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AD9172BBPZRL

Analog Devices

AD9172BBPZRL by Analog Devices

AD9172BBPZRL by Analog Devices is a 144-terminal IC with package style GRID ARRAY, FINE PITCH. It operates b/w -40 to 85 °C and has a nominal voltage of 1V. Ideal for telecom circuits, this IC is designed for industrial temperature-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,822 parts In-Stock

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Digiode

USA . 414 parts In-Stock

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414

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Distributors (Availability)

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Native Components

USA . 24 parts In-Stock

1+ parts

$0.278

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-

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$0.267

24

$0.278

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$0.267

Northwest PG Solutions

USA . 1,899 parts In-Stock

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$0.306

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$0.270

1,899

$0.306

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$0.270

Parana Technologies

USA . 938 parts In-Stock

1+ parts

$8.147

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$7.577

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938

$8.147

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$7.577

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IDEA Electronic Components Group

UK . 2,130 parts In-Stock

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$8.760

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$8.322

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2,130

$8.760

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AZTECH Wire

Italy . 348 parts In-Stock

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$11.510

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348

$11.510

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DigiPath Technology Company

USA . 1,529 parts In-Stock

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$13.666

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$13.119

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$13.119

1,529

$13.666

$13.119

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$13.119

Vigor

Singapore . 6,495 parts In-Stock

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$368.460

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6,495

$368.460

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Semicontronic

India . 511 parts In-Stock

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$645.000

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$628.875

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$625.650

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511

$645.000

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$625.650

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One Stop Electronics

USA . 1,207 parts In-Stock

1+ parts

$881.000

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$881.000

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Corphita

USA . 502 parts In-Stock

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Overview

Elevate your telecom interface designs with the high-quality AD9172BBPZRL from Analog Devices. This innovative product offers unparalleled performance and reliability, backed by the reputable manufacturer's expertise in the industry. Ideal for a wide range of applications in the telecommunications sector, this IC provides exceptional value and benefits to customers seeking seamless connectivity solutions. Experience the advantages of superior design, efficiency, and functionality with the AD9172BBPZRL, setting a new standard in telecom interface technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, ensuring a longer lifespan and reliable performance.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into various electronic devices.

Package Shape: SQUARE

Square shape helps with efficient space utilization on circuit boards and enables a compact design.

No. of Terminals: 144

High number of terminals allow for a wide range of connectivity options and functionality.

Package Style: GRID ARRAY, FINE PITCH

Grid array with fine pitch design enables high component density and improved signal integrity.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of temperatures, making it suitable for various applications.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection to the circuit board.

Maximum Seated Height: 1.71 mm

Low seated height contributes to a slim profile and space-saving design.

Width: 10 mm

Compact width enables integration into smaller electronic devices and circuit boards.

Length: 10 mm

Compact length helps with space optimization on the circuit board.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments.

Terminal Form: BALL

Ball terminal form allows for reliable electrical connections and ease of soldering.

Nominal Supply Voltage: 1 V

Nominal supply voltage of 1V is suitable for efficient power consumption and operation.

Terminal Pitch: 0.8 mm

Fine terminal pitch of 0.8mm enables high component density and miniaturization.

Technical Specifications

Other Function Telecom Interface ICs AD9172BBPZRL attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-PBGA-B144

Length:

10 mm

No. of Functions:

1

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.71 mm

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

AD9172BBPZRL Telecommunications trade compliance attributes, and parameters.

ECCN

3A001.A.5.B.2.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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