, its package is made of PLASTIC/EPOXY and is surface mountable for various applications.

S-PBGA-B144

10 mm

3

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.4 V

YES

TELECOM CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

30

10 mm

AD9670BBCZ by Analog Devices

AD9670BBCZ

Analog Devices

AD9670BBCZ by Analog Devices is a 144-terminal telecom IC with a 1.4V supply voltage. It features a low profile grid array package, operates b/w 0-85°C, and has a peak reflow temperature of 260°C. Ideal for telecom circuit applications requiring fine pitch components in a compact form factor.

S-PBGA-B144

10 mm

3

1

144

85 Cel

0 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.4 mm

1.4 V

YES

TELECOM CIRCUIT

OTHER

BALL

.8 mm

BOTTOM

30

10 mm

STA8090FGBTR by STMicroelectronics

STA8090FGBTR

STMicroelectronics

STA8090FGBTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max temp of 85 °C and operates at a nominal voltage of 1.2V. Ideal for surface mount designs, it ensures reliable performance in demanding environments.

R-PBGA-B99

6 mm

1

99

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

5 mm

STA8090FGTR by STMicroelectronics

STA8090FGTR

STMicroelectronics

STA8090FGTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max operating temp of 85 °C and operates at a nominal voltage of 1.2V. Its thin profile and fine pitch make it ideal for space-constrained designs.

R-PBGA-B99

6 mm

1

99

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

5 mm

STA8090FG by STMicroelectronics

STA8090FG

STMicroelectronics

STA8090FG by STMicroelectronics is a telecom interface IC designed for industrial applications. It features a compact 99-terminal grid array with a max operating temp of 85 °C and operates at a nominal voltage of 1.2V. Its robust CMOS technology ensures reliable performance in demanding environments.

R-PBGA-B99

6 mm

1

99

85 Cel

-40 Cel

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

NOT SPECIFIED

1.2 mm

1.2 V

YES

CMOS

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

NOT SPECIFIED

5 mm

HMC6300BG46 by Analog Devices

HMC6300BG46

Analog Devices

Analog Devices' HMC6300BG46 is a 65-terminal IC with a package style of grid array, ideal for telecom circuits. It operates b/w -40 to 85°C, with a peak reflow temperature of 260°C. The very thin profile and fine pitch make it suitable for industrial applications requiring a nominal voltage of 2.7V.

R-PBGA-B65

6 mm

1

1

65

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.815 mm

2.7 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

30

4 mm

HMC6301BG46 by Analog Devices

HMC6301BG46

Analog Devices

HMC6301BG46 by Analog Devices is a 75-terminal IC with package style GRID ARRAY, used in TELECOM CIRCUIT applications. It operates b/w -40 to 85°C, with a peak reflow temp of 260°C. The IC has a nominal voltage of 1.35V and terminal pitch of 0.5mm.

R-PBGA-B75

6 mm

1

1

75

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.815 mm

1.35 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.5 mm

BOTTOM

30

4 mm

AD9363ABCZ-REEL by Analog Devices

AD9363ABCZ-REEL

Analog Devices

AD9363ABCZ-REEL by Analog Devices is a telecom IC with 144 terminals in a square grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it has a low profile and fine pitch design for surface mounting applications.

S-PBGA-B144

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

10 mm

AD9363ABCZ by Analog Devices

AD9363ABCZ

Analog Devices

AD9363ABCZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a supply voltage of 1.3V. Ideal for telecom circuits, it features a low profile design and ball terminal form.

S-PBGA-B144

10 mm

3

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

LFBGA

SQUARE

GRID ARRAY, LOW PROFILE, FINE PITCH

260

1.7 mm

1.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

30

10 mm

BCM43570KFFBG by Cypress Semiconductor

BCM43570KFFBG

Cypress Semiconductor

BCM43570KFFBG by Cypress Semiconductor is a 242-terminal IC with 867 Mbps data rate, operating at 0-60°C. Telecom circuit application with 3.3V supply voltage and 0.4mm terminal pitch for high-speed connectivity in commercial-grade environments.

Also has 1.2 V core supply

867 Mbps

S-PBGA-B242

10 mm

1

242

60 Cel

0 Cel

PLASTIC/EPOXY

TFBGA

BGA242,23X23,16

SQUARE

GRID ARRAY, THIN PROFILE, FINE PITCH

1.05 mm

3.3 V

YES

TELECOM CIRCUIT

COMMERCIAL

BALL

.4 mm

BOTTOM

10 mm

EFR32BG1B232F256GJ43-C0 by Silicon Labs

EFR32BG1B232F256GJ43-C0

Silicon Labs

EFR32BG1B232F256GJ43-C0 by Silicon Labs is a 43-terminal IC with telecom circuit type, operating at -40 to 85°C. It has a nominal voltage of 3.3V and uses ball terminal form. This industrial-grade IC in grid array package is ideal for telecom interface applications.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

EFR32BG1P332F256GJ43-C0 by Silicon Labs

EFR32BG1P332F256GJ43-C0

Silicon Labs

EFR32BG1P332F256GJ43-C0 by Silicon Labs is a Telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and tin silver copper finish. Ideal for telecom circuits, it has a very thin profile and fine pitch design for industrial applications.

R-PBGA-B43

e1

3.295 mm

1

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

260

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

TIN SILVER COPPER

BALL

.4 mm

BOTTOM

40

3.143 mm

EFR32BG1V132F256GJ43-C0 by Silicon Labs

EFR32BG1V132F256GJ43-C0

Silicon Labs

EFR32BG1V132F256GJ43-C0 by Silicon Labs is a telecom IC with 3.3V supply voltage, operating from -40 to 85°C. It features a grid array package style with 43 terminals and 0.4mm pitch, suitable for industrial applications requiring thin profile and fine pitch components.

R-PBGA-B43

3.295 mm

1

43

85 Cel

-40 Cel

PLASTIC/EPOXY

VFBGA

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

.54 mm

3.3 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.4 mm

BOTTOM

3.143 mm

AD9172BBPZRL by Analog Devices

AD9172BBPZRL

Analog Devices

AD9172BBPZRL by Analog Devices is a 144-terminal IC with package style GRID ARRAY, FINE PITCH. It operates b/w -40 to 85 °C and has a nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial temperature-grade applications.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

NOT SPECIFIED

1.71 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm

AD9172BBPZ by Analog Devices

AD9172BBPZ

Analog Devices

AD9172BBPZ by Analog Devices is a telecom IC with 144 terminals in a grid array package. It operates b/w -40 to 85°C, with a nominal voltage of 1V. This IC is ideal for telecom circuit applications due to its fine pitch and ball terminal form.

S-PBGA-B144

10 mm

1

144

85 Cel

-40 Cel

PLASTIC/EPOXY

FBGA

SQUARE

GRID ARRAY, FINE PITCH

NOT SPECIFIED

1.71 mm

1 V

YES

TELECOM CIRCUIT

INDUSTRIAL

BALL

.8 mm

BOTTOM

NOT SPECIFIED

10 mm