Loading...

STA2500DCTR

STMicroelectronics

STA2500DCTR by STMicroelectronics

STA2500DCTR by STMicroelectronics is a telecom interface IC designed for industrial applications. It operates at a nominal voltage of 2.75V, with a temperature range from -40 °C to 85 °C. This compact 48-terminal device features a square grid array package for efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 11,473 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,473

-

-

-

-

Digiode

USA . 3,194 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,194

-

-

-

-

Anansix

USA . 2,304 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,304

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,047 parts In-Stock

1+ parts

$7.741

100+ parts

-

1k+ parts

$6.967

10k+ parts

-

1,047

$7.741

-

$6.967

-

AZTECH Wire

Italy . 346 parts In-Stock

1+ parts

$13.020

100+ parts

-

1k+ parts

-

10k+ parts

-

346

$13.020

-

-

-

MKK Technologies

India . 1,176 parts In-Stock

1+ parts

$14.556

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$14.556

-

-

-

DigiPath Technology Company

USA . 1,176 parts In-Stock

1+ parts

$14.556

100+ parts

-

1k+ parts

-

10k+ parts

-

1,176

$14.556

-

-

-

Ampacity Inc.

Singapore . 1,435 parts In-Stock

1+ parts

$939.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,435

$939.000

-

-

-

Corphita

USA . 4,991 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,991

-

-

-

-

Parana Technologies

USA . 998 parts In-Stock

1+ parts

-

100+ parts

$9.255

1k+ parts

-

10k+ parts

-

998

-

$9.255

-

-

Overview

Unlock seamless connectivity with the STA2500DCTR from STMicroelectronics, a trusted leader in innovation. This advanced telecom interface IC ensures robust performance across diverse industrial applications while thriving in extreme temperatures. Designed for reliability and efficiency, it enhances your projects with superior quality, ensuring long-lasting results. Experience unmatched value that elevates your designs, driving success and satisfaction in every deployment!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material contributes to the durability and reliability of the Telecom Interface IC, making it suitable for various applications.

Surface Mount: YES

Surface mount capability enhances the compactness and ease of integration into various circuit designs, making it ideal for modern electronic devices.

Package Shape: SQUARE

The square package shape aids in efficient space utilization on PCBs, allowing for higher density designs.

Power Supplies (V): 2.75

A nominal supply voltage of 2.75V ensures compatibility with a wide range of low-power applications, minimizing energy consumption.

No. of Terminals: 48

With 48 terminals, this IC can support complex functionalities and multiple connections, making it versatile for various telecom applications.

Package Style (Meter): GRID ARRAY

The grid array package style facilitates effective heat dissipation and strong electrical connections, enhancing performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable operation in demanding environments, particularly useful for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C makes this IC well-suited for use in extreme conditions, ensuring functionality in rugged applications.

Terminal Position: BOTTOM

Bottom terminal position allows for easy soldering and efficient use of PCB real estate, enhancing design flexibility.

Maximum Seated Height: 1.25 mm

A low maximum seated height of 1.25 mm contributes to a slim profile, enabling installation in space-constrained designs.

Width: 6 mm

The compact width of 6 mm facilitates efficient PCB layout and design, enabling higher density circuits.

Length: 6 mm

A length of 6 mm complements the width, ensuring a balanced square form factor for more straightforward assembly and integration.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grade, this IC is reliable for long-term operation in harsh environments without failure.

Terminal Form: BALL

The ball terminal form ensures strong and reliable connections, improving overall IC performance and signal integrity.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom applications, this IC is optimized for communication functions, enhancing performance in networking tasks.

Nominal Supply Voltage: 2.75 V

Operating at a nominal supply voltage of 2.75V ensures excellent power efficiency, making it ideal for battery-operated devices.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for a denser arrangement of connections on the PCB, contributing to miniaturization of devices.

Technical Specifications

Other Function Telecom Interface ICs STA2500DCTR attributes and parameters. Explore more Other Function Telecom Interface ICs devices from STMicroelectronics

Specs

JESD-30 Code:

S-PBGA-B48

Length:

6 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA48,7X7,32

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2.75

Qualification:

Not Qualified

Maximum Seated Height:

1.25 mm

Sub-Category:

Other Telecom ICs

Nominal Supply Voltage:

2.75 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

6 mm

Trade Compliance

STA2500DCTR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 11